# US 10,312,177 B2 · Thermal interface materials including a coloring agent > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,177 B2 - Document ID: US10312177B2 - Status: Granted - Kind: B2 - Application number: 15/554,806 - Filed: 2016-10-12 - Published: 2018-12-13 - Granted: 2019-06-04 - Earliest claimed: 2015-11-17 - Assignees: Honeywell International Inc. - Applicants: Honeywell International Inc.; Liqiang Zhang; Yaqin Mao; Huifeng Duan; Haigang Kang; Ya Qun Liu; Ling Shen; Kai Zhang - Inventors: Liqiang Zhang; Yaqin Mao; Huifeng Duan; Haigang Kang; Ya Qun Liu; Ling Shen; Kai Zhang - Web page: https://patentgrep.com/patent/US10312177B2 ## CPC - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - C08L 23/26: modified by chemical after-treatment (saponified copolymers C08L23/0861; unsaturated acid salts C08L23/0876) - C09K 5/06: the change of state being from liquid to solid or vice versa - C09K 5/063: {Materials absorbing or liberating heat during crystallisation; Heat storage materials} - H10W 40/251: {Organics} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE ## Abstract The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment. ## Claims ### Claim 1 A thermal interface material comprising: at least one polymer; at least one thermally conductive filler; and at least one coloring agent in the form of an organic pigment having a formula selected from the group consisting of Formulas (I)-(XVI): wherein each R is independently selected from H, alkyl, aryl, and halogen; and ### Claim 2 (depends on 1) The thermal interface material of claim 1, wherein the thermal interface material comprises 0.5 wt. % to 2 wt. % of the coloring agent based on 100 wt. % of the thermal interface material without the coloring agent. ### Claim 3 (depends on 1) The thermal interface material of claim 1, wherein the thermal interface material comprises 1 wt. % to 20 wt. % of the coloring agent based on 100 wt. % of the thermal interface material without the coloring agent. ### Claim 4 (depends on 1) The thermal interface material of claim 1, wherein the thermal interface material has a thermal impedance of 0.05° C. cm2/W to 0.3° C. cm2/W. ### Claim 5 (depends on 1) The thermal interface material of claim 1, wherein the thermal interface material comprises: 5 wt. % to 10 wt. % of the at least one polymer; 85 wt. % to 95 wt. % of the at least one thermally conductive filler; 0.1 wt. % and 5 wt. % of a phase change material; and 0.5 wt. % to 20 wt. % of the coloring agent, based on 100 wt. % of the thermal interface material without the coloring agent. ### Claim 6 A dispensable thermal interface material comprising: at least one polymer; at least one thermally conductive filler; a coloring agent selected from the group consisting of: α-Fe2O3; α-Fe2O3.H2O; Fe3O4; and an organic pigment having a formula selected from the group consisting of Formulas (I)-(XVI): wherein each R is independently selected from H, alkyl, aryl, and halogen; and and at least one solvent. ### Claim 7 (depends on 6) The dispensable thermal interface material of claim 6, wherein the solvent is an isoparaffinic fluid. ### Claim 8 (depends on 6) The dispensable thermal interface material of claim 6, wherein the solvent comprises from 1 wt. % to 20 wt. % based on the total weight of a mixture including the thermal interface material and the solvent. ### Claim 9 (depends on 6) The dispensable thermal interface material of claim 6, wherein the dispensable thermal interface material as described above has the viscosity in the range of 10 Pa·s to 100,000 Pa·s. ### Claim 10 (depends on 6) The dispensable thermal interface material of claim 6, wherein the coloring agent is an organic pigment of Formula (I). ### Claim 11 (depends on 6) The dispensable thermal interface material of claim 6, wherein the coloring agent is selected from the group consisting of α-Fe2O3; α-Fe2O3.H2O and Fe3O4. ### Claim 12 (depends on 1) The thermal interface material of claim 1, wherein the coloring agent comprises a compound of the following formula: ### Claim 13 (depends on 1) The thermal interface material of claim 1, wherein the thermally conductive filler is present in an amount between 75 wt. % and 97 wt. %, based on a total weight of the thermal interface material. ### Claim 14 (depends on 6) The dispensable thermal interface material of claim 6, wherein the coloring agent comprises a compound of the following formula: ### Claim 15 (depends on 6) The dispensable thermal interface material of claim 6, wherein the thermally conductive filler is present in an amount between 75 wt. % and 97 wt. %, based on a total weight of the thermal interface material. ### Claim 16 A thermal interface material comprising: at least one polymer; at least one thermally conductive filler; at least one phase change material; and at least one coloring agent selected from the group consisting of iron based inorganic pigments and organic pigments. ### Claim 17 (depends on 16) The thermal interface material of claim 16, wherein the iron based inorganic pigment is selected from the group consisting of α-Fe2O3; α-Fe2O3.H2O; and Fe3O4. ### Claim 18 (depends on 16) The thermal interface material of claim 16, wherein the at least one coloring agent has a formula selected from the group consisting of Formulas (I)-(XVI): wherein each R is independently selected from H, alkyl, aryl, and halogen; and ### Claim 19 (depends on 16) The thermal interface material of claim 16, wherein the coloring agent comprises a compound of the following formula: ### Claim 20 (depends on 16) The thermal interface material of claim 16, wherein the thermally conductive filler is present in an amount between 75 wt. % and 97 wt. %, based on a total weight of the thermal interface material.