# US 10,312,183 B2 · Die package component with jumper structure

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- Number: US 10,312,183 B2
- Document ID: US10312183B2
- Status: Granted
- Kind: B2
- Application number: 15/644,202
- Filed: 2017-07-07
- Published: 2018-11-15
- Granted: 2019-06-04
- Earliest claimed: 2017-05-09
- Assignees: Taiwan Semiconductor Co., Ltd.
- Applicants: Taiwan Semiconductor Co., Ltd.
- Inventors: Reyn Qin; Lucy Fan; Meifang Song; Xiaoli Wang
- Web page: https://patentgrep.com/patent/US10312183B2

## CPC

- H10W 70/464: {Additional interconnections in combination with leadframes}
- H10W 70/041: {Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps}
- H10W 70/048: {Mechanical treatments, e.g. punching, cutting, deforming or cold welding}
- H10W 70/417: {Bonding materials between chips and die pads}
- H10W 70/421: {Shapes or dispositions}
- H10W 70/442: {of multiple leadframes in a single chip}
- H10W 70/466: {Tape carriers or flat leads}
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 70/68: Shapes or dispositions thereof
- H10W 74/014: {using batch processing}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10W 70/427: {Bent parts}
- H10W 72/0198: {batch processes}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07353: {changes in shapes}
- H10W 72/07354: {changes in dispositions}
- H10W 72/076: {of strap connectors}
- H10W 72/334: {Cross-sectional shape, i.e. in side view}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/631: {Shapes of strap connectors}
- H10W 72/634: {Cross-sectional shape}
- H10W 72/646: {the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector}
- H10W 72/886: {Die-attach connectors and strap connectors}
- H10W 72/931: {Shapes of bond pads}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/766: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A die package component with a jumper structure includes a first lead frame, a second lead frame, a die, a jumper structure and a package body. The first lead frame has a die connection surface. The second lead frame is separated to the first lead frame. The second lead frame has a lead frame connection groove which defines a thermal deformation tolerance allowable route. The jumper structure is thermally deformed in a thermal-variable environment. The jumper structure includes a die welding portion and a lead welding portion. The die welding portion is welded to the die. Upon meeting a thermal deformation, the lead welding portion would be movable welded along the thermal deformation tolerance allowable route to the lead frame connection groove.

## Claims

### Claim 1

A die package component with a jumper structure, comprising:
a first lead frame, having a die connection surface;
a second lead frame, separated to the first lead frame, furnished with a lead frame connection groove, the lead frame connection groove further including a thermal deformation tolerance allowable route, the second lead frame including a guide-stop structure at one side at least on a vertical route of the lead frame connection groove, the vertical route being perpendicular to an extension direction parallel to the thermal deformation tolerance allowable route, the guide-stop structure being to guide a lead welding portion into the lead frame connection groove and to prevent the lead welding portion from leaving the lead frame connection groove along the vertical route;
a die, connected on the die connection surface;
the jumper structure, generating a thermal deformation under a thermal-variable environment, further including:
a die welding portion, welded to the die;
a solder, located in the lead frame connection groove; and
the lead welding portion, welded to the lead frame connection groove via the solder, being movable along the thermal deformation tolerance allowable route upon the thermal deformation; and
a package body, at least partly packaging the first lead frame and the second lead frame, completely packaging the die and the jumper structure.

### Claim 2 (depends on 1)

The die package component with a jumper structure of claim 1, wherein the lead frame connection groove is a trapezoidal groove.

### Claim 3 (depends on 1)

The die package component with a jumper structure of claim 1, wherein the lead welding portion is extended from the die welding portion as a unique piece.

### Claim 4 (depends on 3)

The die package component with a jumper structure of claim 3, wherein the lead welding portion is extended from the die welding portion as a unique piece and at least partly in the extension direction.

### Claim 5 (depends on 3)

The die package component with a jumper structure of claim 3, wherein the die welding portion has a bump structure protruding toward the die, a solder accommodation space being formed between the bump structure and the die.