# US 10,308,845 B2 · Adhesive tape featuring adhesive with continuous polymer phase > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,308,845 B2 - Document ID: US10308845B2 - Status: Granted - Kind: B2 - Application number: 15/138,414 - Filed: 2016-04-26 - Published: 2016-11-10 - Granted: 2019-06-04 - Earliest claimed: 2015-05-05 - Assignees: Tesa SE - Applicants: Tesa SE - Inventors: Christian Schuh; Klaus Keite-Telgenbüscher; Chris Gäbert; Minyoung Bai - Web page: https://patentgrep.com/patent/US10308845B2 ## CPC - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - C08L 33/06: of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical - C08L 75/04: Polyurethanes - C09J 7/38: Pressure-sensitive adhesives [PSA] - C09J 163/04: Epoxynovolacs - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) ## Abstract An adhesive tape containing an adhesive comprising at least one polymer optionally a tackifier resin at least one reactive resin, the adhesive comprising at least 104 parts of the at least one reactive resin per 100 parts of polymer and tackifier resin at least one initiator and/or curing agent and/or accelerator where the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive. ## Claims ### Claim 1 Adhesive tape containing an adhesive comprising at least one polymer selected from the group consisting of acrylonitrile-butadiene rubbers, poly(ethylene oxide), poly(ethylene terephthalate), poly(carbonates), poly(phenylene oxides), poly(urethanes), poly(ureas), poly(amides) (PA), poly(lactate) (PLA), poly(etheretherketone) (PEEK), poly(sulphone) (PSU) and poly(ethersulphone) (PES) optionally a tackifier resin at least one epoxy resin, the adhesive comprising at least 104 parts of the at least one epoxy resin per 100 parts of polymer and tackifier resin at least one initiator and/or curing agent and/or accelerator wherein said at least one polymer is per se not pressure-sensitively adhesive, but the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive, and the at least one epoxy resin is a solid having a softening temperature of at least 45° C., or has a viscosity at 25° C. of at least 20 Pa s. ### Claim 2 (depends on 1) Adhesive tape according to claim 1, wherein the adhesive comprises at least 120 parts of reactive resin per 100 parts of polymer. ### Claim 3 (depends on 1) Adhesive tape according to claim 1, wherein at least one epoxy resin is present as reactive resin. ### Claim 4 (depends on 3) Adhesive tape according to claim 3, wherein said at least one epoxy resin is based on bisphenol A, bisphenol S, bisphenol F, an epoxy novolak, an epoxy-cresol novolak or an epoxidized nitrile rubber. ### Claim 5 (depends on 1) Adhesive tape according to claim 1, wherein the at least one polymer is an elastomer or a thermoplastic. ### Claim 6 (depends on 1) Adhesive tape according to claim 1, wherein the at least one epoxy resin is present at least partly in homogeneous solution in the continuous polymer phase. ### Claim 7 (depends on 1) Adhesive tape according to claim 1, wherein said at least one polymer is selected from the group consisting of polyurethanes, nitrile-butadiene rubbers, polyamides, poly(etheretherketone) (PEEK), poly(sulphone) (PSU), and poly(ethersulphone) (PES). ### Claim 8 (depends on 1) Adhesive tape according to claim 1, wherein the short-term temperature resistance of the uncured adhesive tape is greater than 35° C. ### Claim 9 (depends on 3) Adhesive tape according to claim 3, wherein at least one of the at least one epoxy resin has on average more than two epoxide groups per molecule. ### Claim 10 (depends on 1) Adhesive tape according to claim 1, wherein the peel adhesion of the uncured pressure sensitive adhesive on steel is at least 1 N/cm. ### Claim 11 (depends on 1) Adhesive tape according to claim 1, wherein the bond strength, measured by dynamic shearing test, on steel is at least 5 MPa. ### Claim 12 (depends on 1) Adhesive tape according to claim 1, wherein said at least one polymer is a polyurethane, and wherein the polyurethane is semicrystalline and in the DSC measurement has a melting peak or crystallization peak which corresponds to an enthalpy of fusion of at least 5 J/g. ### Claim 13 (depends on 1) Adhesive tape according to claim 1, wherein the at least one polymer is chemically crosslinked after coating and before use. ### Claim 14 (depends on 13) Adhesive tape according to claim 13, wherein the chemical crosslinking takes place with radiation induction or via the addition of a crosslinking agent, optionally with addition of a polyfunctional alcohol or amine having a molar weight <10 000 g/mol. ### Claim 15 (depends on 1) Adhesive tape according to claim 1, present without carrier as an adhesive transfer tape. ### Claim 16 (depends on 1) A method for the permanent joining of two substrates, wherein said two substrates are joined by an adhesive tape of claim 1. ### Claim 17 (depends on 1) Method for the adhesive bonding of oiled substrates, wherein said oiled substrates are bonded with an adhesive tape of claim 1. ### Claim 18 (depends on 17) Method for producing a solvent-based pressure sensitive adhesive tape of claim 17, wherein the adhesive of the tape is produced by a process comprising the steps of: dissolving the at least one polymer in a non-aqueous solvent; adding the at least one reactive resin; cooling to room temperature; adding the curing agent and optionally the accelerator with shearing, in order to achieve effective dispersing; adding optional additives, rheology modifiers, foaming agents, fillers, adhesion promoters. ### Claim 19 (depends on 1) Method for producing a solvent-free pressure sensitive adhesive tape of claim 1, wherein the adhesive of the tape is produced by a process comprising the steps of melting the at least one polymer; metering in the at least one reactive resin; cooling the melt to below 100° C.; metering in and mixing in the curing agent and optionally the accelerator; extruding thin layers with a thickness of 50 μm to 3000 μm.