# US 10,310,686 B2 · Rigid trackpad for an electronic device

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- Number: US 10,310,686 B2
- Document ID: US10310686B2
- Status: Granted
- Kind: B2
- Application number: 15/411,733
- Filed: 2017-01-20
- Published: 2018-01-11
- Granted: 2019-06-04
- Earliest claimed: 2016-07-11
- Assignees: Apple Inc.
- Applicants: Apple Inc.
- Inventors: Kyle J. Nekimken; Scott J. McEuen; Forrest W. Liau; Joonas I. Ponkala; Sanjay C. Sheth; Alex J. Lehmann; Nathan N. Ng; Matthew B. Frazer
- Web page: https://patentgrep.com/patent/US10310686B2

## CPC

- G06F 1/169: {the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes (G06F1/1643 takes precedence; constructional details of pointing devices G06F3/033)}
- B32B 37/003: {to avoid air inclusion}
- B32B 37/10: characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B 37/1284: {Application of adhesive}
- G06F 3/0445: {using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer}
- G06F 3/0447: {Position sensing using the local deformation of sensor cells}
- B32B 2037/1253: {curable adhesive}
- B32B 2457/00: Electrical equipment
- G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
- G06F 2203/04105: Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

## Abstract

A laminated stack, such as a trackpad, is assembled by coupling components using an adhesive system. Assembly of the laminated stack includes forming an adhesive-spacing component on a first substrate, forming an adhesive-alignment-holding component on the first substrate in a perimeter around the adhesive-spacing component, forming a bonding component by filling an area within the perimeter with liquid adhesive, and bonding the first substrate to a second substrate by curing the bonding component. The first substrate and the second substrate may each be one of a touch-sensing component and a cover component. The adhesive-spacing component maintains a space between the first substrate and the second substrate while the bonding component cures. The adhesive-alignment-holding component maintains alignment of the first substrate and the second substrate while the bonding component cures.

## Claims

### Claim 1

A computing structure for an electronic device, comprising:
a cover;
a touch-sensing component positioned below the cover; and
an adhesive layer coupling the cover to the touch-sensing component, comprising:
an alignment-holding component defining a perimeter;
a spacing component positioned within the perimeter and formed from a cured liquid adhesive material; and
a bonding component filling a space within the perimeter around the spacing component, the bonding component bonding the cover to the touch-sensing component; wherein
the bonding component is formed from the liquid adhesive material; and
the cured liquid adhesive material has a higher stiffness than the alignment-holding component.

### Claim 2 (depends on 1)

The computing structure of claim 1, further comprising:
an additional adhesive layer bonded to the touch-sensing component; and
a stiffener coupled to the touch-sensing component by the additional adhesive layer.

### Claim 3 (depends on 2)

The computing structure of claim 2, wherein the cover and the stiffener are coupled to opposing surfaces of the touch-sensing component.

### Claim 4 (depends on 1)

The computing structure of claim 1, wherein the cured liquid adhesive and the spacing component are optically matched.

### Claim 5 (depends on 1)

The computing structure of claim 1, wherein the spacing component is one of an array of spacing components.

### Claim 6 (depends on 5)

The computing structure of claim 5, wherein the bonding component surrounds the array of spacing components.

### Claim 7 (depends on 1)

The computing structure of claim 1, wherein the spacing component and bonding component have equal thicknesses.

### Claim 8 (depends on 1)

The computing structure of claim 1, wherein the cover and the touch- sensing component are parallel to each other.

### Claim 9 (depends on 1)

The computing structure of claim 1, wherein the alignment-holding component is dielectrically matched to the liquid adhesive material.