# US 10,308,001 B2 · Method for manufacturing an electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,308,001 B2 - Document ID: US10308001B2 - Status: Granted - Kind: B2 - Application number: 15/192,274 - Filed: 2016-06-24 - Published: 2016-12-29 - Granted: 2019-06-04 - Earliest claimed: 2015-06-26 - Assignees: Commissariat A L'energie Atomique Et Aux Energies Alternatives - Applicants: Commissariat A L'Energie Atomique et aux Energies Alternatives - Inventors: Messaoud Bedjaoui; Pierre Garrec; Sylvain Nizou - Web page: https://patentgrep.com/patent/US10308001B2 ## CPC - B32B 37/12: characterised by using adhesives - G02F 1/1333: Constructional arrangements; {Manufacturing methods}(G02F1/135, G02F1/136 take precedence) - G02F 1/153: Constructional details - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/38: Multiple capacitors, i.e. structural combinations of fixed capacitors - H01G 11/10: Multiple hybrid or EDL capacitors, e.g. arrays or modules (housings, cases, encapsulations or mountings thereof H01G11/78) - H01G 11/78: Cases; Housings; Encapsulations; Mountings - H01G 11/84: Processes for the manufacture of hybrid or EDL capacitors, or components thereof - H01M 6/02: Details (of electrodes H01M4/00; of non-active parts H01M50/00) - H01M 6/40: Printed batteries {, e.g. thin film batteries} - H01M 10/052: Li-accumulators - H01M 10/0585: of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators - H01M 50/11: having a chip structure, e.g. micro-sized batteries integrated on chips - H10K 71/80: using temporary substrates - B32B 2457/10: Batteries - H10P 72/74: {using temporarily an auxiliary support} - H10P 72/7426: {used as a support during build up manufacturing of active devices} - Y02E 60/10: Energy storage using batteries - Y02E 60/13: Energy storage using capacitors - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A method for manufacturing an electronic device including a substrate, including assembling the substrate, by a joining zone of a first face of the substrate, with a joining zone of a first face of a carrier, and disjoining the substrate relatively to the carrier. After the step of assembling, the method includes formation of a film on the substrate, the film being configured to adhere to an adhesion zone of a second face of the substrate opposite the first face of the substrate, the adhesive force between the film and the adhesion zone of the second face of the substrate being chosen greater than the joining force between the joining zone of the carrier and the joining zone of the first face of the substrate. A traction on the film has a force of traction configured to overcome the joining force without overcoming the adhesive force. ## Claims ### Claim 1 A method for manufacturing an electronic device comprising a substrate, the method comprising: assembling the substrate, by a joining zone of a first face of the substrate, with a joining zone of a first face of a carrier; disjoining the substrate relatively to the carrier; forming at least one electronic component from a second face of the substrate opposite the first face of the substrate at least partially after the step of assembling; forming a film on the substrate, said film being configured to adhere to an adhesion zone of the second face of the substrate, an adhesive force between the film and the adhesion zone of the second face of the substrate being chosen greater than a joining force between the joining zone of the carrier and the joining zone of the first face of the substrate, with the step of forming of at least one component being carried out before the forming of the film, with the forming of the film being carried out after the assembling and being configured to cover the at least one electronic component; after the forming of the film, operating a traction on the film with a force of traction configured to overcome the joining force, without overcoming the adhesive force. ### Claim 2 (depends on 1) The method according to claim 1, wherein the traction is carried out at least partially by traction exerted on an edge of the film. ### Claim 3 (depends on 1) The method according to claim 1, wherein the forming of the film is configured to create a portion of film overhanging the second face of the substrate, and the traction is carried out at least partially by traction on the portion of the overhanging film. ### Claim 4 (depends on 1) The method according to claim 1, wherein, on the first face of the carrier, a peripheral zone is formed adjacent to the joining zone, and wherein the forming of the film is configured so that the film adheres on the adhesion zone of the second face of the substrate and covers at least one portion of the peripheral zone, the peripheral zone being formed in such a way as to girdle the joining zone of the first face of the carrier. ### Claim 5 (depends on 4) The method according to claim 4, wherein the peripheral zone has a surface energy less than that of the adhesion zone. ### Claim 6 (depends on 5) The method according to claim 5, wherein a surface treatment is carried out on at least one portion of the peripheral zone in such a way that the at least one portion of the peripheral zone has a surface energy less than that of the adhesion zone. ### Claim 7 (depends on 4) The method according to claim 4, comprising forming at least one step between the joining zone of the first face of the carrier and the peripheral zone in such a way as to position the peripheral zone set back from the joining zone of the first face of the carrier, wherein the forming of the film is configured to arrange at least one space not filled with the material of the film above the at least one step. ### Claim 8 (depends on 7) The method according to claim 7, wherein a height dimension of the at least one step, according to a thickness of the carrier, is chosen greater than or equal to a thickness of the film. ### Claim 9 (depends on 7) The method according to claim 7, wherein the substrate is overhanging the at least one step according to a plane of the first face of the substrate. ### Claim 10 (depends on 4) The method according to claim 4, wherein the carrier comprises a shim bearing, by a first face, on a first face of an underlying portion of the carrier, at least one portion of the peripheral zone being formed by a second face of the shim, opposite the first face of the shim, and wherein the shim has a thickness equal to that of the substrate. ### Claim 11 (depends on 1) The method according to claim 1, wherein the traction force has at least one non-zero component according to a thickness dimension of the substrate. ### Claim 12 (depends on 1) The method according to claim 1, wherein the traction is carried out at several points of the film. ### Claim 13 (depends on 12) The method according to claim 12, wherein the traction is carried out by a rolling element, wherein at least one edge portion of the film is fixed to a peripheral surface of the rolling element, and wherein a rotation of the rolling element is then carried out configured to wind the film on the peripheral surface of the rolling element. ### Claim 14 (depends on 1) The method according to claim 1, wherein the film is formed by laminating. ### Claim 15 (depends on 1) The method according to claim 1, wherein the film is configured to encapsulate the second face of the substrate. ### Claim 16 (depends on 1) The method according to claim 1, wherein the film comprises at least one first layer of film configured to adhere at least on the adhesion zone of the second face of the substrate, and at least one second layer of film above said first layer of film, with the at least one second layer of film comprising at least one layer sealed from the outside atmosphere. ### Claim 17 (depends on 1) The method according to claim 1, wherein, in the substrate, at least one breakable zone is formed, more fragile than a rest of the substrate, with the traction being configured to break the breakable zone. ### Claim 18 (depends on 17) The method according to claim 17, wherein a plurality of electronic components is formed, with the components being separated by breakable zones. ### Claim 19 (depends on 1) The method according to claim 1, wherein at least one electronic component is a capacitive stack or a battery or an electrochromic component.