# US 10,309,919 B2 · Moisture detection and ingression monitoring systems and methods of manufacture > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,309,919 B2 - Document ID: US10309919B2 - Status: Granted - Kind: B2 - Application number: 16/107,544 - Filed: 2018-08-21 - Published: 2018-12-13 - Granted: 2019-06-04 - Earliest claimed: 2015-05-07 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Fen Chen; Jeffrey P. Gambino; Carole D. Graas; Wen Liu; Prakash Periasamy - Web page: https://patentgrep.com/patent/US10309919B2 ## CPC - G01N 27/223: {for determining moisture content, e.g. humidity (rain detectors on vehicle windows B60S1/0825)} - G01D 5/2405: {by varying dielectric} - G01R 27/2605: {Measuring capacitance (capacitive sensors G01D5/24)} - G01D 5/24: by varying capacitance - H03K 17/955: using a capacitive detector - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) ## Abstract Moisture detection and ingression monitoring systems and methods of manufacture are provided. The moisture detection structure includes chip edge sealing structures including at least one electrode forming a capacitor structured to detect moisture ingress within an integrated circuit. The at least one electrode and a second electrode of the capacitor is biased to ground and to a moisture detection circuit or vice versa, respectively. ## Claims ### Claim 1 A moisture detection structure comprising a guardring structure and a crackstop structure extending vertically through an edge of the chip and at least one electrode electrically connected to either the guardring structure or the crackstop structure which forms a capacitor with a second electrode to detect moisture ingress within an integrated circuit, wherein the guardring structure and the crackstop structure comprise metal features extending vertically through multiple wiring and insulator layers along the edge of the chip. ### Claim 2 (depends on 1) The structure of claim 1, wherein the at least one electrode and the second electrode of the capacitor are biased to ground. ### Claim 3 (depends on 1) The structure of claim 1, wherein the at least one electrode and the second electrode of the capacitor are connected to a moisture detection circuit. ### Claim 4 (depends on 1) The structure of claim 1, wherein the at least one electrode and the second electrode of the capacitor are biased to ground and to a moisture detection circuit. ### Claim 5 (depends on 1) The structure of claim 1, wherein the capacitor is structured to provide moisture sensing capability for real-time 360 degree on chip moisture detection. ### Claim 6 (depends on 1) The structure of claim 1, wherein the guardring structure and the crackstop structure comprise an chip edge sealing structures. ### Claim 7 (depends on 6) The structure of claim 6, wherein: the chip edge sealing structures comprise the guardring structure with the at least one electrode and the second electrode; and the at least one electrode is biased to ground and the second electrode is electrically connected to the moisture detection circuit. ### Claim 8 (depends on 6) The structure of claim 6, wherein the chip edge sealing structures comprises the guardring ring structure with the one electrode extending from a predetermined wiring layer and the second electrode forming the capacitor is one of a solder bump or ball limiting metallurgy. ### Claim 9 (depends on 8) The structure of claim 8, wherein either of the one electrode and the second electrode is biased to ground and the other of the one electrode and the second electrode is electrically connected to the moisture detection circuit. ### Claim 10 (depends on 6) The structure of claim 6, wherein the chip edge sealing structures comprise the crackstop structure with the one electrode extending from a predetermined wiring layer and further comprising the second electrode which is separated therefrom by a gap provided between the one electrode and the second electrode. ### Claim 11 (depends on 10) The structure of claim 10, wherein either of the one electrode and the second electrode is biased to ground and the other of the one electrode and the second electrode is electrically connected to the moisture detection circuit. ### Claim 12 (depends on 6) The structure of claim 6, wherein the chip edge sealing structures comprise the crackstop structure with the one electrode extending from a predetermined wiring layer and further comprising the second electrode extending from a capacitor plate, which is separated therefrom by a gap provided between the one electrode and the second electrode. ### Claim 13 (depends on 12) The structure of claim 12, wherein either of the one electrode and the second electrode is biased to ground and the other of the one electrode and the second electrode is electrically connected to the moisture detection circuit.