# US 10,308,786 B2 · Power inductor and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,308,786 B2 - Document ID: US10308786B2 - Status: Granted - Kind: B2 - Application number: 15/509,852 - Filed: 2015-04-27 - Published: 2017-09-07 - Granted: 2019-06-04 - Earliest claimed: 2014-09-11 - Assignees: Moda-Innochips Co., Ltd. - Applicants: Moda-Innochips Co., Ltd. - Inventors: In Kil Park; Gyeong Tae Kim; Seung Hun Cho; Jun Ho Jung; Ki Joung Nam; Jung Gyu Lee - Web page: https://patentgrep.com/patent/US10308786B2 ## CPC - C09K 5/14: Solid materials, e.g. powdery or granular - B22F 1/102: Metallic powder coated with organic material - B22F 1/16: Metallic particles coated with a non-metal (coated with lubricating or binding agents or with organic material B22F1/10) - B22F 3/02: Compacting only - B29C 43/02: of articles of definite length, i.e. discrete articles {(B29C35/0227 takes precedence)} - B29C 65/002: {Joining methods not otherwise provided for} - C08K 3/04: Carbon - C08K 3/08: Metals - C08K 3/22: of metals - C08K 3/28: Nitrogen-containing compounds - C23C 18/1637: {metallic substrate} - C23C 18/1653: {Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating} - C25D 7/123: {Semiconductors first coated with a seed layer or a conductive layer} - H01F 17/0013: {with stacked layers} - H01F 17/04: with magnetic core - H01F 27/008: {with temperature compensation} - H01F 27/292: {Surface mounted devices} - H01F 27/34: Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields - H01F 41/0233: {Manufacturing of magnetic circuits made from sheets (magnetic cores made from sheets H01F27/245; soft magnetic alloys in the form of sheets H01F1/16)} - H01F 41/041: {Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00)} - H01F 41/10: Connecting leads to windings (making electric connections in general H01R43/00) - H05K 1/181: associated with surface mounted components - B22F 2301/35: Iron - B22F 2302/25: Oxide - B22F 2302/45: Others, including non-metals - B29L 2031/34: Electrical apparatus, e.g. sparking plugs or parts thereof - C08K 2003/0856: {Iron} - C08K 2003/222: {Magnesia, i.e. magnesium oxide} - C08K 2003/282: {Binary compounds of nitrogen with aluminium} - C08K 2201/001: Conductive additives - C08K 2201/01: Magnetic additives - H01F 27/22: Cooling by heat conduction through solid or powdered fillings - H01F 27/2809: {on stacked layers} - H01F 2017/048: {with encapsulating core, e.g. made of resin and magnetic powder} - H05K 2201/1003: Non-printed inductor - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract Provided are a power inductor including a body, a base disposed in the body, a coil disposed on the base, a first external electrode connected to the coil, the first external electrode being disposed on a side surface of the body, and a second external electrode connected to the first external electrode, the second external electrode being disposed on a bottom surface of the body and a method for manufacturing the same. ## Claims ### Claim 1 A power inductor, comprising: a body having first, second, third and fourth external surfaces, wherein the third external surface is between the first and second external surfaces, wherein the first external surface is opposite the second external surface and wherein the third external surface is opposite the fourth external surface; a base disposed in the body; a coil disposed on the base; a plurality of first external electrodes connected to the coil, the plurality of first external electrode being disposed on first and second external surfaces of the body; and a second external electrode connected to the first external electrode, the second external electrode being disposed on the third surface of the body, wherein no external electrode is disposed on the fourth external surface of the body. ### Claim 2 (depends on 1) The power inductor of claim 1, wherein the second external electrode is mounted on a printed circuit board (PCB) and spaced apart from a central portion of the third surface of the body. ### Claim 3 A power inductor, comprising: a body comprising a stepped portion formed on an area of a top surface thereof a base disposed in the body; a coil disposed on the base; and external electrodes connected to the coil, the external electrodes being disposed from first and second surfaces, which are opposite to each other, to upper and lower portions of the body, respectively wherein each of the external electrodes has a height less than the stepped portion on the upper portion of the body. ### Claim 4 A power inductor, comprising: a body; a base disposed in the body; a coil disposed on the base; an external electrode disposed on a surface of the body such that a portion of the body is present between the external electrode and the coil along a direction; and a connection electrode extending within the body along the direction from the coil to the external electrode, wherein, along the direction, the coil is arranged between the base and the connection electrode. ### Claim 5 (depends on 4) The power inductor of claim 4, wherein the external electrode is mounted on a PCB and spaced from a central portion of the body. ### Claim 6 (depends on 5) The power inductor of claim 5, wherein the external electrode is grown from the connection electrode. ### Claim 7 (depends on 1) The power inductor of claim 1, further comprising the body comprises metal powder, a polymer, and a thermal conductive filler. ### Claim 8 (depends on 7) The power inductor of claim 7, wherein the metal powder comprises metal alloy powder comprising iron and has a surface coated with at least one of a magnetic material and an insulating material. ### Claim 9 (depends on 8) The power inductor of claim 8, wherein the thermal conductive filler comprises at least one selected from the group consisting of MgO, AlN, and a carbon-based material and is contained in a content of approximately 0.5 wt % to approximately 3 wt %, based on approximately 100 wt % of the metal powder. ### Claim 10 (depends on 7) The power inductor of claim 7, wherein the base is formed by bonding a copper foil to both surfaces of a metal plate comprising iron. ### Claim 11 (depends on 7) The power inductor of claim 7, further comprising a magnetic layer disposed on at least one area of the body and having magnetic permeability greater than that of the body. ### Claim 12 (depends on 7) The power inductor of claim 7, wherein at least two bases are provided, the coils are respectively disposed on the at least two bases, and the coils are connected to each other by a side surface electrode disposed on a fifth surface of the body. ### Claim 13 A method for manufacturing a power inductor, the method comprising: forming a coil on at least one base; forming a plurality of sheets comprising metal powder and a polymer; stacking the plurality of sheets with the base therebetween to press the sheets, and then molding the sheets to form a body having first, second, third and fourth external surfaces, wherein the third external surface is between the first and second external surfaces, wherein the first external surface is opposite the second external surface and wherein the third external surface is opposite the fourth external surface; forming a plurality of second external electrodes on the third external surface of the body so as to be spaced apart from one another; and forming a plurality of first external electrodes each connected to the plurality of second external electrodes on the first and second external surfaces of the body, wherein no external electrode is disposed on the fourth external surface of the body. ### Claim 14 (depends on 13) The method of claim 13, wherein the plurality of second external electrodes are bonded to a copper foil, and then a plating process is performed to grow a plated layer from the copper foil. ### Claim 15 A method for manufacturing a power inductor, the method comprising: forming a coil on at least one base; forming a plurality of sheets comprising metal powder and a polymer, in which a hole is formed in a predetermined area thereof; stacking the plurality of sheets with the base therebetween, compressing the sheets, and then molding the sheets to form a passing hole exposing a predetermined area of the coil; filling the passing hole to form a connection electrode; and forming an external electrode on a surface of the body and connecting the external electrode to the connection electrode. ### Claim 16 (depends on 15) The method of claim 15, wherein the connection electrode is formed by performing an electroless plating process to fill at least a portion of the passing hole and then performing an electroplating process to fill the passing hole, wherein the external electrode grows from the connection electrode by the electroplating process. ### Claim 17 (depends on 15) The method of claim 15, wherein the base is formed by bonding the copper foil to at least one surface of the metal plate comprising iron. ### Claim 18 (depends on 17) The method of claim 17, wherein the sheet further comprises a thermal conductive filler. ### Claim 19 (depends on 13) The method of claim 13, wherein the base is formed by bonding the copper foil to at least one surface of the metal plate comprising iron.