# US 10,309,837 B2 · Measuring device, in particular for use in the process measurement technology, comprising a cylindrical sensor tip

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,309,837 B2
- Document ID: US10309837B2
- Status: Granted
- Kind: B2
- Application number: 14/889,998
- Filed: 2014-05-12
- Published: 2016-04-14
- Granted: 2019-06-04
- Earliest claimed: 2013-05-14
- Assignees: Ifm Electronic GmbH
- Applicants: Ifm Electronic GmbH
- Inventors: Sebastian Liehr; Stephan Reichart; Walter Reichart
- Web page: https://patentgrep.com/patent/US10309837B2

## CPC

- G01K 1/16: Special arrangements for conducting heat from the object to the sensitive element
- B23K 1/0008: {specially adapted for particular articles or work}
- G01K 7/16: using resistive elements
- G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00)
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM

## Abstract

A measuring device, in particular for use in the process measurement technology, including a cylindrical sensor tip which includes a closed housing, a sensor element disposed within the housing in the form of a temperature dependent resistor and for generating a sensor signal, and electronic components, which are connected to the sensor element via electrical connecting lines and/or a conductor film, wherein said sensor element is thermally connected to the housing by means of a solder and a heat conducting, electrically insulating layer is disposed between the sensor element and the solder is provided.

## Claims

### Claim 1

A measuring device, for use in the process measurement technology, comprising:
a cylindrical sensor tip which comprises a closed housing, a sensor element disposed within the housing in the form of a temperature dependent resistor and for generating a sensor signal, and electronic components, which are connected to the sensor element via electrical connecting lines and/or a conductor film,
wherein the sensor element is thermally connected to the housing by means of a solder and a heat conducting, electrically insulating layer is disposed between the sensor element and the solder,
wherein,
the housing has a step-like recess which is not penetrating the housing; and
the thermally conductive, electrically insulating layer is configured as a ceramic substrate that covers the recess and rests on an inside of the housing at opposite sides of the recess,
wherein the recess is disposed at the inside of the housing and is adapted to receive the solder, via which the sensor element is thermally connected to the housing, and wherein the solder distributes itself with the same thickness in the recess so that in the region of the recess between the housing wall and the ceramic substrate and hence also between the housing wall and the sensor element a defined distance is established.

### Claim 2 (depends on 1)

The measuring device according to claim 1, wherein the step-like recess is formed by reducing the wall thickness of the housing.

### Claim 3 (depends on 1)

The measuring device according to claim 1, wherein the step-like recess is formed by a forming process, in particular by deep drawing.

### Claim 4 (depends on 1)

The measuring device according to claim 1, wherein the step-like recess is formed by an annular body resting on the inside of the housing.

### Claim 5 (depends on 1)

The measuring device according to claim 1, wherein the recess has a depth in the range of 100-500 μm, preferably 100-300 μm, particularly preferably 150 μm.

### Claim 6 (depends on 1)

The measuring device according to claim 1, wherein the step-like recess of the housing is disposed at the end face of its distal end.