# US 10,310,654 B2 · Input device having flexible circuit board

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- Number: US 10,310,654 B2
- Document ID: US10310654B2
- Status: Granted
- Kind: B2
- Application number: 15/809,168
- Filed: 2017-11-10
- Published: 2018-03-15
- Granted: 2019-06-04
- Earliest claimed: 2015-07-07
- Assignees: Alps Alpine Co., Ltd.
- Applicants: Alps Alpine Co., Ltd.
- Inventors: Junji Hashida; Toru Sawada; Yoshifumi Masumoto; Atsushi Matsuda; Toru Takahashi
- Web page: https://patentgrep.com/patent/US10310654B2

## CPC

- G06F 3/0445: {using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer}
- B32B 3/08: characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 15/04: comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)}
- B32B 15/092: comprising epoxy resins
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/08: of synthetic resin
- B32B 27/308: {comprising acrylic (co)polymers}
- B32B 27/365: {comprising polycarbonates}
- B32B 27/38: comprising epoxy resins
- G06F 3/0412: {Digitisers structurally integrated in a display}
- G06F 3/047: using sets of wires, e.g. crossed wires
- B32B 2250/44: Number of layers variable across the laminate
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/20: Inorganic coating
- B32B 2255/205: Metallic coating
- B32B 2255/26: Polymeric coating
- B32B 2307/422: Luminescent, fluorescent, phosphorescent
- B32B 2307/51: Elastic
- B32B 2307/546: Flexural strength; Flexion stiffness
- B32B 2307/706: Anisotropic
- B32B 2307/71: Resistive to light or to UV
- B32B 2457/00: Electrical equipment
- B32B 2457/08: PCBs, i.e. printed circuit boards
- B32B 2457/208: Touch screens
- G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
- G06F 2203/04112: Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

## Abstract

An input device includes a light-transmissive panel made of synthetic resin, an electrode layer, a decorative layer disposed on an inner surface of the panel, and an inner resin layer disposed on a surface of the decorative layer. The inner resin layer has a connection pattern on a surface thereof. The connection pattern is in electrical communication with the electrode layer. The input device further includes a flexible printed circuit board joined to the surface of the inner resin layer by thermocompression bonding.

## Claims

### Claim 1

An input device comprising:
a panel made of a light-transmissive material, the panel having a light-transmissive area and a light-shielding area;
an electrode layer formed of a light-transmissive material, the electrode layer being disposed on an inner surface of the panel in the light-transmissive area;
a decorative layer formed of a non-light-transmissive material, the decorative layer being disposed on the inner surface of the panel in the light-shielding area;
an inner resin layer disposed on a surface of the decorative layer;
a conductive connection pattern formed on the inner resin layer, the conductive connection pattern being in electrical communication with the electrode layer; and
a flexible printed circuit board overlapping and facing the inner resin layer, the flexible printed circuit board having a wiring pattern formed thereon, the wiring pattern facing and being connected to the conductive connection pattern,
wherein the inner resin layer is formed of a resin material having a softening temperature higher than that of a resin material of which the decorative layer is formed.

### Claim 2 (depends on 1)

The input device according to claim 1, wherein the flexible printed circuit board is attached to the inner resin layer by thermocompression bonding.

### Claim 3 (depends on 1)

The input device according to claim 1, wherein the inner resin layer is formed of a resin material having a modulus of elasticity higher than that of a resin material of which the decorative layer is formed.

### Claim 4 (depends on 1)

The input device according to claim 1, wherein the decorative layer is formed of an acrylic resin and the inner resin layer is formed of an epoxy resin.

### Claim 5 (depends on 1)

The input device according to claim 1, wherein an end of the inner resin layer disposed on the decorative layer forms a step with respect to the surface of the decorative layer, the input device further comprising:
an auxiliary resin layer disposed at the end of the inner resin layer so as to smoothen the step.

### Claim 6 (depends on 1)

The input device according to claim 1, wherein the inner resin layer includes a plurality of sublayers stacked such that an end of an upper sublayer of the inner resin layer is misaligned with an end of a lower sublayer of the inner resin layer.

### Claim 7 (depends on 1)

The input device according to claim 1, wherein the panel is formed of a synthetic resin.
