# US 10,312,214 B2 · Atomization mechanism for cooling a bond head

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- Number: US 10,312,214 B2
- Document ID: US10312214B2
- Status: Granted
- Kind: B2
- Application number: 15/259,789
- Filed: 2016-09-08
- Published: 2018-03-08
- Granted: 2019-06-04
- Earliest claimed: 2016-09-08
- Assignees: Asm Technology Singapore Pte Ltd
- Applicants: ASM Technology Singapore Pte. Ltd.
- Inventors: Yi Kei Law; Chuek Wah Tang; Pak Kin Leung; Gary Peter Widdowson; Wing Chiu Lai; Kin Fung Yu; Jiang Wen Deng
- Web page: https://patentgrep.com/patent/US10312214B2

## CPC

- B05B 12/087: {Flow or presssure regulators, i.e. non-electric unitary devices comprising a sensing element, e.g. a piston or a membrane, and a controlling element, e.g. a valve}
- B05B 7/0416: {with arrangements for mixing one gas and one liquid}
- B23K 1/0016: {Soldering of electronic components}
- B23K 1/20: Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K 3/04: Heating appliances
- B23K 3/085: {Cooling, heat sink or heat shielding means}
- B23K 2101/42: Printed circuits
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07152: {Means for cooling}
- H10W 72/07183: {Means for monitoring}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES (spray-mixers with nozzles B01F25/72; processes for applying liquids or other fluent materials to surfaces by spraying B05D)
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

## Claims

### Claim 1

An atomization mechanism for cooling a bond head, the atomization mechanism comprising:
an atomization module configured to receive gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray;
wherein the atomization module comprises:
a mixing tube comprising a liquid inlet and a first gas inlet to provide liquid and gas for forming a liquid and gas mixture; and
a conveying tube joined to the mixing tube and comprising a second gas inlet to provide gas for converting the liquid and gas mixture into the atomized spray; and
a conduit configured to convey the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head.

### Claim 2 (depends on 1)

The atomization mechanism according to claim 1, further comprising a liquid pressure regulator operative to adjust a pressure of the liquid supply to the atomization module.

### Claim 3 (depends on 1)

The atomization mechanism according to claim 1, further comprising a gas pressure regulator operative to adjust a pressure of the gas supply to the atomization module.

### Claim 4 (depends on 1)

The atomization mechanism according to claim 1, further comprising a gas measuring unit operative to measure one or both of a pressure and a flow rate of the gas supply to the atomization module.

### Claim 5 (depends on 1)

The atomization mechanism according to claim 1, further comprising valves which are configured to be selectively activated to control a flow of the gas supply and a flow of the liquid supply into the atomization module.

### Claim 6

A bonding apparatus comprising:
a bond head comprising:
a holding element configured to hold an electronic device;
a heater configured to heat the holding element; and
a spray inlet located at the bond head and configured to receive an atomized spray into the bond head to cool the heater; and
an atomization mechanism comprising:
an atomization module configured to receive gas and liquid from a gas supply and a liquid supply respectively to form the atomized spray; and
a conduit configured to convey the atomized spray from the atomization module to the spray inlet located at the bond head.

### Claim 7 (depends on 6)

The bonding apparatus according to claim 6, further comprising a plurality of leakage sensors arranged to detect leakage of the liquid from one or both of the atomization mechanism and the bond head.

### Claim 8 (depends on 6)

The bonding apparatus according to claim 6, further comprising a plurality of humidity sensors arranged to determine a relative humidity around the bond head.

### Claim 9 (depends on 6)

The bonding apparatus according to claim 6, further comprising a separating mechanism configured to receive the atomized spray from the bond head, the separating mechanism being operative to separate the atomized spray into liquid and gas respectively.

### Claim 10 (depends on 9)

The bonding apparatus according to claim 9, wherein the separating mechanism comprises a hollow body configured to cause the atomized spray to form a rotating spray flow.

### Claim 11 (depends on 10)

The bonding apparatus according to claim 10, wherein the rotating spray flow rotates in a helical pattern.

### Claim 12 (depends on 9)

The bonding apparatus according to claim 9, wherein the separating mechanism comprises a hollow body having a cylindrical portion coupled with a frusto-conical portion.

### Claim 13 (depends on 6)

The bonding apparatus according to claim 6, wherein the bond head further comprises a cooling channel through which the spray inlet is conveyed, the cooling channel being connected to the spray inlet and having a cooling portion in contact with the heater along a surface of the heater.

### Claim 14 (depends on 13)

The bonding apparatus according to claim 13, wherein the cooling channel further comprises an inclined inlet configured to direct the atomized spray into the cooling portion, the inclined inlet being inclined at an angle of between 30 to 60 degrees with respect to the cooling portion.

### Claim 15 (depends on 13)

The bonding apparatus according to claim 13, wherein the cooling channel further comprises an inclined outlet configured to direct the atomized spray exiting the cooling portion, the inclined outlet being inclined at an angle of between 30 to 60 degrees with respect to the cooling portion.

### Claim 16 (depends on 6)

The bonding apparatus according to claim 6, further comprising a heater control mechanism operative to control the atomization mechanism and a power supply to the heater based on a temperature of the heater.

### Claim 17 (depends on 16)

The bonding apparatus according to claim 16, wherein the heater control mechanism is operative to initiate the formation of the atomized spray in the atomization module upon detecting a need to cool the heater.

### Claim 18 (depends on 16)

The bonding apparatus according to claim 16, wherein the heater control mechanism is operative to adjust the power supply to change a heating rate of the heater based on the temperature of the heater.