# US 10,308,546 B2 · Multilayer ceramic substrate and electronic component

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- Number: US 10,308,546 B2
- Document ID: US10308546B2
- Status: Granted
- Kind: B2
- Application number: 15/987,416
- Filed: 2018-05-23
- Published: 2018-09-27
- Granted: 2019-06-04
- Earliest claimed: 2015-11-30
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Seiji Fujita
- Web page: https://patentgrep.com/patent/US10308546B2

## CPC

- C03C 14/004: {the non-glass component being in the form of particles or flakes}
- B32B 18/00: Layered products essentially comprising ceramics, e.g. refractory products
- C03C 3/064: containing boron
- C03C 3/091: containing aluminium
- C03C 8/14: Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C04B 35/117: Composites
- C04B 35/78: containing non-metallic materials
- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H05K 3/46: Manufacturing multilayer circuits
- C04B 2235/3208: Calcium oxide or oxide-forming salts thereof, e.g. lime
- C04B 2235/3427: Silicates other than clay, e.g. water glass
- C04B 2235/365: Borosilicate glass
- C04B 2235/5436: micrometer sized, i.e. from 1 to 100 micron
- C04B 2235/5445: submicron sized, i.e. from 0,1 to 1 micron
- C04B 2235/9607: Thermal properties, e.g. thermal expansion coefficient
- C04B 2237/343: Alumina or aluminates
- C04B 2237/582: by joining layers or articles of the same composition but having different additives
- H05K 3/4605: {made from inorganic insulating material}
- H05K 2201/068: wherein the coefficient of thermal expansion is important
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A multilayer ceramic substrate that includes a laminated structure including a surface layer portion located on a surface of the laminated structure and an inner layer portion located on the inner side of the laminated structure, the surface layer portion including a first layer adjacent to the inner layer portion, the inner layer portion including a second layer adjacent to the first layer. The thermal expansion coefficient of the first layer is lower than the thermal expansion coefficient of the second layer, a first glass contained in the first layer and a second glass contained in the second layer each contain 40% or more by weight MO (where M represents at least one selected from the group consisting of Ca, Mg, Sr, and Ba), and the difference in softening points between the first glass and the second glass is 60° C. or lower.

## Claims

### Claim 1

A multilayer ceramic substrate comprising:
a laminated structure including a surface layer portion located on a surface of the laminated structure and an inner layer portion located on an inner side of the laminated structure, the surface layer portion including a first layer adjacent to the inner layer portion, the inner layer portion including a second layer adjacent to the first layer,
wherein a first thermal expansion coefficient of the first layer is lower than a second thermal expansion coefficient of the second layer,
the first layer contains a first glass and the second layer contains a second glass, each of the first glass and the second glass containing 40% or more by weight of MO, where M represents at least one selected from Ca, Mg, Sr, and Ba, and
a difference between a first softening point of the first glass and a second softening point of the second glass is 60° C. or lower.

### Claim 2 (depends on 1)

The multilayer ceramic substrate according to claim 1, wherein the first softening point of the first glass and the second softening point of the second glass are each 720° C. or higher.

### Claim 3 (depends on 2)

The multilayer ceramic substrate according to claim 2, wherein, when the first thermal expansion coefficient of the first layer is α1 [ppmK−1] and the second thermal expansion coefficient of the second layer is α2 [ppmK−1], 0.3≤α2−α1≤1.5.

### Claim 4 (depends on 3)

The multilayer ceramic substrate according to claim 3, wherein 0.5≤α2−α1≤1.4.

### Claim 5 (depends on 3)

The multilayer ceramic substrate according to claim 3, wherein 0.6≤α2−α1≤1.3.

### Claim 6 (depends on 3)

The multilayer ceramic substrate according to claim 3, wherein α1 is 5.0 ppmk−1 to 8.0 ppmK−1, and α2 is preferably 5.5 ppmk−1 to 8.5 ppmK−1.

### Claim 7 (depends on 1)

The multilayer ceramic substrate according to claim 1, wherein, when the first thermal expansion coefficient of the first layer is α1[ppmk−1] and the second thermal expansion coefficient of the second layer is α2 [ppmK−1], 0.3≤α2−α1≤1.5.

### Claim 8 (depends on 7)

The multilayer ceramic substrate according to claim 7, wherein 0.5≤α2−α1≤1.4.

### Claim 9 (depends on 7)

The multilayer ceramic substrate according to claim 7, wherein 0.6≤α2−α1≤1.3.

### Claim 10 (depends on 7)

The multilayer ceramic substrate according to claim 7, wherein α1is 5.0 ppmk−18.0 ppmk−1, and α2 is preferably 5.5 ppmk−1 to 8.5 ppmK−1.

### Claim 11 (depends on 1)

The multilayer ceramic substrate according to claim 1, wherein the difference between the first softening point of the first glass and the second softening point of the second glass is 30° C. or lower.

### Claim 12 (depends on 1)

The multilayer ceramic substrate according to claim 1, wherein the difference between the first softening point of the first glass and the second softening point of the second glass is 20° C. or lower.

### Claim 13 (depends on 1)

The multilayer ceramic substrate according to claim 1, wherein the difference between the first softening point of the first glass and the second softening point of the second glass is 0° C.

### Claim 14 (depends on 1)

The multilayer ceramic substrate according to claim 1, wherein the first glass and the second glass each further contain SiO2, B2O3, and Al2O3.

### Claim 15 (depends on 14)

The multilayer ceramic substrate according to claim 14, wherein each of the first glass and the second glass contains 40.0% to 55.0% by weight of MO, 0% to 10.0% by weight of Al2O3, 0% to 27.0% by weight of B2O3, and 25.0% to 70.0% by weight of SiO2.

### Claim 16 (depends on 15)

The multilayer ceramic substrate according to claim 15, wherein each of the first glass and the second glass contains 41.0% to 50.0% by weight of MO, 3.0% to 8.5% by weight of Al2O3, 3.0% to 20.0% by weight of B2O3, and 30.0% to 60.0% by weight of SiO2.

### Claim 17 (depends on 1)

An electronic component comprising the multilayer ceramic substrate according to claim 1.