# US 10,308,806 B2 · Resin composition and uses thereof in high frequency circuit boards

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,308,806 B2
- Document ID: US10308806B2
- Status: Granted
- Kind: B2
- Application number: 15/027,365
- Filed: 2014-08-11
- Published: 2016-08-25
- Granted: 2019-06-04
- Earliest claimed: 2014-05-06
- Assignees: Shengyi Technology Co., Ltd.
- Applicants: Shengyi Technology Co., Ltd.
- Inventors: Guangbing Chen; Xianping Zeng
- Web page: https://patentgrep.com/patent/US10308806B2

## CPC

- C08L 71/126: {modified by chemical after-treatment}
- B32B 15/08: of synthetic resin
- B32B 27/04: as impregnant, bonding, or embedding substance {(not used)}
- C08J 5/244: {using glass fibres}
- C08J 5/249: {characterised by the additives used in the prepolymer mixture}
- C08L 71/12: Polyphenylene oxides
- C09D 171/12: Polyphenylene oxides
- H05K 1/03: Use of materials for the substrate
- H05K 1/038: {Textiles (used as reinforcing materials for organic insulating substrates H05K1/0366)}
- C08J 2371/12: Polyphenylene oxides
- C08J 2483/04: Polysiloxanes
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The present invention discloses a resin composition, comprising an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit). The present invention further discloses a high-frequency circuit substrate prepared from the aforesaid resin composition and the uses of the aforesaid resin composition in the art. The high frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interstratified adhesive force, a low dielectric constant and a low dielectric loss tangent, and are very suitable as the circuit substrates of high frequency electronic equipments.

## Claims

### Claim 1

A resin composition wherein the resin composition comprises an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit).

### Claim 2 (depends on 1)

The resin composition according to claim 1, wherein the modified polyphenylether resin has the following structure,
wherein 1≤x≤100; 1≤y≤100; 2≤x+y≤100; and M is selected from the group consisting of:
wherein N is any one selected from the group consisting of —O—, —CO—, SO, —SC—, —SO2— and —C(CH3)2—; R2, R4, R6, R8, R11, R13, R15 and R17 are each independently selected from the group consisting of: substituted or unsubstituted C1-C8 linear chain alkyl group, substituted or unsubstituted C1-C8 branched chain alkyl group and substituted or unsubstituted phenyl; R1, R3, R5, R7, R10, R12, R14 and R16 are all any one independently selected from the group consisting of hydrogen atom, substituted or unsubstituted C1-C8 linear chain alkyl group, substituted or unsubstituted C1-C8 branched chain alkyl group and substituted or unsubstituted phenyl; R9 is selected from the group consisting of:
wherein A is selected from the group consisting of arylene, carbonyl, or alkylene having 1-10 carbon atoms; Z is an integer from 0-10; R21, R22 and R23 are all independently a hydrogen atom or alkyl having 1-10 carbon atoms.

### Claim 3 (depends on 1)

The resin composition according to claim 1 wherein the modified polyphenylether resin has a number-average molecular weight of about 500-10,000 g/mol.

### Claim 4 (depends on 1)

The resin composition according to claim 1, wherein MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit) is a compound represented by the following general formula:
(Z1Z2Z3SiO1/2)x(SiO4/2)y
wherein 1≤x≤100; 1≤y≤100; 2≤x+y≤200; and 0.01≤x/y≤10; at least one of Z1, Z2 and Z3 is a group containing unsaturated double bond, and the other two are independently selected from the group consisting of: substituted or unsubstituted C1-C8 linear chain alkyl group, substituted or unsubstituted C1-C8 branched chain alkyl group and substituted or unsubstituted phenyl.

### Claim 5 (depends on 1)

The resin composition according to claim 1, wherein the resin composition further comprises a radical initiator.

### Claim 6 (depends on 5)

The resin composition according to claim 5, wherein the radical initiator is selected from organic peroxide initiator.

### Claim 7 (depends on 6)

The resin composition according to claim 6, wherein the organic peroxide initiator is any one or a mixture of at least two selected from the group consisting of dicumyl peroxide, dibenzoyl peroxide, tert-butyl peroxybenzoate, and n-butyl 4,4-bis(tert-butyl peroxy)-valerate.

### Claim 8 (depends on 1)

The resin composition according to claim 1, wherein the resin composition further comprises a flame retardant.

### Claim 9 (depends on 8)

The resin composition according to claim 8, wherein flame retardant is one or a mixture of at least two selected from the group consisting of a bromine-based flame retardant, a phosphorus-based flame retardant and a nitrogen-based flame retardant.

### Claim 10 (depends on 9)

The resin composition according to claim 9, wherein the bromine-based flame retardant is one or a mixture of at least two selected from the group consisting of decabromodiphenyl ether, hexabromo benzene, decabromodiphenyl ethane and ethylene bis(tetrabromophthalimide).

### Claim 11 (depends on 9)

The resin composition according to claim 9, wherein the phosphorus-based flame retardant is tris(2,4,6-trimethylphenyl)phosphine and/or 10-(2,5-dihydroxylphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.

### Claim 12 (depends on 9)

The resin composition according to claim 9, wherein the nitrogen-based flame retardant is one or a mixture of at least two selected from the group consisting of melamine, melamine phosphate, guanidine phosphate, guanidine carbonate or guanidine sulfamate.

### Claim 13 (depends on 1)

The resin composition according to claim 1, wherein the resin composition further comprises a powder filler.

### Claim 14 (depends on 13)

The resin composition according to claim 13, characterized in that the powder filler is one or a mixture of at least two selected from the group consisting of crystalline silica, amorphous silica, spherical silica, molten silica, titania, silicon carbide, glass fiber, alumina, aluminum nitride, boron nitride, barium titanate or strontium titanate.

### Claim 15 (depends on 1)

The resin composition according to claim 1, wherein the resin composition comprises from about 10 to about 100 parts by weight of MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit), based on 100 parts by weight of the modified polyphenylether resin.

### Claim 16 (depends on 15)

The resin composition according to claim 15, wherein the resin composition comprises from about 1 to about 3 parts by weight of a radical initiator and from about 5 to about 40 parts by weight of a flame retardant, based on 100 parts by weight of the total weight of the modified polyphenylether resin and MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit).

### Claim 17 (depends on 16)

The resin composition according to claim 16, wherein the resin composition comprises from about 10 to about 150 parts by weight of a powder filler, based on 100 parts by weight of the total weight of the modified polyphenylether resin and MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit).

### Claim 18 (depends on 1)

A resin varnish, characterized in that the resin varnish is obtained by dissolving or dispersing the resin composition according claim 1 in a solvent.

### Claim 19 (depends on 18)

A prepreg, wherein the prepreg is obtained by impregnating a glass fiber cloth with the resin varnish in claim 18 and drying.

### Claim 20 (depends on 19)

The prepreg according to claim 19, wherein the prepreg comprises from about 50 to about 230 parts by weight of a glass fiber cloth, based on 100 parts by weight of the total weight of the modified polyphenylether resin, MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit), flame retardant and powder filler.