# US 10,312,128 B2 · Chemical-mechanical polish (CMP) devices, tools, and methods

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- Number: US 10,312,128 B2
- Document ID: US10312128B2
- Status: Granted
- Kind: B2
- Application number: 14/986,113
- Filed: 2015-12-31
- Published: 2017-07-06
- Granted: 2019-06-04
- Earliest claimed: 2015-12-31
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Chang-Sheng Lin
- Web page: https://patentgrep.com/patent/US10312128B2

## CPC

- H10P 72/7604: {the wafers being placed on a susceptor, stage or support}
- B24B 37/042: {operating processes therefor}
- B24B 37/105: {the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement}
- B24B 53/017: Devices or means for dressing, cleaning or otherwise conditioning lapping tools
- B24B 57/02: for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
- H10P 72/0422: {for wet etching}
- H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS

## Abstract

Chemical-mechanical polishing (CMP) devices, tools, and methods are disclosed. In some embodiments, a device for a CMP tool includes a carrier and an embedded dummy disk coupled to the carrier. The embedded dummy disk comprises a substrate and a film disposed over the substrate. The carrier is coupleable to an arm of a handler of the CMP tool. The carrier and the embedded dummy disk are adapted to be embedded within a housing of the CMP tool. The embedded dummy disk is adapted to be polished by the CMP tool in preparation for a polishing process for a wafer.

## Claims

### Claim 1

A device for a chemical-mechanical polishing (CMP) tool, the device comprising:
a first carrier component configured to position at least one production wafer with regard to a polishing pad;
a second carrier component, separate from the first carrier component and configured to position at least one embedded dummy disk with regard to the polishing pad;
a pad conditioner, configured to position a pad conditioning disk over the polishing pad;
wherein the at least one embedded dummy disk comprises a substrate and a film disposed over the substrate, wherein the second carrier component and the at least one embedded dummy disk are embedded within a housing of the CMP tool, and wherein the CMP tool is configured to polish the at least one embedded dummy disk in preparation for a polishing process for a wafer; and
a handler connected to the first carrier component, the second carrier component, and the pad conditioner, the handler configured to handle the first carrier component to position the at least one production wafer against the polishing pad independently of the second carrier component and configured to handle the second carrier component to position the at least one embedded dummy disk against the polishing pad independently of the first carrier component.

### Claim 2 (depends on 1)

The device according to claim 1, further comprising a plurality of the embedded dummy disks coupled to a carrier of the second carrier component.

### Claim 3 (depends on 1)

The device according to claim 1, wherein the film of the embedded dummy disk comprises a thickness of about 1 μm to about 2 mm.

### Claim 4 (depends on 1)

The device according to claim 1, wherein the film of the embedded dummy disk is unpatterned.

### Claim 5 (depends on 1)

The device according to claim 1, wherein the film of the embedded dummy disk comprises a material selected from the group consisting essentially of an oxide material, a nitride material, a metal, and combinations thereof.

### Claim 6 (depends on 1)

The device according to claim 1, wherein the film of the embedded dummy disk comprises a material selected from the group consisting essentially of SiO2; undoped silicate glass (USG); phosphosilicate glass (PSG); borophosphosilicate glass (BPSG); SiN; SiCN; SiON; SiOCN; Cu, Al, W, Co, Ta, Ti, Ni, metal oxides thereof, or metal nitrides thereof; and combinations thereof.

### Claim 7 (depends on 1)

The device according to claim 1, wherein the substrate of the embedded dummy disk comprises a material selected from the group consisting essentially of a semiconductive material, a metal, a polymer, and combinations thereof.

### Claim 8

A chemical-mechanical polishing (CMP) tool comprising:
a housing;
a platen disposed within the housing;
a polishing pad disposed on the platen;
a slurry dispensing device disposed within the housing proximate the platen;
a handler disposed within the housing proximate the platen;
a pad conditioner coupled to the handler by a pad conditioning arm, the pad conditioner being disposed over the polishing pad;
a first carrier coupled to the handler by a first arm, the first carrier being positioned to retain a wafer; and
a second carrier coupled to the handler by a second arm, the second carrier comprising an embedded dummy disk coupled thereto, wherein the embedded dummy disk comprises a substrate and a film disposed over the substrate, and wherein the second carrier and the embedded dummy disk are embedded within the CMP tool within the housing, wherein the first carrier and the second carrier are respectively positioned independently of one another relative to the polishing pad by operation of the first arm and the second arm, respectively.

### Claim 9 (depends on 8)

The CMP tool according to claim 8, further comprising a plurality of the second carriers coupled to the handler, wherein each of the plurality of the second carriers comprises an embedded dummy disk coupled thereto.

### Claim 10 (depends on 8)

The CMP tool according to claim 8, wherein the second carrier comprises a plurality of the embedded dummy disks disposed thereon.

### Claim 11 (depends on 10)

The CMP tool according to claim 10, further comprising a plurality of the second carriers coupled to the handler.

### Claim 12 (depends on 8)

The CMP tool according to claim 8, wherein the second carrier comprises a dedicated disk carrier for the embedded dummy disk.

### Claim 13 (depends on 8)

The CMP tool according to claim 8, wherein the wafer comprises a production wafer, a patterned wafer, or a test wafer.

### Claim 14

A chemical-mechanical polishing (CMP) tool comprising:
a load port coupled to a housing, and being configured to insert a wafer into the housing;
a rotatable platen disposed within the housing, the rotatable platen configured to support a polishing pad thereon;
at least one embedded dummy disk disposed within the housing;
a pad conditioner disposed over the polishing pad;
a handler disposed within the housing, the handler being coupled to a plurality of arms, wherein:
a first arm of the plurality of arms couples a first carrier to the handler, wherein the first carrier is configured to retain the wafer for processing;
a second arm of the plurality of arms couples a second carrier to the handler, independently of the first carrier, wherein the second carrier is configured to retain at least one dummy disk within the housing, the at least one dummy disk comprising:
a substrate; and
a film on the substrate, the film having a thickness sufficient to reduce or eliminate a need to replace the dummy disk; and
a third arm of the plurality of arms couples the pad conditioner to the handler.

### Claim 15 (depends on 14)

The CMP tool according to claim 14, wherein the polishing pad is configured to be removable from the rotatable platen.

### Claim 16 (depends on 14)

The CMP tool according to claim 14, wherein the film on the substrate is unpatterned.

### Claim 17 (depends on 14)

The CMP tool according to claim 14, wherein the second carrier is configured to retain ten or fewer dummy disks.

### Claim 18 (depends on 14)

The CMP tool according to claim 14, wherein the wafer has a first diameter, the dummy disk has a second diameter, and the second diameter is less than or equal to the first diameter.

### Claim 19 (depends on 14)

The CMP tool according to claim 14, wherein the thickness of the film is about 1 μm to about 2 mm.

### Claim 20 (depends on 14)

The CMP tool according to claim 14, wherein a third arm of the plurality of arms couples a diamond disk to the handler.