# US 10,307,849 B2 · Vacuum-processing device and control method therefor, and vacuum soldering device and control method therefor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,307,849 B2 - Document ID: US10307849B2 - Status: Granted - Kind: B2 - Application number: 15/507,906 - Filed: 2015-08-28 - Published: 2017-10-05 - Granted: 2019-06-04 - Earliest claimed: 2014-09-02 - Assignees: Senju Metal Industry Co., Ltd. - Applicants: Senju Metal Industry Co., Ltd. - Inventors: Tomotake Kagaya - Web page: https://patentgrep.com/patent/US10307849B2 ## CPC - B23K 1/008: Soldering within a furnace (B23K1/012 takes precedence) - F04B 37/14: to obtain high vacuum - F04B 49/065: {and making use of computers} - F04C 18/0207: {both members having co-operating elements in spiral form} - F04C 25/02: for producing high vacuum (sealing arrangements F04C27/00; silencing F04C29/06) - F04C 28/08: characterised by varying the rotational speed - F04D 19/04: specially adapted to the production of a high vacuum, e.g. molecular pumps - F04D 27/0261: {by varying driving speed} - H05K 3/34: by soldering - B23K 2101/42: Printed circuits - F04B 2205/09: Flow through the pump - F04C 18/12: of other than internal-axis type - F04C 2240/403: with inverter for speed control - F04D 17/168: {Pumps specially adapted to produce a vacuum} - H05K 2203/085: Using vacuum or low pressure - H05K 2203/163: Monitoring a manufacturing process - H10W 72/07125: {Means for controlling the bonding environment, e.g. valves or vacuum pumps} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07183: {Means for monitoring} - Y02B 30/70: Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - F04B: POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS (machines for liquids, or pumps, of rotary-piston or oscillating-piston type F04C; non-positive-displacement pumps F04D; pumping of fluid by direct contact of another fluid or by using inertia of fluid to be pumped F04F) - F04C: ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS (engines F03C); ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS - F04D: NON-POSITIVE-DISPLACEMENT PUMPS (engine fuel-injection pumps F02M; ion pumps H01J41/12; electrodynamic pumps H02K44/02) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS ## Abstract The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value. ## Claims ### Claim 1 A vacuum-processing device comprising: a chamber to be evacuated; an operating part that sets a condition for evacuating the chamber; a pump that evacuates the chamber based on the evacuation condition, the pump having a plurality of pump outputs; and a control portion comprising program instructions that, when executed by at least one processor, cause the at least one processor to: perform an evacuation control of the pump so as to switch a pump output to a higher pump output based on a fact that an amount of decrease in degree of vacuum per unit time, at a time of evacuation of the chamber using a predetermined pump output, has become smaller than a reference value, and set, as the reference value the amount of decrease in degree of vacuum per unit time when a predetermined time elapses from the evacuation of the chamber using a predetermined pump output. ### Claim 2 (depends on 1) The vacuum-processing device according to claim 1, wherein the program instructions further cause the at least one processor to: continuously compare the amount of decrease in degree of vacuum per unit time for the selected pump output with the reference value during evacuation, and switch the pump output to the higher pump output when the amount of decrease in degree of vacuum per unit time has become smaller than the reference value. ### Claim 3 (depends on 1) A vacuum soldering device comprising the vacuum-processing device according to claim 1. ### Claim 4 (depends on 2) A vacuum soldering device comprising the vacuum-processing device according to claim 2.