Systems and methods to dispense and mix reagents
AssigneeCentrillion Technology Holdings Corporation
InventorsFilip Crnogorac, Glenn McGall, Bolan Li
Life of this patent
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Abstract
The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 μm to 2 mm.
Claims7
A method for processing wafers, comprising:
- (a) providing a first wafer;
- (b) moving the first wafer from a first position to a second position by a wafer conveyance robot;
- (c) placing the first wafer on top of a vacuum chuck at the second position, the vacuum chuck rotatably holding the first wafer;
- (d) dispensing at least one reagent into a reaction chamber between a bottom face of a lid dispenser at the second position and a top surface of the first wafer by a nozzle in the lid dispenser when the wafer is stationary;
- and
- (e) spreading the at least one reagent by capillary action over the top surface of the first wafer such that the reaction chamber is filled with the at least one reagent to form a thin-film, wherein the lid dispenser is not rotated;
- wherein the nozzle is placed above the first wafer and projected at the center of the wafer, and wherein the vacuum chuck is configured to rotate the first wafer to mix the at least one reagent with an additional reagent over the top surface of the first wafer.
Dependencies are inferred from the claim text.