# US 10,312,179 B2 · Circuit arrangement, and current transformer

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- Number: US 10,312,179 B2
- Document ID: US10312179B2
- Status: Granted
- Kind: B2
- Application number: 15/307,897
- Filed: 2015-04-23
- Published: 2017-03-02
- Granted: 2019-06-04
- Earliest claimed: 2014-04-30
- Assignees: Conti Temic microelectronic GmbH
- Applicants: Conti Temic microelectronic GmbH
- Inventors: Olivier Pola
- Web page: https://patentgrep.com/patent/US10312179B2

## CPC

- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/43: by flowing gases, e.g. forced air cooling
- H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers}
- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 70/658: {for devices provided for in groups H10D8/00 - H10D48/00}
- H10W 76/12: characterised by their shape
- H10W 90/00: Package configurations
- H10W 90/811: {Multiple chips on leadframes}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The teachings of the present disclosure relate to electrical circuits and embodiments may include a circuit arrangement and a current converter comprising said circuit arrangement. An example circuit arrangement may include: a carrier part; a power component; a cooling channel for conveying a cooling agent; and a busbar conducting a current to the power component. The busbar may be arranged on the carrier part and have a region with a first surface and a second surface arranged opposite the first surface. The region may project away from the carrier part into the cooling channel. The power component may be arranged on the first surface of the region and connected to the region in an electrically conductive and mechanical manner.

## Claims

### Claim 1

A circuit arrangement comprising:
a carrier part including a circuit carrier;
a power component connected mechanically and electrically to the carrier part;
a cooling channel for conveying a cooling agent;
a busbar connecting to a planar surface of the circuit carrier to conduct a current to the power component from the circuit carrier, the busbar having a region projecting away from the carrier part into the cooling channel; and
an insulating layer encapsulating and fully sealing the busbar and the power component to the planar surface of the circuit carrier, electrically isolating the cooling agent in the cooling channel;
wherein the power component is arranged on a first surface of the region and connected to the region in an electrically conductive and mechanical manner.

### Claim 2 (depends on 1)

The circuit arrangement as claimed in claim 1, wherein the region projects away from the carrier part at an angle to the surface of the carrier part.

### Claim 3 (depends on 1)

The circuit arrangement as claimed in claim 1, wherein the insulating layer is electrically insulating and thermally conductive.

### Claim 4 (depends on 1)

The circuit arrangement as claimed in claim 1, wherein the insulating layer has a film thickness exceeding 50 micrometers.

### Claim 5 (depends on 1)

The circuit arrangement as claimed in claim 1, wherein the insulating layer comprises a thermoset plastic, a thermoplastic, a cast plastic, or a lacquer.

### Claim 6 (depends on 1)

The circuit arrangement as claimed in claim 1, wherein the region projects away from the carrier part at a perpendicular angle to the surface of the carrier part.

### Claim 7 (depends on 1)

The circuit arrangement as claimed in claim 1, wherein the insulating layer has a film thickness exceeding 100 micrometers.

### Claim 8 (depends on 1)

The circuit arrangement as claimed in claim 1, wherein the insulating layer has a film thickness up to 300 micrometers.

### Claim 9

A current converter comprising:
a carrier part including a circuit carrier;
a power component connected mechanically and electrically to the carrier part;
a cooling channel for conveying a cooling agent;
a busbar conducting a current to the power component from the circuit carrier, the busbar having a region with a first surface and a second surface arranged opposite the first surface, the region projecting away from the carrier part into the cooling channel;
the busbar secured to the carrier part by an electrically-insulating adhesive insulating foil; and
an insulating layer encapsulating and fully sealing the busbar and the power component to the planar surface of the circuit carrier, electrically isolating the cooling agent in the cooling channel;
wherein the power component is arranged on the first surface of the region and connected to the region in an electrically conductive and mechanical manner.