# US 10,312,116 B2 · Methods and apparatus for rapidly cooling a substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,116 B2 - Document ID: US10312116B2 - Status: Granted - Kind: B2 - Application number: 15/722,549 - Filed: 2017-10-02 - Published: 2018-01-25 - Granted: 2019-06-04 - Earliest claimed: 2014-04-11 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Jallepally Ravi; Steven V. Sansoni; Kirankumar Savandaiah - Web page: https://patentgrep.com/patent/US10312116B2 ## CPC - H10P 72/0434: {mainly by convection} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract Methods and apparatus for changing the temperature of a substrate are provided. In some embodiments, a method includes: placing a substrate onto a support surface of a substrate support disposed within an inner volume of a cooling chamber; moving at least one of the substrate support or a plate disposed in the cooling chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; flowing a gas into the second volume to increase a pressure within the second volume; and flowing a coolant through a plurality of channels disposed in at least one of the substrate support or the plate to cool the substrate. ## Claims ### Claim 1 A method for changing the temperature of a substrate, comprising: placing a substrate onto a support surface of a substrate support disposed within a first volume of an inner volume of a cooling chamber; moving at least one of the substrate support or a plate disposed in the cooling chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate by forming a seal between the substrate support and the plate in a location disposed radially outward of the substrate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; flowing a gas into the second volume to increase a pressure within the second volume; and flowing a coolant through a plurality of channels disposed in at least one of the substrate support or the plate to cool the substrate. ### Claim 2 (depends on 1) The method of claim 1, further comprising: flowing the coolant through the plurality of channels in both of the substrate support and the plate. ### Claim 3 (depends on 1) The method of claim 1, further comprising: flowing a backside gas through the substrate support into a space between the substrate and the support surface. ### Claim 4 (depends on 1) The method of claim 1, wherein the substrate support comprises an outer ring surrounding the support surface, and wherein the outer ring comprises an annular channel extending from the support surface in a direction opposite the plate and at least one through hole extending from the at least one first channel to a peripheral surface of the outer ring. ### Claim 5 (depends on 4) The method of claim 4, further comprising: flowing the gas from the second volume to the remaining portion of the inner volume through the annular channel and the at least one through hole, wherein the annular channel and the at least one through hole create a choked flow. ### Claim 6 (depends on 1) The method of claim 1, wherein the gas comprises at least one inert gas. ### Claim 7 (depends on 1) The method of claim 1, wherein a thickness of the plate increases along positions radially outward of a central axis of the plate. ### Claim 8 (depends on 1) The method of claim 1, wherein moving at least one of the substrate support or the plate comprises moving the substrate support toward the plate. ### Claim 9 (depends on 1) The method of claim 1, wherein the second volume is substantially sealed off from the remaining portion of the inner volume by providing a choked flow condition between the second volume and the remaining portion of the inner volume such that the pressure inside of the second volume is increased at a greater rate than the pressure within the remaining portion of the inner volume. ### Claim 10 A method for changing the temperature of a substrate, comprising: placing a substrate onto a support surface of a substrate support disposed within a first volume of an inner volume of a chamber; moving at least one of the substrate support or a plate disposed in the chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate by forming a seal between the substrate support and the plate in a location disposed radially outward of the substrate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; flowing a gas into the second volume to increase a pressure within the second volume; and flowing a heat transfer fluid through a plurality of channels disposed in at least one of the substrate support or the plate to change the temperature of the substrate. ### Claim 11 (depends on 10) The method of claim 10, further comprising: flowing the heat transfer fluid through the plurality of channels in both of the substrate support and the plate. ### Claim 12 (depends on 10) The method of claim 10, wherein the heat transfer fluid is provided at a desired temperature to heat the substrate. ### Claim 13 (depends on 10) The method of claim 10, further comprising: flowing a backside gas through the substrate support into a space between the substrate and the support surface. ### Claim 14 (depends on 10) The method of claim 10, wherein the second volume is substantially sealed off from the remaining portion of the inner volume by providing a choked flow condition between the second volume and the remaining portion of the inner volume such that the pressure inside of the second volume is increased at a greater rate than the pressure within the remaining portion of the inner volume. ### Claim 15 A method for changing the temperature of a substrate, comprising: placing a substrate onto a support surface of a substrate support disposed within a first volume of an inner volume of a chamber; moving at least one of the substrate support or a plate disposed in the chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate by forming a seal between the substrate support and the plate in a location disposed radially outward of the substrate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; increasing a pressure within the second volume; and flowing a heat transfer fluid through a plurality of channels disposed in at least one of the substrate support or the plate to change the temperature of the substrate. ### Claim 16 (depends on 15) The method of claim 15, wherein the heat transfer fluid is provided at a desired temperature to heat the substrate. ### Claim 17 (depends on 15) The method of claim 15, wherein the heat transfer fluid is provided at a desired temperature to cool the substrate. ### Claim 18 (depends on 15) The method of claim 15, further comprising: flowing the heat transfer fluid through the plurality of channels in both of the substrate support and the plate. ### Claim 19 (depends on 15) The method of claim 15, further comprising: flowing a backside gas through the substrate support into a space between the substrate and the support surface. ### Claim 20 (depends on 15) The method of claim 15, wherein the second volume is substantially sealed off from the remaining portion of the inner volume by providing a choked flow condition between the second volume and the remaining portion of the inner volume such that the pressure inside of the second volume is increased at a greater rate than the pressure within the remaining portion of the inner volume.