# US 10,309,015 B2 · Substrate treating apparatus and substrate treating method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,309,015 B2 - Document ID: US10309015B2 - Status: Granted - Kind: B2 - Application number: 15/641,594 - Filed: 2017-07-05 - Published: 2018-07-19 - Granted: 2019-06-04 - Earliest claimed: 2017-01-17 - Assignees: Psk Inc. - Applicants: Psk Inc. - Inventors: Sung Gu Ji - Web page: https://patentgrep.com/patent/US10309015B2 ## CPC - C23C 16/50: using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)} - C23C 16/4412: {Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps} - C23C 16/4558: {Perforated rings} - C23C 16/45587: {Mechanical means for changing the gas flow} - C23C 16/4585: {Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds} - C23C 16/507: using external electrodes, e.g. in tunnel type reactors - H01J 37/321: {the radio frequency energy being inductively coupled to the plasma} - H01J 37/32357: {Generation remote from the workpiece, e.g. down-stream} - H01J 37/3244: {Gas supply means} - H01J 37/32834: {Exhausting} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a process chamber, a substrate support unit configured to support a substrate in the process chamber, a gas supply unit configured to supply a process gas into the process chamber, and an exhaust adjusting unit configured to adjust a discharge amount of the process gas and residual gases in the process chamber, wherein the exhaust adjusting unit includes a ring-shaped first exhaust ring provided on a side of the substrate support unit and having a plurality of exhaust holes, a ring-shaped second exhaust ring provided below the first exhaust ring and having a plurality of exhaust holes, and an adjustment part configured to adjust relative locations of the plurality of exhaust holes provided in the second exhaust ring with respect to the plurality of exhaust holes provided in the first exhaust ring. ## Claims ### Claim 1 A substrate treating apparatus comprising: a process chamber; a substrate support unit configured to support a substrate in the process chamber; a gas supply unit configured to supply a process gas into the process chamber; and an exhaust adjusting unit configured to adjust a discharge amount of the process gas and residual gases in the process chamber, wherein the exhaust adjusting unit comprises: a ring-shaped first exhaust ring provided on a side of the substrate support unit and having a plurality of exhaust holes; a ring-shaped second exhaust ring provided below the ring-shaped first exhaust ring and having a plurality of exhaust holes; and an adjustment part configured to adjust relative locations of the plurality of exhaust holes provided in the ring-shaped second exhaust ring with respect to the plurality of exhaust holes provided in the ring-shaped first exhaust ring, wherein the plurality of exhaust holes of the ring-shaped first exhaust ring have shapes corresponding to the plurality of exhaust holes of the ring-shaped second exhaust ring, wherein the adjustment part comprises a rotary member connected to the ring-shaped second exhaust ring to rotate the ring-shaped second exhaust ring, and wherein the rotary member comprises: a support member connected to lower surfaces of opposite ends of the ring-shaped second exhaust ring; a support plate connected to the support member and having a ring shape corresponding to the ring-shaped second exhaust ring; and a driving unit configured to rotate the support plate. ### Claim 2 (depends on 1) The substrate treating apparatus of claim 1, wherein the exhaust adjusting unit further comprises a storage part configured to store a correspondence of alignment states of the exhaust holes of the ring-shaped first exhaust ring and the ring-shaped second exhaust ring according to a substrate treating process progress degree, and wherein the adjustment part adjusts relative locations of the plurality of exhaust holes provided in the ring-shaped second exhaust ring with respect to the plurality of exhaust holes provided in the ring-shaped first exhaust ring, based on the correspondence of the alignment states of the exhaust holes according to the substrate treating process progress degree. ### Claim 3 (depends on 1) The substrate treating apparatus of claim 1, wherein the support plate has a gear at a side end thereof, and wherein the driving unit comprises: a driving gear enmeshed with the gear; a motor configured to provide driving power for rotating the driving gear; and a connection member configured to transmit the driving power generated by the motor to the driving gear. ### Claim 4 (depends on 1) The substrate treating apparatus of claim 1, wherein the rotary member comprises: a disk-shaped driving plate provided on an outside of the support plate; and a belt surrounding outer peripheral surfaces of the support plate and the disk-shaped driving plate, and wherein the driving unit comprises: a motor configured to drive the disk-shaped driving plate; and a connection member configured to transmit driving power generated by the motor to the disk-shaped driving plate. ### Claim 5 (depends on 1) The substrate treating apparatus of claim 1, further comprising: a plasma generating unit configured to generate plasma supplied to the substrate. ### Claim 6 (depends on 1) A method for treating a substrate by using the substrate treating apparatus of claim 1, the method comprising: loading a substrate in a process chamber; treating the substrate for a first treatment time by adjusting arrangement state of exhaust holes of a first exhaust ring and a second exhaust ring to a first alignment state; changing the first alignment state to a second alignment state; treating the substrate for a second treatment time in the second alignment state; and extracting the substrate.