# US 10,312,169 B1 · Substrate and package module including the same

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- Number: US 10,312,169 B1
- Document ID: US10312169B1
- Status: Granted
- Kind: B1
- Application number: 15/895,259
- Filed: 2018-02-13
- Published: 2019-06-27
- Granted: 2019-06-04
- Earliest claimed: 2017-12-27
- Assignees: Lingsen Precision Industries, Ltd.
- Applicants: Lingsen Precision Industries, Ltd.
- Inventors: Yu-Shiang Chen; Chao-Wei Yu; Yu-Lin Hsiao; Ming-Te Tu
- Web page: https://patentgrep.com/patent/US10312169B1

## CPC

- H10W 76/60: Seals
- H10W 76/157: having interconnections parallel to the insulating or insulated base
- H10W 42/60: protecting against electrostatic charges or discharges, e.g. Faraday shields (integrated devices comprising arrangements for electrical protection H10D89/60)
- H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage}
- H10W 76/15: Containers comprising an insulating or insulated base
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A substrate includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of protrusions extending outward from an outer periphery of the annular portion. A package module is formed by the substrate, a chip mounted on the bearing surface of the substrate body, and a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive. By means of the protrusions of the interconnection layer, the bonding area of the adhesive is increased and the spread of the adhesive is effectively concentrated.

## Claims

### Claim 1

A substrate comprising:
a substrate body having a bearing surface; and
an interconnection layer disposed on the bearing surface of the substrate body and having an annular portion and a plurality of first protrusions extending outward from an outer periphery of the annular portion;
wherein the interconnection layer has a plurality of second protrusions extending inward from an inner periphery of the annular portion, and each of the first protrusions and each of the second protrusions are interlaced with each other.

### Claim 2 (depends on 1)

The substrate as claimed in claim 1, wherein the annular portion and the first protrusions are formed integrally.

### Claim 3 (depends on 1)

The substrate as claimed in claim 1, wherein the annular portion and the first protrusions are manufactured from metal.

### Claim 4 (depends on 1)

A package module comprising:
a substrate as defined in claim 1;
a chip mounted on the bearing surface of the substrate body and surrounded by the annular portion of the interconnection layer; and
a cap enclosing the chip and having a bottom adhered to the annular portion and the first protrusions by an adhesive.

### Claim 5 (depends on 4)

The package module as claimed in claim 4, wherein the adhesive is solder paste.

### Claim 6 (depends on 4)

The package module as claimed in claim 4, wherein the annular portion and the first protrusions are formed integrally from metal.