# US 10,310,574 B1 · Electronic apparatus with heat-dissipation system and heat-dissipation device thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,310,574 B1 - Document ID: US10310574B1 - Status: Granted - Kind: B1 - Application number: 15/868,872 - Filed: 2018-01-11 - Published: 2019-06-06 - Granted: 2019-06-04 - Earliest claimed: 2017-12-01 - Assignees: Wistron Corporation - Applicants: Wistron Corp. - Inventors: Ying Tzu Chou; Chien-Chung Chang; Te-Lung Wu - Web page: https://patentgrep.com/patent/US10310574B1 ## CPC - G06F 1/206: {comprising thermal management} - F28F 3/02: Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) - G06F 1/20: Cooling means - H05K 7/20154: {Heat dissipaters coupled to components} - H05K 7/20172: {Fan mounting or fan specifications} - H05K 7/20209: {Thermal management, e.g. fan control} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/20727: {within server blades for removing heat from heat source} - H10W 40/43: by flowing gases, e.g. forced air cooling - F28F 5/00: Elements specially adapted for movement - F28F 2215/14: in the form of movable or loose fins - H05K 7/20836: {Thermal management, e.g. server temperature control} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic apparatus with a heat-dissipation system includes a heat-dissipation device including a base, a heat-dissipation structure rotatably disposed on the bottom base, and a drive mechanism configured to selectively rotate the heat-dissipation structure toward one of a plurality of predetermined orientations. ## Claims ### Claim 1 A heat-dissipation device configured to be disposed in an electronic apparatus, wherein the heat-dissipation device comprises: a bottom base; a heat-dissipation structure comprising: a heat-dissipation base rotatably disposed on the bottom base; and a plurality of heat-dissipation fins disposed on the heat-dissipation base; and a driving mechanism configured to selectively rotate the heat-dissipation structure to one of a plurality of predetermined orientations, wherein the driving mechanism comprises: a first connection element connected to the heat-dissipation structure; a first magnetic element disposed on the first connection element; a first electromagnet adjacent to the first magnetic element, and configured to generate a first magnetic field; a second connection element pivoted on the first connection element; a second magnetic element disposed on the second connection element; and a second electromagnet adjacent to the second magnetic element, and configured to generate a second magnetic field, wherein the heat-dissipation structure is rotated to one of the predetermined orientations by changing strengths of the first magnetic field and the second magnetic field. ### Claim 2 An electronic apparatus with a heat-dissipation system, comprising: a housing; a heat-dissipation device comprising: a bottom base located in the housing; a heat-dissipation structure rotatably disposed on the bottom base; and a driving mechanism configured to rotate the heat-dissipation structure; a fan disposed in the housing, and configured to generate an airflow passing through the heat-dissipation structure; a plurality of sensors disposed in the housing, and configured to generate a plurality of sensing signals; and a processing device selectively rotating the heat-dissipation structure to one of the predetermined orientations according to the sensing signals, so as to enhance the intensity of the airflow passing through the heat-dissipation structure, wherein the driving mechanism comprises: a first connection element connected to the heat-dissipation structure; a first magnetic element disposed on the first connection element; a first electromagnet adjacent to the first magnetic element, and configured to generate a first magnetic field; a second connection element pivoted on the first connection element; a second magnetic element disposed on the second connection element; and a second electromagnet adjacent to the second magnetic element, and configured to generate a second magnetic field, wherein the heat-dissipation structure is rotated to one of the predetermined orientations by changing strengths of the first magnetic field and the second magnetic field. ### Claim 3 (depends on 2) The electronic apparatus as claimed in claim 2, wherein at least one of the sensors is located between the heat-dissipation structure and the fan. ### Claim 4 (depends on 2) The electronic apparatus as claimed in claim 2, wherein the heat-dissipation structure is located between the fan and the sensors. ### Claim 5 (depends on 4) The electronic apparatus as claimed in claim 4, further comprising a plurality of heat sources disposed in the housing, wherein the sensors are located between the heat sources and the heat-dissipation structure, and adjacent to the heat sources or integrated in the heat sources, wherein the processing device is configured to selectively rotate the heat-dissipation structure to one of the predetermined orientations according to the sensing signals, so as to enhance the intensity of the airflow toward to one of the heat sources. ### Claim 6 An electronic apparatus with a heat-dissipation system, comprising: a housing; a heat-dissipation device comprising: a bottom base located in the housing; a heat-dissipation structure rotatably disposed on the bottom base; and a driving mechanism configured to rotate the heat-dissipation structure; a plurality of fans disposed in the housing, and configured to generate an airflow passing through the heat-dissipation structure; and a processing device configured to detect an operation condition of the fans, and generating an operation signal, wherein the processing device controls the driving mechanism to make the heat-dissipation structure rotate to a predetermined orientation according to the operation signal, wherein the driving mechanism comprises: a first connection element connected to the heat-dissipation structure; a first magnetic element disposed on the first connection element; a first electromagnet adjacent to the first magnetic element, and configured to generate a first magnetic field; a second connection element pivoted on the first connection element; a second magnetic element disposed on the second connection element; and a second electromagnet adjacent to the second magnetic element, and configured to generate a second magnetic field, wherein the heat-dissipation structure is rotated to one of the predetermined orientations by changing strengths of the first magnetic field and the second magnetic field.