# US 10,311,597 B2 · Apparatus and method of determining a bonding position of a die > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,311,597 B2 - Document ID: US10311597B2 - Status: Granted - Kind: B2 - Application number: 15/611,910 - Filed: 2017-06-02 - Published: 2018-12-06 - Granted: 2019-06-04 - Earliest claimed: 2017-06-02 - Assignees: Asm Technology Singapore Pte Ltd - Applicants: ASM Technology Singapore Pte Ltd - Inventors: Kui Kam Lam; Shun Ming Fung; Chi Keung Leung; Wing Kin Lam; Yuet Cheung - Web page: https://patentgrep.com/patent/US10311597B2 ## CPC - G06T 7/73: using feature-based methods - G06T 2207/10004: Still image; Photographic image - G06T 2207/30148: Semiconductor; IC; Wafer - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ## Abstract The invention provides an apparatus for determining a bonding position of a die. The apparatus includes a bond head for picking up and bonding the die. The apparatus further includes a plurality of cameras positioned and configured for capturing at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. Further, the invention provides a method of determining a bonding position of a die. The method captures at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. The method further determines a bonding position of the die based on the captured images. ## Claims ### Claim 1 Apparatus for determining a bonding position of a die, the apparatus comprising: a bond head for picking up and bonding the die; a plurality of cameras positioned and configured for capturing images of side surfaces of the die between a top surface and a bottom surface of the die when the die is being held by the bond head, such images including at least a first image comprising a first side surface of the die, a second image comprising a second side surface of the die, and a third image comprising the first and second side surfaces of the die so as to determine the bonding position of the die based on the first image, the second image, and the third image. ### Claim 2 (depends on 1) The apparatus according to claim 1, further comprising a processor configured to receive the first image, the second image, and the third image, and to determine, according to the first, second and third images, the bonding position of the die. ### Claim 3 (depends on 1) The apparatus according to claim 1, wherein the plurality of cameras are positioned relative to each other so that optical axes of the plurality of cameras lie substantially on a horizontal plane. ### Claim 4 (depends on 1) The apparatus according to claim 1, wherein a first camera for capturing the first image and a second camera for capturing the second image are positioned relative to each other so that an optical axis of the first camera and an optical axis of the second camera are substantially perpendicular. ### Claim 5 (depends on 4) The apparatus according to claim 4, wherein the first camera, the second camera, and a third camera for capturing the third image are positioned relative to each other so that the third camera is positioned between the first camera and the second camera. ### Claim 6 (depends on 1) The apparatus according to claim 1, further comprising at least a light source for illuminating at least one side surface of the die. ### Claim 7 (depends on 6) The apparatus according to claim 6, wherein the second camera and the light source are positioned relative to each other so that the light source is positioned next to the second camera. ### Claim 8 (depends on 6) The apparatus according to claim 6, wherein the light source and the plurality of cameras are positioned relative to each other so that an optical axis of the light source and the optical axes of the plurality of cameras lie substantially on a horizontal plane. ### Claim 9 (depends on 6) The apparatus according to claim 6, wherein the second camera, the third camera and the light source are positioned relative to each other, so that an angle between the optical axis of the second camera and the optical axis of the third camera and an angle between the optical axis of the second camera and the optical axis of the light source are equal. ### Claim 10 (depends on 6) The apparatus according to claim 6, wherein the second camera, the third camera and the light source are positioned relative to each other, so that the optical axis of the second camera, the optical axis of the third camera, and the optical axis of the light source intersect at a point. ### Claim 11 (depends on 1) The apparatus according to claim 1, wherein the plurality of cameras and the bond head are positioned relative to each other, so that the optical axes of the plurality of cameras are substantially perpendicular to a longitudinal axis of the bond head. ### Claim 12 A method of determining a bonding position of a die, the method comprising: capturing images of side surfaces of the die between a top surface and a bottom surface of the die when the die is being held by the bond head, such images including at least a first image comprising a first side surface of the die, a second image comprising a second side surface of the die, and a third image comprising the first and second side surfaces of the die; and determining the bonding position of the die based on the first image, the second image, and the third image. ### Claim 13 (depends on 12) The method according to claim 12, wherein determining the bonding position of the die further comprises: determining a position of a first side edge and a position of a second side edge of the first side surface in the first image; determining a position of a third side edge and a position of a fourth side edge of the second side surface in the second image; and determining a position of the first side edge of the first side surface and a position of the second side edge of the first side surface in the third image or determining a position of the third side edge of the second side surface and a position of the fourth side edge of the second side surface in the third image. ### Claim 14 (depends on 13) The method according to claim 13, wherein determining the bonding position of the die further comprises determining positions of at least three edge points of the die at respective midpoint positions of a thickness of the die at the respective determined positions of the side edges. ### Claim 15 (depends on 12) The method according to claim 12, wherein capturing the first image is performed from a direction substantially perpendicular to a direction of capturing the second image. ### Claim 16 (depends on 12) The method according to claim 12, wherein capturing the third image is performed from a position between a position of capturing the first image and a position of capturing the second image. ### Claim 17 (depends on 12) The method according to claim 12, wherein the capturing and the determining are performed on-the-fly between a pick-up position and a place position of the die. ### Claim 18 (depends on 12) The method according to claim 12, wherein the determining of the bonding position is performed by an automated data processor based on the first image, the second image and the third image received by the automated data processor.