# US 10,309,988 B2 · Probe guide plate and probe device

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- Number: US 10,309,988 B2
- Document ID: US10309988B2
- Status: Granted
- Kind: B2
- Application number: 15/407,427
- Filed: 2017-01-17
- Published: 2017-07-20
- Granted: 2019-06-04
- Earliest claimed: 2016-01-18
- Assignees: Shinko Electric Industries Co., Ltd.; Japan Electronic Materials Corporation
- Applicants: Shinko Electric Industries Co., Ltd.; Japan Electronic Materials Corporation
- Inventors: Yuichiro Shimizu; Kosuke Fujihara; Katsunori Yamagishi; Koji Nagai
- Web page: https://patentgrep.com/patent/US10309988B2

## CPC

- G01R 1/07371: {using an intermediate card or back card with apertures through which the probes pass}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

A probe guide plate includes a first silicon substrate, a first recess portion formed in an upper surface of the first silicon substrate, first through-holes formed in the first silicon substrate at a bottom of the first recess portion, a second silicon substrate directly bonded on the first silicon substrate, a second recess portion formed to face the first recess portion in a lower surface of the second silicon substrate, and second through-holes formed in the second silicon substrate at a bottom of the second recess portion and arranged to correspond to the first through-holes, A notch portion is formed at an upper end portion of an inner wall of each of the first through-holes of the first silicon substrate.

## Claims

### Claim 1

A probe guide plate comprising:
a first silicon substrate;
a first recess portion formed in an upper surface of the first silicon substrate;
first through-holes formed in the first silicon substrate at a bottom of the first recess portion;
a second silicon substrate directly bonded on the first silicon substrate without another material;
a second recess portion formed to face the first recess portion in a lower surface of the second silicon substrate; and
second through-holes formed in the second silicon substrate at a bottom of the second recess portion and arranged to correspond to the first through-holes,
wherein a first notch portion is formed at an upper end portion of an inner wall of each of the first through-holes of the first silicon substrate, and a second notch portion is formed at a lower end portion of an inner wall of each of the second through-holes of the second silicon substrate,
wherein an upper end of each first notch portion is disposed at a boundary between a bottom of the first recess portion and a corresponding first through-hole, and a lower end of each second notch portion is disposed at a boundary between a top of the second recess portion and a corresponding second through-hole,
wherein the first notch portion has a tapered shape and is inclined so that a height thereof gradually decreases as a distance in a width direction of the probe guide plate from the upper end of the first notch portion increases, the width direction being a direction that spans the first through-holes,
wherein the second notch portion has a tapered shape and is inclined so that a height thereof gradually increases as the distance in the width direction of the probe guide plate from the lower end of the second notch portion increases.

### Claim 2 (depends on 1)

The probe guide plate according to claim 1, wherein the first through-holes and the second through-holes are arranged with being misaligned, as seen from above.

### Claim 3 (depends on 2)

The probe guide plate according to claim 2, wherein a width from an upper end to a lower end of each first notch portion and from a lower end to an upper end of each second notch portion is set to be equal to or greater than a positional deviation amount between the first through-hole and the second through-hole.

### Claim 4 (depends on 1)

The probe guide plate according to claim 1, wherein a peripheral edge portion of the probe guide plate is formed with a screwing hole penetrating therethrough, and
wherein an inner wall of the screwing hole has a step surface to which a head of a fixing screw is to be contacted.

### Claim 5

A probe device comprising:
a probe guide plate comprising
a first silicon substrate,
a first recess portion formed in an upper surface of the first silicon substrate,
first through-holes formed in the first silicon substrate at a bottom of the first recess portion,
a first notch portion formed at an upper end portion of an inner wall of each of the first through-holes,
a second silicon substrate directly bonded on the first silicon substrate without another material;
a second recess portion formed to face the first recess portion in a lower surface of the second silicon substrate,
second through-holes formed in the second silicon substrate at a bottom of the second recess portion and arranged to correspond to the first through-holes, and
a second notch portion formed at a lower end portion of an inner wall of each of the second through-holes,
wherein an upper end of each first notch portion is disposed at a boundary between a bottom of the first recess portion and a corresponding first through-hole, and a lower end of each second notch portion is disposed at a boundary between a top of the second recess portion and a corresponding second through-hole,
wherein the first notch portion has a tapered shape and is inclined so that a height thereof gradually decreases as a distance in a width direction of the probe guide plate from the upper end of the first notch portion increases, the width direction being a direction that spans the first through-holes,
wherein the second notch portion has a tapered shape and is inclined so that a height thereof gradually increases as the distance in the width direction of the probe guide plate from the lower end of the second notch portion increases; and
probe terminals inserted into the first through-holes from the second through-holes of the probe guide plate.