Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same

An organic electronic device, comprising:

• a substrate;
• an organic electronic element formed on the substrate;
• and
• a crosslinked pressure-sensitive adhesive film encapsulating the organic electronic element,
• wherein the pressure-sensitive adhesive film comprises a pressure-sensitive adhesive layer including a crosslinked pressure-sensitive adhesive composition,
• wherein the pressure-sensitive adhesive composition comprises an encapsulating resin and a multifunctional active energy ray-polymerizable compound,
• wherein the encapsulating resin is a butyl rubber, wherein the multifunctional active energy ray-polymerizable compound satisfies following formula:
• where R1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or more, and X is a residue induced from a linear, branched, or cyclic alkyl group having 3 to 30 carbon atoms, wherein the multifunctional active energy ray polymerizable compound is included at 5 to 18 parts by weight relative to 100 parts by weight of the encapsulating resin, and
• wherein the pressure-sensitive adhesive composition has a gel content represented by Equation 1 of 50% or more, a micro gel content represented by Equation 2 of 3% or less, and a water vapor transmission rate in a thickness direction while being formed in a film of 50 g/m2·day or less, wherein the water vapor transmission rate is measured according to a specification of ASTM F1249:
• Gel content (wt %)=B/A×100 [Equation 1]
• Micro gel content (wt %)=C/A×100 [Equation 2]
• wherein in Equations 1 and 2, A is a mass of the pressure-sensitive adhesive composition,
• in Equation 1, B is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours and filtered through a 200-mesh sieve (pore size of 200 μm), and
• in Equation 2, C is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours, primarily filtered through a 200-mesh sieve (pore size:
• 200 μm), and secondarily filtered through a 1000-mesh sieve (pore size:
• 5 μm).