Method of forming a power module with a magnetic device having a conductive clip

A magnetic device, comprising:

• a magnetic core, including:
• a first surface continuously spanning an end-to-end boundary of said magnetic core and facing a first conductive substrate;
• and
• an opposing second surface continuously spanning said end-to-end boundary of said magnetic core;
• a first u-shaped conductive clip facing said second surface and continuously spanning end-to-end boundary of said magnetic core to form a first portion of a winding of said magnetic device;
• a second u-shaped conductive clip facing said second surface and continuously spanning said end-to-end boundary of said magnetic core to form a second portion of said winding of said magnetic device, wherein said first u-shaped conductive clip is coupled by a first solder area to said first conductive substrate, and said second u-shaped conductive clip is coupled by a second solder area to a second conductive substrate separate from said first conductive substrate, and wherein a first location on said first conductive substrate where said first u-shaped conductive clip is coupled to said first conductive substrate by the first solder area and a second location on said second u-shaped conductive substrate where said second u-shaped conductive clip is coupled to said second conductive substrate are separated by a gap, wherein the gap comprises an air gap between the first solder area and the second solder area;
• and
• a plurality of wire bonds coupled between said first conductive substrate and a semiconductor die.

A magnetic device, comprising:

• a magnetic core, including:
• a first surface continuously spanning an end-to-end boundary of said magnetic core and facing a first conductive substrate;
• and
• an opposing second surface continuously spanning said end-to-end boundary of said magnetic core;
• a first conductive clip facing said second surface and continuously spanning said end-to-end boundary of said magnetic core to form a first portion of a winding of said magnetic device;
• a second conductive clip facing said second surface and continuously spanning said end-to-end boundary of said magnetic core to form a second portion of said winding of said magnetic device, wherein said first conductive clip is coupled by a first solder area to said first conductive substrate, and said second conductive clip is coupled by a second solder area to a second conductive substrate separate from said first conductive substrate, and wherein a first location on said first conductive substrate where said first conductive clip is coupled to said first conductive substrate and a second location on said first conductive substrate where said second conductive clip is coupled to said second conductive substrate are separated by a gap, wherein the gap comprises an air gap between the first solder area and the second solder area;
• a plurality of wire bonds coupled between said first conductive substrate and a semiconductor die;
• and
• at least one wire bond coupled between said first conductive substrate and second conductive substrate.