# US 10,312,193 B2 · Package comprising switches and filters

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,312,193 B2
- Document ID: US10312193B2
- Status: Granted
- Kind: B2
- Application number: 15/235,790
- Filed: 2016-08-12
- Published: 2018-02-15
- Granted: 2019-06-04
- Earliest claimed: 2016-08-12
- Assignees: QUALCOMM Incorporated
- Applicants: QUALCOMM Incorporated
- Inventors: Shiqun Gu; Chengjie Zuo; Steve Fanelli; Husnu Ahmet Masaracioglu
- Web page: https://patentgrep.com/patent/US10312193B2

## CPC

- H10W 70/65: Shapes or dispositions of interconnections
- H03H 1/0007: {of radio frequency interference filters}
- H10W 20/01: {Manufacture or treatment}
- H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/095: {of vias therein}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/635: {Through-vias}
- H10W 70/685: comprising multiple insulating layers
- H10W 72/0198: {batch processes}
- H10W 74/01: Manufacture or treatment
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 90/00: Package configurations
- H03H 2001/0021: {Constructional details}
- H10W 44/241: {for passive devices or passive elements}
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 72/073: {of die-attach connectors}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/874: {On different surfaces}
- H10W 72/9413: {on encapsulations}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 90/10: Configurations of laterally-adjacent chips
- H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)

## Abstract

A package includes a redistribution portion, a first portion, and a second portion. The first portion is coupled to the redistribution portion. The first portion includes a first switch comprising a plurality of switch interconnects, and a first encapsulation layer that at least partially encapsulates the first switch. The second portion is coupled to the first portion. The second portion includes a first plurality of filters. Each filter includes a plurality of filter interconnects. The second portion also includes a second encapsulation layer that at least partially encapsulates the first plurality of filters. The first portion includes a second switch positioned next to the first switch, where the first encapsulation layer at least partially encapsulates the second switch. The second portion includes a second plurality of filters positioned next to the first plurality of filters, where the secod encapsulation layer at least partially encapsulates the second plurality of filters.

## Claims

### Claim 1

A package comprising:
a redistribution portion including:
at least one dielectric layer; and
at least one redistribution interconnect, wherein the at least one redistribution interconnect is configured to provide impedance matching between a first switch die and at least one first filter die from a plurality of first filter dies;
a first portion coupled to the redistribution portion, the first portion including:
the first switch die comprising a plurality of switch interconnects, wherein the first switch die is configured to operate as a switch; and
a first encapsulation layer at least partially encapsulating the first switch die, wherein the first encapsulation layer touches the at least one dielectric layer of the redistribution portion; and
a second portion coupled to the first portion, the second portion including:
the plurality of first filter dies, each first filter die comprising a plurality of first filter interconnects, wherein each first filter die is configured to operate as a filter;
a second encapsulation layer at least partially encapsulating the plurality of first filter dies; and
a passivation layer coupled to the second encapsulation layer, the first encapsulation layer, and the first switch die, wherein the passivation layer is located between the first encapsulation layer and the second encapsulation layer.

### Claim 2 (depends on 1)

The package of claim 1, wherein the first portion further comprises a second switch die positioned next to the first switch die, wherein the first encapsulation layer at least partially encapsulates the second switch die.

### Claim 3 (depends on 1)

The package of claim 1, wherein the second portion further comprises a plurality of second filter dies positioned next to the plurality of first filter dies, wherein the second encapsulation layer at least partially encapsulates the plurality of second filter dies.

### Claim 4 (depends on 1)

The package of claim 1, wherein two neighboring filter dies from the plurality of first filter dies have a spacing of about 100 microns (μm) or less.

### Claim 5 (depends on 1)

The package of claim 1, wherein the second portion further comprises a through encapsulation interconnect that travels through the second portion, the through encapsulation interconnect is configured to provide an electrical path between the plurality of first filter dies and the redistribution portion.

### Claim 6 (depends on 5)

The package of claim 5, wherein the plurality of first filter dies and the first switch die are electrically coupled to each other through at least one electrical path that includes the plurality of first switch interconnects, the redistribution portion, the through encapsulation interconnect and the plurality of first filter interconnects.

### Claim 7 (depends on 1)

The package of claim 1, wherein the first switch die is located between the redistribution portion and the plurality of first filter dies.

### Claim 8 (depends on 1)

The package of claim 1, wherein the package is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.

### Claim 9

An apparatus comprising:
a redistribution portion including:
at least one dielectric layer; and
at least one redistribution interconnect, wherein the at least one redistribution interconnect is configured to provide impedance matching between a first switching means and at least one first filtering means from a plurality of first filtering means;
a first portion coupled to the redistribution portion, the first portion including:
the first switching means comprising a plurality of switch interconnects, wherein the first switching means is configured to operate as a switch; and
a first encapsulation layer at least partially encapsulating the first switching means, wherein the first encapsulation layer touches the at least one dielectric layer of the redistribution portion; and
a second portion coupled to the first portion, the second portion including:
the plurality of first filtering means, each first filtering means comprising a plurality of filter interconnects, wherein each first filtering means is configured to operate as a filter;
a second encapsulation layer at least partially encapsulating the plurality of first filtering means; and
a passivation layer coupled to the second encapsulation layer, the first encapsulation layer, and the first switching means, wherein the passivation layer is located between the first encapsulation layer and the second encapsulation layer.

### Claim 10 (depends on 9)

The apparatus of claim 9, wherein the first portion further comprises a second switching means positioned next to the first switching means, the second switching means configured to operate as a switch, wherein the first encapsulation layer at least partially encapsulates the second switching means.

### Claim 11 (depends on 9)

The apparatus of claim 9, wherein the second portion further comprises a plurality of second filtering means positioned next to the plurality of first filtering means, each second filtering means configured to operate as a filter, wherein the second encapsulation layer at least partially encapsulates the plurality of second filtering means.

### Claim 12 (depends on 9)

The apparatus of claim 9, wherein two neighboring filtering means from the plurality of first filtering means have a spacing of about 100 microns (μm) or less.

### Claim 13 (depends on 9)

The apparatus of claim 9, wherein the second portion further comprises a through encapsulation interconnect that travels through the second portion, the through encapsulation interconnect configured to provide an electrical path between the plurality of first filtering means and the redistribution portion.

### Claim 14 (depends on 9)

The apparatus of claim 9, wherein the apparatus is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.

### Claim 15

A method for fabricating a package, comprising:
forming a second portion that includes:
providing a plurality of first filter dies, each first filter die including a plurality of filter interconnects, wherein each filter die is configured to operate as a filter;
forming a second encapsulation layer that at least partially encapsulates the plurality of first filter, and
forming a passivation layer over the second encapsulation layer;
forming a first portion over the second portion, wherein forming the first portion includes:
providing a first switch die over the passivation layer, the first switch including a plurality of switch interconnects, wherein the first switch is configured to operate as a switch; and
forming a first encapsulation layer that at least partially encapsulates the first switch die; and
forming a redistribution portion over the first portion, wherein forming the redistribution portion includes:
forming at least one dielectric layer over the first encapsulation layer; and
forming at least one redistribution interconnect, wherein the at least one redistribution interconnect is configured to provide impedance matching between the first switch die and at least one first filter die from the plurality of first filter dies.

### Claim 16 (depends on 15)

The method of claim 15, wherein the forming first portion further comprises providing a second switch die next to the first switch die, wherein the first encapsulation layer at least partially encapsulates the second switch die.

### Claim 17 (depends on 15)

The method of claim 15, wherein forming the second portion further comprises providing a plurality of second filter dies next to the plurality of first filter dies, wherein the second encapsulation layer at least partially encapsulates the plurality of second filter dies.

### Claim 18 (depends on 15)

The method of claim 15, wherein forming the second portion further comprises a providing a through encapsulation interconnect that travels through the second portion, the through encapsulation interconnect configured to provide an electrical path between the plurality of first filter dies and the redistribution portion.

### Claim 19 (depends on 1)

The package of claim 1, further comprising:
an adhesive layer located over the second encapsulation layer and the plurality of first filter dies; and
a plurality of interconnects located in the passivation layer, wherein the plurality of interconnects is located between the plurality of first filter dies and the first switch die.

### Claim 20 (depends on 19)

The package of claim 19,
wherein the adhesive layer and the second portion form a back side of the package, and
the redistribution portion forms a front side of the package.