# US 10,312,024 B2 · Multilayer ceramic electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,312,024 B2 - Document ID: US10312024B2 - Status: Granted - Kind: B2 - Application number: 15/365,169 - Filed: 2016-11-30 - Published: 2017-06-08 - Granted: 2019-06-04 - Earliest claimed: 2015-12-03 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yutaka Ota - Web page: https://patentgrep.com/patent/US10312024B2 ## CPC - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01C 1/148: the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) - H01C 7/008: {Thermistors (H01C7/02 - H01C7/06 take precedence)} - H01C 7/18: comprising a plurality of layers stacked between terminals - H01F 17/0013: {with stacked layers} - H01F 17/04: with magnetic core - H01F 27/292: {Surface mounted devices} - H01G 2/065: {for surface mounting, e.g. chip capacitors} - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/2325: {characterised by the material of the terminals} - H10N 30/872: {Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices} - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H01C: RESISTORS - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract A multilayer ceramic capacitor includes a multilayer body including ceramic layers and including main surfaces, side surfaces, and end surfaces, inner electrodes, which are located inside the multilayer body and a portion of each of which extends to one main surface, and outer electrodes located on one main surface and connected to the inner electrodes. Each of the outer electrodes includes outer electrode side surface portions located up to a portion of each of the side surfaces and an outer electrode end surface portion located up to one end surface, and about 1.40≤A/B≤about 3.33 is satisfied, where the lengths of the outer electrode side surface portions in the direction in which the main surfaces are connected are indicated as A and the lengths of the outer electrode end surface portions in the direction in which the main surfaces are connected are indicated as B. ## Claims ### Claim 1 A multilayer ceramic electronic component comprising: a multilayer body including a plurality of stacked ceramic layers, a first main surface and a second main surface opposite to each other, a first side surface and a second side surface opposite to each other in a stacking direction, and a first end surface and a second end surface opposite to each other, the first main surface or the second main surface defining and functioning as a mounting surface; first inner electrodes, which are located inside the multilayer body and a portion of each of which extends to only one surface of the first and second main surfaces on the first end surface side; second inner electrodes, which are located inside the multilayer body and a portion of each of which extends to only one surface of the first and second main surfaces on the second end surface side, at a location different from the locations of the first inner electrodes; a first outer electrode located on the first or second main surface and connected to the first inner electrodes; and a second outer electrode located on the first or second main surface and connected to the second inner electrodes; wherein the first outer electrode includes first outer electrode side surface portions located from the first or second main surface to a portion of each of the first side surface and the second side surface and a first outer electrode end surface portion located from the first or second main surface to a portion of the first end surface; the second outer electrode includes second outer electrode side surface portions located from the first or second main surface to a portion of each of the first side surface and the second side surface and a second outer electrode end surface portion located from the first or second main surface to a portion of the second end surface; and 1.40≤A/B≤3.33 is satisfied, where lengths of the first outer electrode side surface portions and the second outer electrode side surface portions in the direction in which the first main surface and the second main surface are connected are indicated as A and lengths of the first outer electrode end surface portion and the second outer electrode end surface portion in the direction in which the first main surface and the second main surface are connected are indicated as B. ### Claim 2 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the stacked ceramic layers include a dielectric material. ### Claim 3 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the stacked ceramic layers include a piezoelectric ceramic, and the multilayer ceramic electronic component defines and functions as a ceramic piezoelectric element. ### Claim 4 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the stacked ceramic layers include a semiconductor ceramic, and the multilayer ceramic electronic component defines and functions as a thermistor element. ### Claim 5 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the stacked ceramic layers include a magnetic ceramic, and the multilayer ceramic electronic component defines and functions as an inductor element. ### Claim 6 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein at least one gap is provided in the multilayer body between the first end surface and the second end surface. ### Claim 7 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the first outer electrode and the second outer electrode include an underlying electrode layer and a plating layer. ### Claim 8 (depends on 7) The multilayer ceramic electronic component according to claim 7, wherein the underlying electrode layer includes at least one of a baking layer, a resin layer, and a thin film layer. ### Claim 9 (depends on 7) The multilayer ceramic electronic component according to claim 7, wherein the plating layer includes a two-layer structure. ### Claim 10 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the multilayer body includes ceramic green sheets printed with predetermined patterns of electrically conductive paste. ### Claim 11 A multilayer ceramic electronic component comprising: a multilayer body including a plurality of stacked ceramic layers, a first main surface and a second main surface opposite to each other, a first side surface and a second side surface opposite to each other in a stacking direction, and a first end surface and a second end surface opposite to each other, the first main surface or the second main surface defining and functioning as a mounting surface; first inner electrodes, which are located inside the multilayer body and a portion of each of which extends to the first and second main surfaces on the first end surface side; second inner electrodes, which are located inside the multilayer body and a portion of each of which extends to the first and second main surfaces on the second end surface side, at locations different from the locations of the first inner electrodes; first outer electrodes located on the first and second main surfaces and connected to the first inner electrodes; and second outer electrodes located on the first and second main surfaces and connected to the second inner electrodes; wherein each of the first outer electrodes includes first outer electrode side surface portions located from the first or second main surface to a portion of each of the first side surface and the second side surface and a first outer electrode end surface portion located from the first or second main surface to a portion of the first end portion; each of the second outer electrodes includes second outer electrode side surface portions located from the first or second main surface to a portion of each of the first side surface and the second side surface and a second outer electrode end surface portion located from the first or second main surface to a portion of the second end surface; and 1.40≤A/B≤3.33 is satisfied, where lengths of the first outer electrode side surface portions and the second outer electrode side surface portions in the direction in which the first main surface and the second main surface are connected are indicated as A and lengths of the first outer electrode end surface portions and the second outer electrode end surface portions in the direction in which the first main surface and the second main surface are connected are indicated as B. ### Claim 12 (depends on 11) The multilayer ceramic electronic component according to claim 11, wherein the stacked ceramic layers include a dielectric material. ### Claim 13 (depends on 11) The multilayer ceramic electronic component according to claim 11, wherein the stacked ceramic layers include a piezoelectric ceramic, and the multilayer ceramic electronic component defines and functions as a ceramic piezoelectric element. ### Claim 14 (depends on 11) The multilayer ceramic electronic component according to claim 11, wherein the stacked ceramic layers include a semiconductor ceramic, and the multilayer ceramic electronic component defines and functions as a thermistor element. ### Claim 15 (depends on 11) The multilayer ceramic electronic component according to claim 11, wherein the stacked ceramic layers include a magnetic ceramic, and the multilayer ceramic electronic component defines and functions as an inductor element. ### Claim 16 (depends on 11) The multilayer ceramic electronic component according to claim 11, wherein at least one gap is provided in the multilayer body between the first end surface and the second end surface. ### Claim 17 (depends on 11) The multilayer ceramic electronic component according to claim 11, wherein the first outer electrode and the second outer electrode include an underlying electrode layer and a plating layer. ### Claim 18 (depends on 17) The multilayer ceramic electronic component according to claim 17, wherein the underlying electrode layer includes at least one of a baking layer, a resin layer, and a thin film layer.