# US 10,312,162 B2 · Methods and apparatus for semiconductor sample workflow > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,162 B2 - Document ID: US10312162B2 - Status: Granted - Kind: B2 - Application number: 15/615,494 - Filed: 2017-06-06 - Published: 2017-12-21 - Granted: 2019-06-04 - Earliest claimed: 2016-06-21 - Assignees: FEI Company - Applicants: FEI Company - Inventors: Konstantin Balashov; Tom Miller - Web page: https://patentgrep.com/patent/US10312162B2 ## CPC - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - G01N 1/28: Preparing specimens for investigation {including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q}(mounting specimens on microscopic slides G02B21/34; means for supporting the objects or the materials to be analysed in electron microscopes H01J37/20 {; laboratory gas handling apparatus B01L5/00}) - G01N 1/32: Polishing; Etching - G01N 9/24: by observing the transmission of wave or particle radiation through the material - G01N 23/20025: Sample holders or supports therefor - G01N 23/2204: Specimen supports therefor; Sample conveying means therefore - G03F 7/70483: {Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring} - G03F 7/70616: {Monitoring the printed patterns} - G03F 7/7075: {Handling workpieces outside exposure position, e.g. SMIF box} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract Apparatus and methods are described for the automated transfer and storage of transmission electron microscope (TEM) and scanning/transmission electron microscope (STEM) lamella samples throughout a semiconductor manufacturing facility using existing automation infrastructure such as a Front Opening Unified Pod (FOUP). Also provided are wafer facsimiles corresponding to outer dimensions of semiconductor, data storage or solar cell wafers, wherein the facsimiles adapted to store, carry and/or provide a testing platform for testing of samples taken from semiconductor, data storage or solar cell wafers. ## Claims ### Claim 1 A wafer or disk facsimile for use in storing and transporting test samples taken from a semiconductor wafer or data storage wafer, comprising: a body dimensioned to correspond to at least a diameter of the semiconductor wafer or data storage wafer from which the test samples are taken; and a plurality of niches formed in a surface of the body and configured to receive one or more of the test samples taken from the semiconductor wafer or data storage wafer. ### Claim 2 (depends on 1) The wafer or disk facsimile of claim 1, wherein the test samples are electron microscope (EM) lamella. ### Claim 3 (depends on 2) The wafer or disk facsimile of claim 2, wherein the test samples are transmission electron microscope (TEM) and/or scanning/transmission electron microscope (STEM) lamella. ### Claim 4 (depends on 1) The wafer or disk facsimile of claim 1, wherein the body is formed of a rigid material configured to be received and transported by a front opening unified pod (FOUP). ### Claim 5 (depends on 4) The wafer or disk facsimile of claim 4, wherein the rigid material is a ceramic, plastic, metal or silicon material. ### Claim 6 (depends on 1) The wafer or disk facsimile of claim 1, wherein each of the plurality of niches are configured to directly receive a test sample. ### Claim 7 (depends on 1) The wafer or disk facsimile of claim 1, wherein the plurality of niches are EM grid receptacles configured to receive EM grids. ### Claim 8 (depends on 1) The wafer or disk facsimile of claim 1, wherein the plurality of niches include EM grid retainers. ### Claim 9 (depends on 7) The wafer or disk facsimile of claim 7, further comprising at least one sub-carrier positioned on or in a surface of the wafer facsimile, the at least one sub-carrier configured to carry a plurality of EM grids such that the sub-carrier may be loaded directly into a vacuum chamber of an electron microscope (EM). ### Claim 10 (depends on 9) The wafer facsimile of claim 9, wherein the sub-carrier is configured to carry transmission electron microscope (TEM) grids. ### Claim 11 (depends on 1) The wafer facsimile of claim 1, wherein the plurality of niches is indexed such that each test sample received therein is identifiable to a semiconductor wafer or data storage wafer from which the test sample is taken. ### Claim 12 (depends on 11) The wafer facsimile of claim 11, wherein the plurality of niches are indexed using a barcode or an RFID tag. ### Claim 13 A wafer facsimile for use in storing and transporting test samples taken from a data storage wafer or a solar cell wafer, comprising: a body dimensioned to correspond to an outer diameter of the data storage wafer or solar cell wafer being tested; and a plurality of niches formed in a surface of the body and configured to receive one or more test samples. ### Claim 14 The wafer facsimile of 13, wherein the plurality of niches is indexed such that each test sample received therein is identifiable to a semiconductor wafer or data storage wafer from which the test sample is taken.