# US 10,310,643 B2 · Touch panel and junction structure of touch panel and flexible printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,310,643 B2 - Document ID: US10310643B2 - Status: Granted - Kind: B2 - Application number: 15/466,449 - Filed: 2017-03-22 - Published: 2017-10-05 - Granted: 2019-06-04 - Earliest claimed: 2016-03-31 - Assignees: Dongwoo Fine-Chem Co., Ltd. - Applicants: Dongwoo Fine-Chem Co., Ltd. - Inventors: Han Sub Ryu; Yong Soo Park; Euk Kun Yoon - Web page: https://patentgrep.com/patent/US10310643B2 ## CPC - G06F 3/04164: {Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads} - G06F 3/041: Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means - G06F 3/0446: {using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/189: characterised by the use of flexible or folded printed circuits - G06F 2203/04102: Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper - H05K 3/361: {Assembling flexible printed circuits with other printed circuits} - H05K 2201/0108: Transparent - H05K 2201/09436: Pads or lands on permanent coating which covers the other conductors - H05K 2201/09472: Recessed pad for surface mounting; Recessed electrode of component - H05K 2201/10136: Liquid Crystal display [LCD] - H05K 2201/10151: Sensor - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A touch panel includes: an adhesive layer formed on a base film; a protective layer formed on the adhesive layer; a touch sensor portion formed on the protective layer; a bonding pad portion comprising a plurality of unit bonding pads formed on the protective layer as electrically connected to the touch sensor portion; and a first insulating layer formed on the protective layer to extend from a unit bonding pad while filling separation regions between the unit bonding pads. Since the deformations in the elements of the touch panel during the process of bonding the touch panel and the flexible printed circuit board are prevented, there are effects that the degradation in the performance of the touch panel is prevented, and the structural stability of the junction structure of the touch panel and the flexible printed circuit board is secured. ## Claims ### Claim 1 A touch panel comprising: an adhesive layer formed on a base film; a protective layer formed on the adhesive layer; a touch sensor portion formed on the protective layer; a bonding pad portion comprising a plurality of unit bonding pads formed on the protective layer as electrically connected to the touch sensor portion; and a first insulating layer formed on the protective layer to extend from the unit bonding pads while filling separation regions between the unit bonding pads, wherein the unit bonding pad comprises a plurality of insulating columns having a height corresponding to the first insulating layer or an insulating pattern portion having a height corresponding to the first insulating layer and formed with a plurality of holes. ### Claim 2 (depends on 1) The touch panel according to claim 1, wherein the unit bonding pad comprises: a transparent conductive layer formed on the insulating columns. ### Claim 3 (depends on 1) The touch panel according to claim 1, wherein the unit bonding pad comprises: a transparent conductive layer formed in the holes and the insulating pattern portion. ### Claim 4 (depends on 1) The touch panel according to claim 1, wherein a height difference between the unit bonding pads and the first insulating layer is substantially same as a height of the transparent conductive layer. ### Claim 5 (depends on 1) The touch panel according to claim 1, wherein the first insulating layer and the insulating columns constituting the unit bonding pads are formed through a same process. ### Claim 6 (depends on 1) The touch panel according to claim 1, wherein an entire area of the unit bonding pads and a partial area of the first insulating layer extended from the unit bonding pads are a bonding region to where a flexible printed circuit board (FPCB) is bonded. ### Claim 7 (depends on 1) The touch panel according to claim 1, wherein an entire area of the unit bonding pads and a partial area of the first insulating layer extended from the unit bonding pads are bonded to a flexible printed circuit board with an anisotropic conductive film (ACF) or an anisotropic conductive material layer as an intermediate. ### Claim 8 (depends on 1) The touch panel according to claim 1, further comprising a second insulating layer formed at a periphery of the first insulating layer to be spaced apart from the unit bonding pads. ### Claim 9 A junction structure of a touch panel and a flexible printed circuit board comprising a touch panel, a flexible printed circuit board (FPCB) and a bonding portion for bonding the touch panel and the flexible printed circuit board, wherein the touch panel comprises: an adhesive layer formed on a base film; a protective layer formed on the adhesive layer; a touch sensor portion formed on the protective layer; a bonding pad portion comprising a plurality of unit bonding pads formed on the protective layer while it is electrically connected to the touch sensor portion; and a first insulating layer formed on the protective layer to extend from the unit bonding pads filling gaps between the unit bonding pads, wherein the flexible printed circuit board is bonded to the bonding pad portion of the touch panel with the bonding portion as an intermediate, wherein the unit bonding pad comprises a plurality of insulating columns having a height corresponding to the first insulating layer or an insulating pattern portion having a height corresponding to the first insulating layer and formed with a plurality of holes. ### Claim 10 (depends on 9) The junction structure of a touch panel and a flexible printed circuit board according to claim 9, wherein the unit bonding pad comprises: a transparent conductive layer formed on the insulating columns. ### Claim 11 (depends on 9) The junction structure of a touch panel and a flexible printed circuit board according to claim 9, wherein the unit bonding pad comprises: a transparent conductive layer formed in the holes and the insulating pattern portion. ### Claim 12 (depends on 9) The junction structure of a touch panel and a flexible printed circuit board according to claim 9, wherein a height difference between the unit bonding pads and the first insulating layer is substantially same as a thickness of the transparent conductive layer. ### Claim 13 (depends on 9) The junction structure of a touch panel and a flexible printed circuit board according to claim 9, wherein the first insulating layer and the insulating columns included in the unit bonding pads are formed through a same process. ### Claim 14 (depends on 9) The junction structure of a touch panel and a flexible printed circuit board according to claim 9, wherein an entire area of the unit bonding pads and a partial area of the first insulating layer extended from the unit bonding pads are bonded to the flexible printed circuit board with the bonding portion as an intermediate. ### Claim 15 (depends on 9) The junction structure of a touch panel and a flexible printed circuit board according to claim 9, wherein the bonding portion comprises an anisotropic conductive film (ACF) or an anisotropic conductive material layer. ### Claim 16 (depends on 9) The junction structure of a touch panel and a flexible printed circuit board according to claim 9, further comprising a second insulating layer formed at a periphery of the first insulating layer to be spaced apart from the unit bonding pads.