# US 10,312,007 B2 · Inductor formed in substrate

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- Number: US 10,312,007 B2
- Document ID: US10312007B2
- Status: Granted
- Kind: B2
- Application number: 13/711,149
- Filed: 2012-12-11
- Published: 2014-06-12
- Granted: 2019-06-04
- Earliest claimed: 2012-12-11
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Mihir K Roy; Mathew J Manusharow; Harold Ryan Chase
- Web page: https://patentgrep.com/patent/US10312007B2

## CPC

- H01F 17/0013: {with stacked layers}
- H01F 2017/0066: {with a magnetic layer}
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

## Abstract

A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate.

## Claims

### Claim 1

A device comprising:
a first conductor formed on a first dielectric layer as a partial turn of a coil;
a second conductor formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil;
a vertical interconnect coupling the first and second conductors to form a first full turn of the coil;
an ultra-thin core supporting the dielectric layers and conductors on a first side of the ultra-thin core;
a single magnetic core disposed within the first full turn of the coil, wherein the magnetic core includes magnetic material dispersed in an epoxy resin, wherein the magnetic domains are aligned; and
a fine line formation on the first dielectric layer using fine solder balls to couple to a die.

### Claim 2 (depends on 1)

The device of claim 1 and further comprising two additional partial turn conductors on additional dielectric layers coupled to form a second full turn of the coil.

### Claim 3 (depends on 2)

The device of claim 2 wherein the magnetic core comprises high magnetic permittivity material particles dispersed in epoxy resin.

### Claim 4 (depends on 1)

The device of claim 1 wherein the conductors comprise copper traces.

### Claim 5 (depends on 1)

The device of claim 1 wherein the vertical interconnect comprises copper.

### Claim 6 (depends on 1)

The device of claim 1 wherein a second set of dielectric layers symmetric in number and thickness are supported on a second side of the ultra-thin core.

### Claim 7 (depends on 6)

The device of claim 6 and further comprising a core supporting the symmetric set of dielectric layers on a first side, and a second symmetric set of dielectric layers and conductors on a second side of the core.

### Claim 8 (depends on 6)

The device of claim 6 and further comprising a conductive vertical interconnect through multiple dielectric layers through the ultra-thin core.

### Claim 9

A device comprising:
a first copper conductor formed on a first dielectric layer as a partial turn of a coil;
a second copper conductor formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil;
a copper vertical interconnect coupling the first and second conductors to form a first full turn of the coil;
an ultra-thin core supporting the dielectric layers and conductors on a first side of the ultra-thin core;
a single magnetic core disposed within first full turn of the coil, wherein the magnetic core includes magnetic material dispersed in an epoxy resin, wherein the magnetic domains are aligned; and
a fine line formation on the first dielectric layer using fine solder balls to couple to a die.

### Claim 10 (depends on 9)

The device of claim 9 and further comprising two additional partial turn conductors on additional dielectric layers coupled to form a second full turn of the coil.

### Claim 11 (depends on 10)

The device of claim 10 wherein the magnetic core comprises high magnetic permittivity material particles dispersed in epoxy resin.