# US 10,308,787 B2 · Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device

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- Number: US 10,308,787 B2
- Document ID: US10308787B2
- Status: Granted
- Kind: B2
- Application number: 15/466,270
- Filed: 2017-03-22
- Published: 2017-10-05
- Granted: 2019-06-04
- Earliest claimed: 2016-04-05
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Kazunori Kondo; Yoichiro Ichioka; Michihiro Sugo
- Web page: https://patentgrep.com/patent/US10308787B2

## CPC

- C08K 3/36: Silica
- C08G 59/3281: {containing silicon}
- C08G 59/4215: {cycloaliphatic}
- C08G 59/5073: {having two nitrogen atoms in the ring}
- C08G 59/621: {Phenols}
- C08J 5/18: Manufacture of films or sheets
- C08L 83/10: Block- or graft-copolymers containing polysiloxane sequences (obtained by polymerising a compound having a carbon-to-carbon double bond on to a polysiloxane C08L51/08, C08L53/00)
- C08L 83/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C08L83/10 takes precedence)
- C09D 183/10: Block or graft copolymers containing polysiloxane sequences (obtained by polymerising a compound having a carbon-to-carbon double bond on to a polysiloxane C09D151/08, C09D153/00)
- C09D 183/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09D183/10 takes precedence)
- C09J 183/04: Polysiloxanes
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10W 74/476: {Organic materials comprising silicon}
- C08G 77/14: containing silicon bound to oxygen-containing groups
- C08G 77/455: containing polyamide, polyesteramide or polyimide sequences
- C08G 77/52: containing aromatic rings
- C08J 2383/04: Polysiloxanes
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7422: {used to protect an active side of a device or wafer}
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000, (B) an epoxy resin-curing agent; and (C) a filler. This can provide a resin composition and a resin film that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection performance, good adhesion properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably. The present invention also provides a method for producing the resin film, a semiconductor device molded with the resin film, and a method for producing the semiconductor device.

## Claims

### Claim 1

A resin composition comprising:
(A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000,
wherein R1 to R4 each independently represent a monovalent hydrocarbon group having 1 to 8 carbon atoms, with the proviso that the both of R3 and R4 are not methyl groups at the same time; “m” and “n” are each independently an integer of 0 to 300; the both of “a” and “b” are positive numbers satisfying a+b=1; each of “X” independently represents a linking group selected from the divalent groups shown by the following general formulae (2), (3), (4), and (5), and the molar numbers of units shown by said general formulae (2), (3), (4), and (5) contained in the silicone resin (A) are defined as “c”, “d”, “e”, and “f” respectively, “e” is a positive number, each of “c”, “d”, and “f” is 0 or a positive number satisfying c+d+e+f/the molar number of the linking group shown by “X” contained in the silicone resin (A)=1, and having a ratio to “e” in a range of c+d=1 to 10 and f=0 to 1 when the “e” is assumed to be 1;
wherein “V” is a divalent organic group selected from the following
“p” is 0 or 1, R5 represents a hydrogen atom or a methyl group, “g” is an integer of 0 to 7, R6 and R7 each independently represent the same or different group selected from alkyl groups and alkoxy groups having 1 to 4 carbon atoms, and “h” is any of 0, 1, and 2,
wherein R8 represents a hydrogen atom or a methyl group, and “q” is an integer of 0 to 7,
wherein “Y” is a divalent group selected from the following
wherein “R” each independently represent a hydrogen atom or a methyl group, and R9 and R10 each independently represent a hydrogen atom or a methyl group,
wherein R12 and R13 each independently represent a monovalent hydrocarbon group having 1 to 8 carbon atoms, with the proviso that the both of R12 and R13 are not methyl groups at the same time, “r” and “s” are each independently an integer of 0 to 300, R11 represents a hydrogen atom or a methyl group, and “k” is an integer of 0 to 7;
(B) an epoxy resin-curing agent; and
(C) a filler.

### Claim 2 (depends on 1)

The resin composition according to claim 1, wherein the “Y” is a divalent group selected from the following
in the general formula (4).

### Claim 3 (depends on 1)

The resin composition according to claim 1, wherein the component (B) is any of an amine-based epoxy resin-curing agent, a phenol-based epoxy resin-curing agent, and an acid anhydride-based epoxy resin-curing agent.

### Claim 4 (depends on 2)

The resin composition according to claim 2, wherein the component (B) is any of an amine-based epoxy resin-curing agent, a phenol-based epoxy resin-curing agent, and an acid anhydride-based epoxy resin-curing agent.

### Claim 5 (depends on 1)

The resin composition according to claim 1, wherein the amount of the component (B) is 5 to 50 parts by mass based on 100 parts by mass of the component (A), and the mass fraction of the component (C) is 50 to 95% by mass based on the total mass.

### Claim 6 (depends on 2)

The resin composition according to claim 2, wherein the amount of the component (B) is 5 to 50 parts by mass based on 100 parts by mass of the component (A), and the mass fraction of the component (C) is 50 to 95% by mass based on the total mass.

### Claim 7 (depends on 3)

The resin composition according to claim 3, wherein the amount of the component (B) is 5 to 50 parts by mass based on 100 parts by mass of the component (A), and the mass fraction of the component (C) is 50 to 95% by mass based on the total mass.

### Claim 8 (depends on 4)

The resin composition according to claim 4, wherein the amount of the component (B) is 5 to 50 parts by mass based on 100 parts by mass of the component (A), and the mass fraction of the component (C) is 50 to 95% by mass based on the total mass.

### Claim 9 (depends on 1)

The resin composition according to claim 1, further comprising an epoxy resin-curing accelerator.

### Claim 10 (depends on 1)

The resin composition according to claim 1, further comprising an epoxy resin other than the component (A).

### Claim 11 (depends on 1)

The resin composition according to claim 1, wherein the component (C) is silica.

### Claim 12 (depends on 2)

The resin composition according to claim 2, wherein the component (C) is silica.

### Claim 13 (depends on 1)

A resin film made from the resin composition according to claim 1.

### Claim 14 (depends on 2)

A resin film made from the resin composition according to claim 2.

### Claim 15 (depends on 1)

A method for producing a resin film comprising:
coating a delamination film with the resin composition according to claim 1 to produce two or more resin-formed films each having a resin composition layer on the delamination film, and
superimposing the resin composition layers of the two or more resin-formed films with each other.

### Claim 16 (depends on 2)

A method for producing a resin film comprising:
coating a delamination film with the resin composition according to claim 2 to produce two or more resin-formed films each having a resin composition layer on the delamination film, and
superimposing the resin composition layers of the two or more resin-formed films with each other.

### Claim 17 (depends on 15)

The method for producing a resin film according to claim 15,
wherein at least one of the resin-formed films has a protective film for protecting the resin composition layer in such a way that the resin composition layer and the protective film are successively formed on the delamination film, and
the superimposing of the resin composition layers of the resin-formed films is performed such that the protective film or the delamination film is removed from each of the resin-formed films so as to expose the resin composition layer to be laminated with each other, and the exposed resin composition layers are superimposed with each other.

### Claim 18 (depends on 13)

A method for producing a semiconductor device, comprising the steps of:
adhering the resin film according to claim 13 to a semiconductor wafer to mold the semiconductor wafer with the resin film, and
dividing the molded semiconductor wafer into individual pieces.

### Claim 19 (depends on 13)

A semiconductor device, wherein the device is a division piece of a semiconductor wafer molded with a heat cured film of the resin film according to claim 13.