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US 10,300,701 B2Granted
Printed circuit board fluid ejection apparatus
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie
Life of this patent
Estimating the term…
Abstract
In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow to the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.
Claims15
A method of manufacturing a fluid ejection apparatus, comprising:
- mounting a printhead die within an opening formed in a first printed circuit board layer having a first side, the printhead die comprising at least one port extending into the printhead die;
- coupling a second printed circuit board layer to the first side of the first printed circuit board layer;
- plunge-cutting a fluid feed slot through the second printed circuit board layer and into a surface of the printhead die exposing the at least one port.
A method of forming a micro device, comprising:
- applying a barrier layer to a first side of a first printed circuit board and over an opening formed into the first printed circuit board, the first circuit board comprising a conductor layer;
- mounting a printhead die in opening, the printhead die comprising a conductor;
- coupling the conductor layer of the first printed circuit board to the conductor of the printhead die;
- applying an adhesive around the printhead die to adhere the printhead die to the first printed circuit board;
- coupling a second printed circuit board layer to the first printed circuit board opposite the barrier layer;
- removing the barrier layer;
- plunge-cutting a fluid feed slot through the second printed circuit board layer and into a surface of the printhead die.
4 more elements
A method, comprising:
- forming an opening within a first printed circuit board set;
- mounting a printhead die within the opening of the first printed circuit board set, the printhead die comprising at least one port extending partially into the printhead die;
- coupling a first side of the second printed circuit board set to a first side of the first printed circuit board layer;
- plunge-cutting a fluid feed slot through the second printed circuit board set and into a surface of the printhead die exposing the at least one port.
1 more element
Dependencies are inferred from the claim text.