# US 10,308,766 B2 · Solvent soluble polyimide copolymer

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- Number: US 10,308,766 B2
- Document ID: US10308766B2
- Status: Granted
- Kind: B2
- Application number: 14/897,511
- Filed: 2014-04-17
- Published: 2016-06-09
- Granted: 2019-06-04
- Earliest claimed: 2013-06-14
- Assignees: Somar Corporation
- Applicants: Somar Corporation
- Inventors: Yoshiyasu Takiue
- Web page: https://patentgrep.com/patent/US10308766B2

## CPC

- C08G 73/1067: {Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound}
- C08G 73/1042: {Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds}
- C08G 73/105: {with oxygen only in the diamino moiety}
- C08G 73/1064: {containing sulfur}
- C08G 73/1071: {Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain}
- C09D 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C09J 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)

## Abstract

Provided is a solvent-soluble polyimide copolymer which satisfies storage stability and heat resistance at high levels and has excellent utility. The polyimide copolymer is obtained by copolymerizing (A) 3,3′,4,4′-biphenyltetracarboxylic dianhydride with (B) diamine(s) and/or diisocyanate(s) and has no glass transition temperature observed at lower than 500° C. The component (B) is preferably at least one diamine and/or diisocyanate represented by the following Formulae (1) to (3): (wherein, X represents an amino group or an isocyanate group; R1 to R8 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkenyl group having 2 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms; and at least one of the R1 to R8 is not a hydrogen atom).

## Claims

### Claim 1

A solvent-soluble polyimide copolymer obtained by copolymerizing (A) 3,3′,4,4′-biphenyltetracarboxylic dianhydride, (B) diamine(s) and/or diisocyanate(s), (C) dianhydride(s) other than (A), and (D) diamine(s) and/or diisocyanate(s) other than (B),
said solvent-soluble polyimide copolymer having no glass transition temperature observed at lower than 500° C.,
wherein said component (B) is at least one diamine and/or diisocyanate represented by the following Formulae (1) to (2):
wherein, X represents an amino group or an isocyanate group; wherein two of said R1 to R4 are ethyl groups and the other two are a methyl group and a hydrogen atom,
wherein said component (C) is selected from the group consisting of 4,4′-oxydiphthalic dianhydride, 3,3′,4,4′-diphenylsulfonetertacarboxylic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, 2,2′-bis[(dicarboxyphenoxy)phenyl]propane dianhydride, ethylene glycol-bis-trimellitic anhydride ester, pyromellitic dianhydride and 3,3′,4,4′-biphenyltetracarboxylic dianhydride.