# US 10,307,825 B2 · Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder

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- Number: US 10,307,825 B2
- Document ID: US10307825B2
- Status: Granted
- Kind: B2
- Application number: 15/546,093
- Filed: 2016-01-26
- Published: 2018-01-18
- Granted: 2019-06-04
- Earliest claimed: 2015-01-30
- Assignees: Sumitomo Electric Industries, Ltd.; Sumitomo Electric Printed Circuits, Inc.
- Applicants: Sumitomo Electric Industries, Ltd.; Sumitomo Electric Printed Circuits, Inc.
- Inventors: Issei Okada; Yoshio Oka; Takashi Kasuga; Yasuhiro Okuda; Jinjoo Park; Kousuke Miura; Hiroshi Ueda
- Web page: https://patentgrep.com/patent/US10307825B2

## CPC

- C09D 11/52: Electrically conductive inks
- B05D 3/0254: {After-treatment}
- B22F 1/00: Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F 1/054: Nanosized particles
- B22F 7/04: with one or more layers not made from powder, e.g. made from solid metal
- B22F 9/24: starting from liquid metal compounds, e.g. solutions
- C09D 11/037: characterised by the pigment
- C22C 1/0425: {Copper-based alloys}
- H01B 1/00: Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B 1/026: {Alloys based on copper}
- H01B 1/22: the conductive material comprising metals or alloys
- H01B 5/00: Non-insulated conductors or conductive bodies characterised by their form
- H01B 5/14: comprising conductive layers or films on insulating-supports
- H01B 13/00: Apparatus or processes specially adapted for manufacturing conductors or cables
- H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks}
- H05K 1/097: {Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence)}
- B22F 2301/10: Copper
- B22F 2304/05: Submicron size particles
- C22C 9/00: Alloys based on copper
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4.

## Claims

### Claim 1

A metal powder having a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis,
a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4, and
the metal powder comprising copper or a copper alloy as a main component.

### Claim 2 (depends on 1)

The metal powder according to claim 1, comprising a metal different from the main component.

### Claim 3 (depends on 1)

The metal powder according to claim 1, wherein the metal powder is formed by a liquid-phase reduction method of reducing a metal ion with a reducing agent in an aqueous solution.

### Claim 4 (depends on 3)

The metal powder according to claim 3, wherein the reducing agent used in the liquid-phase reduction method is a trivalent titanium ion.

### Claim 5 (depends on 2)

The metal powder according to claim 2, wherein the metal different from the main component is at least one metal selected from the group consisting of titanium, silver, nickel, and zinc.

### Claim 6 (depends on 5)

The metal powder according to claim 5, wherein a content of the metal different from the main component relative to the main metal in the metal powder is in a range of 0.02% by mass to 5% by mass.