# US 10,312,168 B2 · Electronic element mounting substrate, and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,168 B2 - Document ID: US10312168B2 - Status: Granted - Kind: B2 - Application number: 15/574,442 - Filed: 2016-06-15 - Published: 2018-05-10 - Granted: 2019-06-04 - Earliest claimed: 2015-06-18 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Kouki Suda - Web page: https://patentgrep.com/patent/US10312168B2 ## CPC - H10W 76/12: characterised by their shape - H10F 39/80: {Constructional details of image sensors} - H10F 39/804: {Containers or encapsulations} - H10F 39/811: {Interconnections} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/098: {Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence)} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/68: Shapes or dispositions thereof - H10W 76/10: Containers or parts thereof - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10H 20/8506: {Containers} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract An electronic element mounting substrate includes a base body, an electrode, and a pad. The base body has a frame shape, and includes a first frame section and a second frame section, the second frame section being disposed on the first frame section and including an inner surface protruding further inward than an inner surface of the first frame section. The electrode is disposed on a bottom surface of the first frame section of the base body. The pad is disposed on a bottom surface of a protruding part of the second frame section, and is electrically connected to the electrode. A groove extending in a vertical direction is formed in an inner surface of the protruding part of the second frame section of the base body. ## Claims ### Claim 1 An electronic element mounting substrate comprising: a base body, comprising a frame shape, comprising a first frame section and a second frame section, the second frame section being disposed on the first frame section and comprising an inner surface protruding further inward than an inner surface of the first frame section; an electrode disposed on a bottom surface of the first frame section of the base body; and a pad disposed on a bottom surface of a protruding part of the second frame section, the pad being electrically connected to the electrode, wherein a groove extending in a vertical direction is formed in an inner surface of the protruding part of the second frame section of the base body. ### Claim 2 (depends on 1) The electronic element mounting substrate according to claim 1, wherein the second frame section is rectangular, and the groove is disposed in both of sides facing each other. ### Claim 3 (depends on 2) The electronic element mounting substrate according to claim 2, wherein the second frame section is rectangular, and the groove is disposed in a corner portion where adjacent sides of the second frame section intersect. ### Claim 4 (depends on 3) The electronic element mounting substrate according to claim 3, wherein an upper part of the groove is recessed more than a lower part. ### Claim 5 (depends on 2) The electronic element mounting substrate according to claim 2, wherein a periphery of the groove in the second frame section is sloped upward or downward. ### Claim 6 (depends on 5) The electronic element mounting substrate according to claim 5, wherein an upper part of the groove is recessed more than a lower part. ### Claim 7 (depends on 2) The electronic element mounting substrate according to claim 2, wherein an upper part of the groove is recessed more than a lower part. ### Claim 8 (depends on 1) The electronic element mounting substrate according to claim 1, wherein the second frame section is rectangular, and the groove is disposed in a corner portion where adjacent sides of the second frame section intersect. ### Claim 9 (depends on 8) The electronic element mounting substrate according to claim 8, wherein an upper part of the groove is recessed more than a lower part. ### Claim 10 (depends on 1) The electronic element mounting substrate according to claim 1, wherein a periphery of the groove in the second frame section is sloped upward or downward. ### Claim 11 (depends on 10) The electronic element mounting substrate according to claim 10, wherein an upper part of the groove is recessed more than a lower part. ### Claim 12 (depends on 1) The electronic element mounting substrate according to claim 1, wherein an upper part of the groove is recessed more than a lower part. ### Claim 13 (depends on 1) An electronic device comprising: the electronic element mounting substrate according to claim 1; an electronic element connected to the pad and connected to a bottom surface of the second frame section; and a lid disposed on a top surface of the second frame section.