# US 10,308,808 B2 · Organic silicone resin composition and pre-preg, laminate, copper-clad laminate, and aluminum substrate that use the composition

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- Number: US 10,308,808 B2
- Document ID: US10308808B2
- Status: Granted
- Kind: B2
- Application number: 15/539,467
- Filed: 2015-06-01
- Published: 2017-12-07
- Granted: 2019-06-04
- Earliest claimed: 2014-12-25
- Assignees: Shengyi Technology Co., Ltd.
- Applicants: Shengyi Technology Co., Ltd.
- Inventors: Suwen Ye; Guofang Tang
- Web page: https://patentgrep.com/patent/US10308808B2

## CPC

- C08L 83/06: containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence)
- B32B 27/04: as impregnant, bonding, or embedding substance {(not used)}
- B32B 38/08: Impregnating
- C08G 77/08: characterised by the catalysts used
- C08G 77/16: to hydroxy groups
- C08G 77/18: to alkoxy or aryloxy groups
- C08G 77/80: {Siloxanes having aromatic substituents, e.g. phenyl side groups}
- C08J 5/244: {using glass fibres}
- C08J 5/249: {characterised by the additives used in the prepolymer mixture}
- C08K 3/013: Fillers, pigments or reinforcing additives
- C08K 3/22: of metals
- C08K 3/36: Silica
- C08K 5/098: Metal salts of carboxylic acids
- C08K 5/5435: containing oxygen in a ring
- C08L 83/04: Polysiloxanes
- C09D 183/06: containing silicon bound to oxygen-containing groups (C09D183/12 takes precedence)
- H05K 1/036: {Multilayers with layers of different types}
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- B32B 2307/304: Insulating
- B32B 2307/3065: Flame resistant or retardant, fire resistant or retardant
- C08K 2003/2227: {of aluminium}
- H05K 2201/0162: Silicon containing polymer, e.g. silicone
- H05K 2201/0358: Resin coated copper [RCC]
- H05K 2201/068: wherein the coefficient of thermal expansion is important
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.

## Claims

### Claim 1

An aluminum-based copper-clad laminate comprising a copper foil layer and an aluminum-based layer with an insulation layer being coated between the copper foil layer and the aluminum-based layer, wherein the insulation layer is prepared from an organosilicone resin composition, wherein the organosilicone resin composition comprises in parts by weight: 100 parts of a condensation type silicone resin; 0.0001-2 parts of a catalyst; and 0.001-10 parts of an adjuvant, and
wherein the condensation type silicone resin is any one selected from the group consisting of a methyl silicone resin, a methylphenyl silicone resin and a phenyl silicone resin with R/Si=1.2-1.7 (molar ratio) and Ph/(Me+Ph)=0.2-0.6 (molar ratio), or a mixture of at least two selected therefrom, wherein Ph represents a phenyl group, Me represents a methyl group, and R represents an organic functional group selected from —CH3, -Ph, —OCH3, —OCH2CH3, —H or —OH.

### Claim 2 (depends on 1)

The aluminum-based copper-clad laminate according to claim 1, wherein the condensation type silicone resin is any one selected from the group consisting of a methyl silicone resin, a methylphenyl silicone resin, and a phenyl silicone resin, or a mixture of at least two selected therefrom.

### Claim 3 (depends on 1)

The aluminum-based copper-clad laminate of claim 1, wherein the catalyst is any one selected from the group consisting of zinc naphthenate, tin naphthenate, cobalt naphthenate, iron naphthenate, cerium naphthenate, zinc carboxylate, tin carboxylate, cobalt carboxylate, iron carboxylate, cerium carboxylate, perfluorosulfonic acid, phosphonitrilic chloride, amines, quaternary ammonium bases, zinc caprylate, zinc isooctanoate, titanates and guanidine compounds, or a combination of at least two selected therefrom.

### Claim 4 (depends on 1)

The aluminum-based copper-clad laminate of claim 1, wherein the organosilicone resin composition further comprises a filler.

### Claim 5 (depends on 4)

The aluminum-based copper-clad laminate of claim 4, wherein the filler comprises any one selected from the group consisting of silica, alumina, aluminum hydroxide, boron nitride, aluminum nitride, barium sulfate, mica powder, zinc borate, titanium dioxide, talc powder, silicon nitride and silicon carbide, or a mixture of at least two selected therefrom.

### Claim 6 (depends on 4)

The aluminum-based copper-clad laminate of claim 4, wherein the content of the filler is greater than 0 to 60 parts by weight.

### Claim 7 (depends on 1)

The aluminum-based copper-clad laminate of claim 1, wherein the organosilicone resin composition comprises in parts by weight: 100 parts of a condensation type silicone resin; 0.0001-2.0 parts of a catalyst; 0.001-10 parts of an adjuvant; and 0-60 parts of a filler.

### Claim 8 (depends on 1)

The aluminum-based copper-clad laminate of claim 1, wherein the adjuvant comprises any one selected from the group consisting of a silane coupling agent, a titanate coupling agent, and a dispersant, or a mixture of at least two selected therefrom.

### Claim 9 (depends on 1)

The aluminum-based copper-clad laminate of claim 1, wherein the organosilicone resin composition comprises in parts by weight: 100 parts of a condensation type silicone resin; 0.0005-1.5 parts of a catalyst; 0.005-5 parts of an adjuvant; and 0-50 parts of a filler.