# US 10,309,587 B2 · Light emitting diode component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,309,587 B2 - Document ID: US10309587B2 - Status: Granted - Kind: B2 - Application number: 13/886,878 - Filed: 2013-05-03 - Published: 2014-11-06 - Granted: 2019-06-04 - Earliest claimed: 2002-08-30 - Assignees: GE Lighting Solutions, LLC - Applicants: Srinath K. Aanegola; Emil V. Radkov; James Reginelli; Larry R. Stadelman; Matthew Mrakovich; Tomislav J. Stimac; Stanton Earl Weaver, Jr.; Thomas F. Soules - Inventors: Srinath K. Aanegola; Emil V. Radkov; James Reginelli; Larry R. Stadelman; Matthew Mrakovich; Tomislav J. Stimac; Stanton Earl Weaver, Jr.; Thomas F. Soules - Web page: https://patentgrep.com/patent/US10309587B2 ## CPC - F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer - F21K 9/68: Details of reflectors forming part of the light source - F21V 13/08: the elements being filters or photoluminescent elements and reflectors - H10H 20/8515: {not being in contact with the bodies} - H10H 20/855: Optical field-shaping means, e.g. lenses - F21Y 2105/10: comprising a two-dimensional [2D] array of point-like light-generating elements - F21Y 2115/10: Light-emitting diodes [LED] - H10H 20/841: Reflective coatings, e.g. dielectric Bragg reflectors - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient} - H10H 20/856: Reflecting means - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board. ## Claims ### Claim 1 A white light emitting lighting apparatus comprising: at least one light emitting diode (LED) chip; at least one luminescent element comprising a light transparent body including at least one phosphor layer or a phosphor inclusive light transparent body that is arcuate in at least one dimension and defines a hollow interior volume, said phosphor performing wavelength conversion of light emitted by the LED chip, the luminescent element spaced from the LED chip by a distance at least 2 times the length of a longest side of the LED chip, wherein the phosphor layer or the phosphor inclusive light transparent body defines a surface area at least 10 times as large as the exposed surface area of light absorbing components of the LED chip; and a common reflective support on which both the LED chip and the luminescent element are mounted, wherein internal surfaces of the support and the luminescent element are phosphor coated except the LED chip. ### Claim 2 (depends on 1) The lighting apparatus according to claim 1, wherein the luminescent element is a hemispheric shape, and wherein the LED chip is sealed between the common reflective surface and the luminescent element. ### Claim 3 (depends on 2) The lighting apparatus according to claim 2, wherein the LED chip is disposed at the center of the luminescent element. ### Claim 4 (depends on 1) The lighting apparatus according to claim 1, further including: a submount or substrate of the LED chip, the submount or substrate mounted on the common reflective support and disposed between the common reflective support and the LED chip. ### Claim 5 (depends on 1) The lighting apparatus according to claim 1, wherein the common reflective support is planar. ### Claim 6 (depends on 1) The lighting apparatus according to claim 1, wherein the common reflective support includes a heat sink for the LED chip. ### Claim 7 (depends on 1) The lighting apparatus according to claim 1, wherein the common reflective support comprises a reflector cup including sidewalls, the LED chip disposed in the reflector cup. ### Claim 8 (depends on 1) The lighting apparatus according to claim 1, comprising multiple layers of phosphor and wherein at least two layers are comprised of different phosphor compositions. ### Claim 9 (depends on 1) The lighting apparatus according to claim 1, wherein the luminescent element is comprised of glass or crystalline. ### Claim 10 (depends on 1) The lighting apparatus of claim 1, wherein said phosphor layer is disposed on at least one of an interior or exterior surface of the luminescent element. ### Claim 11 (depends on 1) The lighting apparatus of claim 1, wherein said phosphor layer is of substantially uniform thickness. ### Claim 12 (depends on 1) The lighting apparatus of claim 1 wherein said light transmissive element is tube-shaped. ### Claim 13 (depends on 1) The lighting apparatus of claim 1 consisting of a plurality of UV or blue emitting LED chips and wherein each LED chip is spaced at all locations from the luminescent element by a distance of at least two times the length of the longest side of one of the LED chips. ### Claim 14 (depends on 4) The lighting apparatus of claim 4 wherein said substrate is comprised of silicon carbide or alumina and said lighting apparatus has a package efficiency of at least about 98%. ### Claim 15 (depends on 14) The lighting apparatus of claim 14 wherein said substrate comprises alumina. ### Claim 16 (depends on 4) The lighting apparatus of claim 4 having a power consumption of less than about 3.9 milliwatts per lumen.