# US 10,312,198 B2 · Semiconductor device package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,198 B2 - Document ID: US10312198B2 - Status: Granted - Kind: B2 - Application number: 15/789,858 - Filed: 2017-10-20 - Published: 2019-04-25 - Granted: 2019-06-04 - Earliest claimed: 2017-10-20 - Assignees: Advanced Semiconductor Engineering, Inc. - Applicants: Advanced Semiconductor Engineering, Inc. - Inventors: Shao-Lun Yang; Yu-Shun Hsieh; Chia Yi Cheng; Hong Jie Chen; Shih Yu Huang - Web page: https://patentgrep.com/patent/US10312198B2 ## CPC - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)} - H10W 70/435: {of insulating layers on leadframes, e.g. bridging members} - H10W 70/465: {Bumps or wires} - H10W 70/421: {Shapes or dispositions} - H10W 70/457: {of metallic layers on leadframes} - H10W 74/10: characterised by their shape or disposition - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor device package includes a lead frame, an electronic component, a package body, at least one conductive via and a conductive layer. The lead frame includes a paddle, a connection element and a plurality of leads. The electronic component is disposed on the paddle. The package body encapsulates the electronic component and the lead frame. The at least one conductive via is disposed in the package body, electrically connected to the connection element, and exposed from the package body. The conductive layer is disposed on the package body and the conductive via. ## Claims ### Claim 1 A semiconductor device package, comprising: a lead frame comprising a paddle, a connection element and a plurality of leads; an electronic component disposed on the paddle; a package body encapsulating the electronic component and the lead frame, wherein the package body includes a lower surface exposing the paddle and an upper surface opposite to the lower surface; at least one conductive via disposed in the package body, electrically connected to the connection element, and exposed from the upper surface of the package body; and a conductive layer disposed on the upper surface of the package body and the conductive via. ### Claim 2 (depends on 1) The semiconductor device package of claim 1, wherein the at least one conductive via extends from the upper surface to the lower surface and is in contact with the connection element. ### Claim 3 (depends on 2) The semiconductor device package of claim 2, further comprising a conductive wall extending from the upper surface in to the package body, the conductive wall surrounding the electronic component and electrically connected to the at least one conductive via through the conductive layer. ### Claim 4 (depends on 3) The semiconductor device package of claim 3, wherein the package body is disposed between and separates the conductive wall and the leads. ### Claim 5 (depends on 3) The semiconductor device package of claim 3, wherein the at least one conductive via is disposed between the conductive wall and the electronic component. ### Claim 6 (depends on 2) The semiconductor device package of claim 2, wherein the at least one conductive via substantially covers a width of a portion of the connection element. ### Claim 7 (depends on 1) The semiconductor device package of claim 1, wherein at least one of the leads defines a step structure adjacent to a lateral surface of the package body. ### Claim 8 (depends on 7) The semiconductor device package of claim 7, wherein the step structure is defined by a lower surface of the at least one of the leads. ### Claim 9 (depends on 1) The semiconductor device package of claim 1, further comprising at least one wire element connected to the connection element and encapsulated by the package body, wherein the at least one conductive via is electrically connected to the connection element through the at least one wire element. ### Claim 10 (depends on 9) The semiconductor device package of claim 9, wherein the package body is disposed between and separates the at least one conductive via and the connection element. ### Claim 11 (depends on 1) The semiconductor device package of claim 1, wherein the connection element comprises a tie bar. ### Claim 12 (depends on 1) The semiconductor device package of claim 1, wherein the connection element comprises a grounded lead. ### Claim 13 A semiconductor device package, comprising: a lead frame comprising a paddle, a tie bar and a plurality of leads, the tie bar comprising a first portion adjacent to and connected to the paddle and a second portion, the first portion disposed between the paddle and the second portion; an electronic component disposed on the paddle; a package body encapsulating the electronic component and the lead frame, the package body having an upper surface and a lower surface opposite to the upper surface, wherein the lower surface exposes the paddle and the tie bar; a grounding element extending from the upper surface of the package body to the first portion of the tie bar; and a conductive layer disposed on the upper surface of the package body and electrically connected to the grounding element. ### Claim 14 (depends on 13) The semiconductor device package of claim 13, further comprising a conductive wall extending from the upper surface in to the package body, wherein the conductive wall surrounds the electronic component and electrically connects to the grounding element through the conductive layer. ### Claim 15 (depends on 14) The semiconductor device package of claim 14, wherein the package body is disposed between and separates the conductive wall and the leads. ### Claim 16 (depends on 13) The semiconductor device package of claim 13, wherein the grounding element substantially covers a width of a portion of the tie bar. ### Claim 17 (depends on 13) The semiconductor device package of claim 13, wherein at least one of the leads defines a step structure adjacent to a lateral surface of the package body. ### Claim 18 (depends on 17) The semiconductor device package of claim 17, wherein the step structure is defined by a lower surface of the at least one of the leads. ### Claim 19 (depends on 13) The semiconductor device package of claim 13, wherein the grounding element includes a conductive via and a wire element, a portion of the conductive via is exposed from the upper surface of the package body, and the conductive via electrically connects to the tie bar by the wire element. ### Claim 20 (depends on 19) The semiconductor device package of claim 19, wherein the package body separates the conductive via from the tie bar. ### Claim 21 A semiconductor device package, comprising: a lead frame comprising a paddle and a connection element; an electronic component disposed on the paddle; a package body encapsulating the electronic component and the lead frame, wherein the package body includes a lower surface exposing the paddle and the connection element and an upper surface opposite to the lower surface; a grounding element disposed in the package body and having a curved sidewall, the grounding element electrically connected to the connection element and exposed from the upper surface; and a conductive layer disposed on the upper surface of the package body and electrically connected to the grounding element. ### Claim 22 (depends on 21) The semiconductor device package of claim 21, wherein the connection element comprises a tie bar. ### Claim 23 (depends on 21) The semiconductor device package of claim 21, wherein the connection element comprises a grounded lead. ### Claim 24 (depends on 21) The semiconductor device package of claim 21, wherein the grounding element comprises a conductive via and an arcuate wire element, a portion of the conductive via is exposed from the upper surface of the package body, and the conductive via is electrically connected to the connection element by the arcuate wire element. ### Claim 25 (depends on 21) The semiconductor device package of claim 21, further comprising a conductive wall extending from the upper surface of the package body in to the package body, the conductive wall surrounding the electronic component and electrically connecting to the grounding element through the conductive layer. ### Claim 26 (depends on 25) The semiconductor device package of claim 25, wherein the package body is disposed between and separates the conductive wall and the connection element.