# US 10,310,681 B2 · Translucent conductive film

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- Number: US 10,310,681 B2
- Document ID: US10310681B2
- Status: Granted
- Kind: B2
- Application number: 15/129,115
- Filed: 2015-03-25
- Published: 2017-05-04
- Granted: 2019-06-04
- Earliest claimed: 2014-03-26
- Assignees: Nitto Denko Corporation
- Applicants: Nitto Denko Corporation
- Inventors: Tomohiro Takeyasu; Ikuo Kawamoto; Hitoshi Morita; Akira Arima
- Web page: https://patentgrep.com/patent/US10310681B2

## CPC

- G06F 3/044: by capacitive means
- G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
- G06F 2203/04112: Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

A translucent conductive film includes a film substrate, a metal wiring layer provided as a pattern, and a colored layer. The film substrate has a plurality of protrusions on a surface at a side where the metal wiring layer is provided. The metal wiring layer has a line width of greater than 5 μm but less than 8 μm, and the metal wiring layer having a thickness of greater than or equal to 0.1 μm but less than 0.5 μm. The colored layer is provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer.

## Claims

### Claim 1

A translucent conductive film comprising:
a film substrate, a metal wiring layer provided as a pattern, and a colored layer,
the film substrate having a plurality of protrusions on a surface at a side where the metal wiring layer is provided,
the metal wiring layer having a line width of greater than 5 μm but less than 8 μm, and the metal wiring layer having a thickness of greater than or equal to 0.1 μm but less than 0.5 μm,
the colored layer being provided on a main surface of the metal wiring layer at a viewing side but not on a side surface of the metal wiring layer.

### Claim 2 (depends on 1)

The translucent conductive film according to claim 1, wherein the protrusion has an outer diameter of greater than 0 but less than or equal to 5 μm in a plan view of a surface of the film substrate at a side where the metal wiring layer is provided.

### Claim 3 (depends on 1)

The translucent conductive film according to claim 1, wherein the protrusion has a height of greater than 0 but less than 3 μm.

### Claim 4 (depends on 1)

The translucent conductive film according to claim 1, wherein the metal wiring layer has a flattened geometry, and a ratio of the line width to the thickness is 15 to 50.

### Claim 5 (depends on 1)

The translucent conductive film according to claim 1, wherein the metal wiring layer is provided in a mesh shape.

### Claim 6

A translucent conductive film comprising:
a film substrate having a plurality of protrusions on both surfaces thereof;
a first metal wiring layer provided over one of the surfaces of the film substrate;
a first colored layer provided on the first metal wiring layer;
a second colored layer provided over the other surface of the film substrate; and
a second metal wiring layer provided on the second colored layer,
each of the first and second metal wiring layers having a line width of greater than 5 μm but less than 8 μm, and a thickness of greater than or equal to 0.1 μm but less than 0.5 μm,
the first colored layer being laminated on a main surface of the first metal wiring layer at a side opposite to the film substrate but not provided on a side surface of the first metal wiring layer,
the second colored layer being laminated on a main surface of the second metal wiring layer on a film substrate side but not provided on a side surface of the second metal wiring layer.