Laser ablative dielectric material
AssigneeBrewer Science Inc.
InventorsChristina R. Matos-Perez, Tony D. Flaim, Arthur O. Southard, Lisa M. Kirchner, Deborah Blumenshine
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Abstract
Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.
Claims18
In a method of patterning a dielectric layer supported on a microelectronic substrate, where the method comprises ablating the dielectric layer by exposing the dielectric layer to laser energy so as to facilitate ablation of at least a portion of the dielectric layer, the improvement being that said dielectric layer is formed from a composition comprising a polymer selected from the group consisting of polyureas, polyurethanes, and polyacylhydrazones.
A method of forming a polyacylhydrazone, said method comprising reacting a dihydrazide with a 2-hydroxyalkyl-linked dialdehyde to form said polyacylhydrazone, wherein the alkyl of the 2-hydroxyalkyl-linked dialdehyde has an odd number of carbon atoms.
Dependencies are inferred from the claim text.