# US 10,308,480 B2 · Embedded power module

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- Number: US 10,308,480 B2
- Document ID: US10308480B2
- Status: Granted
- Kind: B2
- Application number: 15/205,936
- Filed: 2016-07-08
- Published: 2018-01-11
- Granted: 2019-06-04
- Earliest claimed: 2016-07-08
- Assignees: Otis Elevator Company
- Applicants: Otis Elevator Company
- Inventors: Shashank Krishnamurthy
- Web page: https://patentgrep.com/patent/US10308480B2

## CPC

- B66B 11/0407: {actuated by an electrical linear motor (in the counterweight B66B17/12)}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 1/112: {directly combined with via connections}
- H05K 1/181: associated with surface mounted components
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/635: {Through-vias}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 90/00: Package configurations
- B66B 9/003: {for lateral transfer of car or frame, e.g. between vertical hoistways or to/from a parking position}
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10166: Transistor
- H10W 72/9413: {on encapsulations}
- H10W 90/10: Configurations of laterally-adjacent chips
- B66B: ELEVATORS; ESCALATORS OR MOVING WALKWAYS ({apparatus for raising or lowering persons on theatrical stages or the like A63J5/12} ; funicular railbound systems with rigid ground-supported tracks and cable traction, e.g. cliff railways, B61B9/00; arrangements of ammunition handlers in vessels B63G3/00; hoists, lifts, or conveyors for loading or unloading in general B65G; braking or detent devices controlling normal movements of winding drums or barrels B66D; ship-lifting devices E02C; garages for many vehicles with mechanical means for lifting vehicles E04H6/12; hoists for feeding ammunition or projectiles to launching apparatus or to loading mechanisms F41A9/00)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An embedded power module includes a substrate, first and second semiconducting dies, first and second gates, and first and second vias. The first semiconducting die is embedded in the substrate and spaced between opposite first and second surfaces of the substrate. The second semiconducting die is embedded in the substrate, is spaced between the first and second surfaces, and is spaced from the first semiconducting die. The first gate is located on the first surface. The second gate is located on the second surface. The first via is electrically engaged to the first gate and the second semiconducting die, and the second via is electrically engaged to the second gate and the first semiconducting die.

## Claims

### Claim 1

An embedded power module comprising:
a substrate including opposite first and second surfaces;
a first semiconducting die embedded in the substrate and spaced between the first and second surfaces;
a second semiconducting die embedded in the substrate, spaced between the first and second surfaces, and spaced from the first semiconducting die;
a first gate located on the first surface;
a second gate located on the second surface;
a first via electrically engaged to the first gate and the second semiconducting die;
a second via electrically engaged to the second gate and the first semiconducting die;
a first conductor pad located on the second surface and spaced from the second gate;
at least one third via electrically engaged to the first semiconducting die and the first conductor pad;
at least one fourth via electrically engaged to the second semiconducting die and the first conductor pad;
a second conductor pad located on the first surface;
a third conductor pad located on the first surface and spaced from the first conductor pad;
at least one fifth via electrically engaged to the first semiconducting die and the second conductor pad; and
at least one sixth via electrically engaged to the second semiconducting die and the third conductor pad, wherein the first conductor pad is a phase conductor pad, the second conductor pad is a DC plus pad, and the third conductor pad is a DC minus pad.

### Claim 2 (depends on 1)

The embedded power module set forth in claim 1 further comprising:
a capacitor electrically connected between the second and third conductor pads.

### Claim 3 (depends on 1)

The embedded power module set forth in claim 1, wherein the at least one third via is two vias, the at least one fourth via is three vias, the at least one fifth via is three vias, and the at least one sixth via is two vias.