# US 10,312,123 B2 · Method for compensating probe misplacement and probe apparatus

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,312,123 B2
- Document ID: US10312123B2
- Status: Granted
- Kind: B2
- Application number: 15/414,852
- Filed: 2017-01-25
- Published: 2017-08-03
- Granted: 2019-06-04
- Earliest claimed: 2016-01-29
- Assignees: Mpi Corporation
- Applicants: MPI Corporation
- Inventors: Chen-Ching Chen; Yu-Hsun Hsu; Po-Yi Ting; Stojan Kanev
- Web page: https://patentgrep.com/patent/US10312123B2

## CPC

- H10P 72/3218: {Conveying cassettes, containers or carriers}
- A47B 88/457: operated by electrically-powered actuation means
- A47B 88/497: with other guiding mechanisms, e.g. scissor mechanisms
- G01K 13/00: Thermometers specially adapted for specific purposes
- G01R 31/2891: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)}
- G01R 31/44: Testing lamps
- H10P 72/18: {characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports}
- H10P 72/1922: {characterised by the construction of the closed carrier}
- A47B 88/988: in the form of holders for positioning specific articles
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- A47B: TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE (furniture jointing F16B)
- G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00)
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

A method for compensating probe misplacement and a probe apparatus are provided. The method is applicable to a probe module which includes a probe and a fixing base. The probe includes a probe body section and a probe tip section. The probe body section is fixed on the fixing base. The method includes: measuring a temperature of a probe body of the probe body section of the probe; calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section; calculating a compensation value according to the thermal expansion amount; moving the probe or a to-be-tested element according to the calculated compensation value, to align a probe tip of the probe tip section with the to-be-tested element or align the to-be-tested element with the probe tip of the probe tip section.

## Claims

### Claim 1

A method for compensating probe misplacement, applicable to a probe module, wherein the probe module comprises a probe and a fixing base, the probe comprises a probe body section and a probe tip section, and the probe body section is fixed on the fixing base, the method for compensating probe misplacement comprising:
measuring a temperature of a probe body of the probe body section of the probe by a temperature measurement sensor disposed on the fixing base of the probe;
calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section by a calculation circuit electrically connected to the temperature measurement sensor;
calculating a compensation value according to the thermal expansion amount by the calculation circuit; and
moving the probe module according to the compensation value, to align a probe tip of the probe tip section with a to-be-tested element.

### Claim 2

A probe module, comprising: a fixing base;
a probe, comprising a probe tip section and a probe body section, wherein the probe body section is fixed on the fixing base, and the probe tip section is exposed out of the fixing base;
a temperature measurement sensor, disposed on the fixing base, to measure a temperature of a probe body of the probe body section of the probe and
a calculation circuit, electrically connected to the temperature measurement sensor, and configured to calculate a thermal expansion amount of the probe along a length direction of the probe body section according to the temperature of the probe body, and to calculate a compensation value according to the thermal expansion amount.

### Claim 3 (depends on 2)

The probe module according to claim 2, further comprising a driver, electrically connected to the calculation circuit, wherein the driver moves the fixing base according to the compensation value, to align a probe tip of the probe tip section with a to-be-tested element.

### Claim 4 (depends on 2)

The probe module according to claim 2, further comprising a driver, electrically connected to the calculation circuit, wherein the driver moves a to-be-tested element according to the compensation value, to align the to-be-tested element with a probe tip of the probe tip section.

### Claim 5

A method for compensating probe misplacement, applicable to a probe module, wherein the probe module comprises a probe and a fixing base, the probe comprises a probe body section and a probe tip section, and the probe body section is fixed on the fixing base, the method for compensating probe misplacement comprising:
measuring a temperature of a probe body of the probe body section of the probe by a temperature measurement sensor disposed on the fixing base of the probe;
calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section by a calculation circuit electrically connected to the temperature measurement sensor;
calculating a compensation value according to the thermal expansion amount by the calculation circuit; and
moving a to-be-tested element according to the compensation value, to align the to-be- tested element with a probe tip of the probe tip section.