# US 10,312,118 B2 · Bonding apparatus and method

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- Number: US 10,312,118 B2
- Document ID: US10312118B2
- Status: Granted
- Kind: B2
- Application number: 14/157,271
- Filed: 2014-01-16
- Published: 2015-07-16
- Granted: 2019-06-04
- Earliest claimed: 2014-01-16
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Pei-Shan Wu; Yi-Ting Hu; Ming-Tan Lee; Yu-Lin Wang; Yuh-Sen Chang; Pin-Yi Shin; Wen-Ming Chen; Wei-Chih Chen; Chih-Yuan Chiu
- Web page: https://patentgrep.com/patent/US10312118B2

## CPC

- H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}
- H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks
- H10W 72/00: Interconnections or connectors in packages
- H10W 95/00: Packaging processes not covered by the other groups of this subclass
- H10W 72/0198: {batch processes}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
- H10W 72/07178: {Means for aligning}
- H10W 72/072: {of bump connectors}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/53178: Chip component
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.

## Claims

### Claim 1

A bonding apparatus, comprising:
a wafer stage for holding a wafer;
a first chip stage for holding at least one first chip;
a first chip transporting device movable from the first chip stage to the wafer stage for transporting the first chip from the first chip stage,
wherein the first chip transporting device comprises:
a first pickup member for picking up the first chip from the first chip stage; and
a first bonding member for bonding the first chip to the wafer, wherein the first pickup member and the first bonding member are spatially separated;
a second chip stage for holding at least one second chip;
a second chip transporting device movable from the second chip stage to the wafer stage for transporting the second chip from the second chip stage, wherein the first and second chip transporting devices are configured to transport the first and second chips onto the same wafer, wherein heaviest weights that the first and second chip transporting devices are designed to deal with are unequal; and
an alignment device movable to a position between the first chip and the wafer when the first chip transporting device moves the first chip to a position above the wafer.

### Claim 2 (depends on 1)

The bonding apparatus of claim 1, wherein the first chip transporting device comprises a first suction device for applying a first suction force to the first chip; and wherein the second chip transporting device comprises a second suction device for applying a second suction force to the second chip, wherein the first suction force is unequal to the second suction force.

### Claim 3 (depends on 1)

The bonding apparatus of claim 1, further comprising:
a plurality of first chip storages; and
a first chip loading device for transferring a plurality of the first chips from the first chip storages to the first chip stage in an alternating manner.

### Claim 4 (depends on 3)

The bonding apparatus of claim 3, further comprising:
a plurality of second chip storages; and
a second chip loading device for transferring a plurality of the second chips from the second chip storages to the second chip stage in an alternating manner.

### Claim 5 (depends on 1)

The bonding apparatus of claim 1, further comprising:
a plurality of wafer storages; and
a wafer loading device for transferring a plurality of the wafers from the wafer storages to the wafer stage in an alternating manner.

### Claim 6 (depends on 1)

The bonding apparatus of claim 1, further comprising:
a pre-alignment device for adjusting an orientation of the wafer.

### Claim 7 (depends on 1)

The bonding apparatus of claim 1, further comprising:
a first adhesive container, wherein a moving path of the first chip transporting device is across the first adhesive container; and
a second adhesive container, wherein a moving path of the second chip transporting device is across the second adhesive container.

### Claim 8 (depends on 1)

The bonding apparatus of claim 1, wherein the second chip transporting device comprises:
a second pickup member for picking up the second chip from the second chip stage; and
a second bonding member for bonding the second chip to the wafer, wherein the second pickup member and the second bonding member are spatially separated.

### Claim 9 (depends on 1)

The bonding apparatus of claim 1, wherein the first and the second chip transporting devices are configured to respectively transport the first and second chips onto the wafer at the same time.

### Claim 10

A bonding apparatus, comprising:
a wafer stage for holding a wafer;
a plurality of chip stages for respectively holding a plurality of chips; and
a plurality of chip transporting devices respectively movable from the chip stages to the wafer stage for respectively transporting the chips from the chip stages onto the wafer stage and configured to bond the chips to the same wafer, wherein heaviest weights that the transporting devices are designed to deal with are unequal,
wherein the chip transporting devices respectively comprise a plurality of pickup members capable of applying unequal suction forces to pick up the chips from the chip stages, and
the chip transporting devices respectively comprise a plurality of bonding members capable of applying unequal suction forces to hold the chips from the pickup members.

### Claim 11 (depends on 10)

The bonding apparatus of claim 10, wherein the chip transporting devices respectively comprise a plurality of suction device for respectively applying suction forces to the chips, wherein the suction forces applied by the suction devices are unequal.

### Claim 12 (depends on 10)

The bonding apparatus of claim 10, further comprising:
a plurality of chip storages; and
a chip loading device for transferring the chips from the chip storages to one of the chip stages in an alternating manner.

### Claim 13 (depends on 10)

The bonding apparatus of claim 10, wherein the pickup members and the bonding members are separated robot arms capable of working individually.

### Claim 14 (depends on 10)

The bonding apparatus of claim 10, further comprising:
an alignment device movable to a position between one of the chips and the wafer when a respective one of the chip transporting devices moves said one of the chips to a position above the wafer.

### Claim 15

A bonding apparatus, comprising:
a wafer stage;
a first chip transporting device movable from and to the wafer stage,
wherein the first chip transporting device comprises:
a first pickup member for picking up the first chip from a first chip stage; and
a first bonding member for bonding the first chip to the wafer, wherein the first pickup member and the first bonding member are spatially separated; and
a second chip transporting device movable from and to the wafer stage, wherein the first and second transporting devices are configured to bond chips to a same wafer held by the wafer stage, wherein heaviest weights that the first and second chip transporting devices are designed to deal with are unequal.

### Claim 16 (depends on 15)

The bonding apparatus of claim 15, further comprising:
an alignment device between a chip held by the first chip transporting device and a wafer held by the wafer stage when the first chip transporting device is moved to a position above the wafer stage.

### Claim 17 (depends on 15)

The bonding apparatus of claim 15, further comprising:
a plurality of wafer storages; and
a wafer loading device for transferring a plurality of the wafers from the wafer storages to the wafer stage in an alternating manner.