# US 10,308,841 B2 · Process and apparatus for detaching a display module bonded by a liquid optically clear adhesive

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- Number: US 10,308,841 B2
- Document ID: US10308841B2
- Status: Granted
- Kind: B2
- Application number: 15/313,268
- Filed: 2014-05-30
- Published: 2017-06-29
- Granted: 2019-06-04
- Earliest claimed: 2014-05-30
- Assignees: Henkel AG & Co. KGaA
- Applicants: Henkel AG & Co. KGaA
- Inventors: Eugen Bilcai; Steven Dufresne
- Web page: https://patentgrep.com/patent/US10308841B2

## CPC

- C09J 5/06: involving heating of the applied adhesive
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 27/06: as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)}
- B32B 43/006: {Delaminating}
- B32B 2307/42: Polarizing, birefringent, filtering
- B32B 2315/08: Glass
- B32B 2457/20: Displays, e.g. liquid crystal displays, plasma displays
- B32B 2457/202: LCD, i.e. liquid crystal displays
- B32B 2457/208: Touch screens
- C09J 2301/416: use of irradiation
- C09J 2301/502: process for debonding adherents
- G02F 2203/68: Green display, e.g. recycling, reduction of harmful substances
- Y10S 156/922: Specified electronic component delaminating in preparation for recycling
- Y10S 156/937: Means for delaminating specified electronic component in preparation for recycling
- Y10T 156/1153: Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T 156/1158: Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
- Y10T 156/1911: Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
- Y10T 156/1917: Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention relates to a process for detaching a component from an electronic assembly. In particular, the present invention relates to a process for detaching a component bonded with a liquid optically clear adhesive (LOCA) in a display module by using electromagnetic radiation (EMR).

## Claims

### Claim 1

A process for detaching a component from an electronic assembly, comprising the steps of:
(a) providing an apparatus for generating electromagnetic radiation;
providing the electronic assembly comprising an outer component bonded to an inner component by an optically clear adhesive;
(b) transmitting electromagnetic radiation at a first intensity for a first time from the apparatus through the outer component to the adhesive;
(c) heating the adhesive by transmission of the first intensity of the electromagnetic radiation to increase the temperature of the adhesive to about 50° C. to about 100° C.;
(d) after the adhesive has been heated to the temperature of about 50° C. to about 100° C., transmitting electromagnetic radiation at a second intensity for a second time from the apparatus to the adhesive to maintain the adhesive at a temperature of about 50° C. to about 100° C., wherein the second intensity is lower than the first intensity;
(e) cooling the adhesive; and thereafter
(f) detaching the components from the electronic assembly.

### Claim 2 (depends on 1)

The process according to claim 1, wherein step (e) of cooling comprises cooling the adhesive for 10 to 30 seconds.

### Claim 3 (depends on 1)

The process according to claim 1, wherein the inner component is selected from a liquid crystal display, an organic light-emitting diode display, a plasma display, a light-emitting diode display, an electrophoretic display, and a cathode ray tube display.

### Claim 4 (depends on 1)

The process according to claim 1, wherein the wavelength of the transmitted electromagnetic radiation is from 420 nm to about 650 nm.

### Claim 5 (depends on 1)

The process according to claim 1, wherein the first and second intensity of the transmitted electromagnetic radiation is from 0.05 W/cm2 to 5 W/cm2.

### Claim 6 (depends on 1)

The process according to claim 1, wherein the duration of the electromagnetic radiation is from 1 second to 180 seconds.

### Claim 7 (depends on 1)

The process according to claim 1, wherein the inner component has a diagonal length from 1 inch to 30 inches.

### Claim 8 (depends on 1)

The process according to claim 1, wherein the apparatus for generating electromagnetic radiation is selected from a high intensity continuously emitting system, an electroluminescent lamp, an incandescent lamp, a metal halide lamp, LED lamp, high-pressure mercury lamp, Xenon lamp, Xenon flash lamp, and an array of light emitting diodes.

### Claim 9 (depends on 1)

The process according to claim 1, wherein the apparatus for generating electromagnetic radiation is an array of light emitting diodes.

### Claim 10

A process for detaching a component from an electronic assembly, comprising the steps of:
(a) providing an apparatus for generating electromagnetic radiation;
providing the electronic assembly comprising an outer component bonded to an inner component by an optically clear adhesive;
(b) transmitting electromagnetic radiation at a first intensity for a first time from the apparatus through the outer component to the adhesive;
(c) heating the adhesive by transmission of the first intensity of the electromagnetic radiation to increase the temperature of the adhesive to about 50° C. to about 100° C.;
(d) after the adhesive has been heated to the temperature of about 50° C. to about 100° C., transmitting electromagnetic radiation at a second intensity for a second time from the apparatus to the adhesive to maintain the adhesive at a temperature of about 50° C. to about 100° C., wherein the second intensity is lower than the first intensity;
(e) transmitting electromagnetic radiation at a third intensity for a third time from the apparatus to the adhesive followed by transmitting electromagnetic radiation at a fourth intensity for a fourth time from the apparatus to the adhesive; wherein the third intensity is higher than the fourth intensity and both the third intensity and the fourth intensity are lower than the first intensity; and
(f) detaching the components from the electronic assembly.