# US 10,312,172 B2 · High-frequency module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,172 B2 - Document ID: US10312172B2 - Status: Granted - Kind: B2 - Application number: 15/919,367 - Filed: 2018-03-13 - Published: 2018-07-19 - Granted: 2019-06-04 - Earliest claimed: 2015-09-14 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yoshihito Otsubo - Web page: https://patentgrep.com/patent/US10312172B2 ## CPC - H10W 74/114: {by a substrate and the encapsulations} - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 9/0022: {of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20)} - H05K 9/0081: {Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence)} - H05K 9/0084: {comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips} - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) - H10W 90/00: Package configurations - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 1/0298: {Multilayer circuits} - H05K 1/181: associated with surface mounted components - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/09972: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently - H05K 2203/1322: Encapsulation comprising more than one layer - H10W 70/63: Vias, e.g. via plugs - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A high-frequency module 1a includes: a wiring substrate 2; a plurality of components 3a and 3b that are mounted on an upper surface 2a of the wiring substrate 2; a sealing resin layer 4 that is stacked on the upper surface 2a of the wiring substrate 2; a shield film 6 that covers a surface of the sealing resin layer 4; and a shield wall 5 that is provided in the sealing resin layer 4. The shield wall 5 is formed of two shield wall element bodies 5a and 5b that have straight line shapes in a plan view, and the two shield wall element bodies 5a and 5b are arranged such that the shield wall element bodies each have one end surface that is not exposed at a different peripheral side surface 4b of the sealing resin layer 4. ## Claims ### Claim 1 A high-frequency module comprising: a wiring substrate; a plurality of components mounted on a main surface of the wiring substrate; a sealing resin layer stacked on the main surface of the wiring substrate and sealing the plurality of components; and a shield wall provided in the sealing resin layer and arranged so as to partition the sealing resin layer into a plurality of regions, wherein at least one prescribed component is respectively mounted in each of the plurality of regions; wherein the shield wall includes a plurality of shield wall element bodies, and each of the plurality of shield wall element bodies has at least one end portion not exposed at a side surface of the sealing resin layer. ### Claim 2 (depends on 1) The frequency module according to claim 1, wherein the shield wall partitions the sealing resin layer into two regions, and wherein when one of the two regions partitioned by the shield wall is viewed from another one of the two regions, at least a part of one of the plurality of shield wall element bodies different from another one of the plurality of shield wall element bodies is arranged in a place where the other shield wall element body is not arranged. ### Claim 3 (depends on 2) The frequency module according to claim 2, wherein the plurality of shield wall element bodies are each arranged so as to be parallel to each other in at least a part of each of the plurality of shield wall element bodies. ### Claim 4 (depends on 3) The frequency module according to claim 3, wherein the plurality of shield wall element bodies are arranged so as to surround at least one region such that the at least one region has an island shape. ### Claim 5 (depends on 3) The frequency module according to claim 3, further comprising: a surface layer conductor arranged on the main surface of the wiring substrate so as to contact each of the plurality of shield wall element bodies. ### Claim 6 (depends on 2) The frequency module according to claim 2, wherein the plurality of shield wall element bodies are arranged so as to surround at least one region such that the at least one region has an island shape. ### Claim 7 (depends on 2) The frequency module according to claim 2, further comprising: a surface layer conductor arranged on the main surface of the wiring substrate so as to contact each of the plurality of shield wall element bodies. ### Claim 8 (depends on 1) The frequency module according to claim 1, wherein the plurality of shield wall element bodies are arranged so as to surround at least one region such that the at least one region has an island shape. ### Claim 9 (depends on 8) The frequency module according to claim 8, wherein at least one region other than the island-shaped region is partitioned by the plurality of shield wall element bodies. ### Claim 10 (depends on 9) The frequency module according to claim 9, further comprising: a shield film covering a surface of the sealing resin layer except for the island-shaped region. ### Claim 11 (depends on 9) The frequency module according to claim 9, further comprising: a surface layer conductor arranged on the main surface of the wiring substrate so as to contact each of the plurality of shield wall element bodies. ### Claim 12 (depends on 8) The frequency module according to claim 8, further comprising: a shield film covering a surface of the sealing resin layer except for the island-shaped region. ### Claim 13 (depends on 12) The frequency module according to claim 12, further comprising: a ground electrode arranged inside the wiring substrate and outside the island-shaped region; and a via connecting the shield wall to the ground electrode. ### Claim 14 (depends on 13) The frequency module according to claim 13, further comprising: a surface layer conductor arranged on the main surface of the wiring substrate so as to contact each of the plurality of shield wall element bodies. ### Claim 15 (depends on 12) The frequency module according to claim 12, further comprising: a surface layer conductor arranged on the main surface of the wiring substrate so as to contact each of the plurality of shield wall element bodies. ### Claim 16 (depends on 8) The frequency module according to claim 8, further comprising: a surface layer conductor arranged on the main surface of the wiring substrate so as to contact each of the plurality of shield wall element bodies. ### Claim 17 (depends on 1) The frequency module according to claim 1, further comprising: a surface layer conductor arranged on the main surface of the wiring substrate so as to contact each of the plurality of shield wall element bodies. ### Claim 18 (depends on 1) The frequency module according to claim 1, further comprising: at least one surface layer conductor being arranged so as to contact the plurality of shield wall element bodies.