Encapsulation method and encapsulation device
AssigneesBoe Technology Group Co., Ltd., Ordos Yuansheng Optoelectroncis Co., Ltd.
InventorsFuyi Cui, Xu Chen, Quanqin Sun, Zhiqiang Gao, Jingjing Chen
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Abstract
An encapsulation method and an encapsulation device are provided. The encapsulation method comprises: forming a binding agent in an encapsulation region of a display substrate; forming an organic thin film on the binding agent; exerting a pressure on the organic thin film and the binding agent by using a pressure exerting device, wherein the organic thin film is not bound to the pressure exerting device; removing the organic thin film; and providing a cover plate on the binding agent and binding the cover plate with the display substrate by the binding agent.
Claims8
An encapsulation method, comprising:
- forming a binding agent in an encapsulation region of a display substrate;
- forming an organic thin film on the binding agent;
- exerting a pressure on the organic thin film and the binding agent by using a pressure exerting device, wherein the organic thin film is not bound to the pressure exerting device;
- removing the organic thin film;
- and
- providing a cover plate on the binding agent and binding the cover plate with the display substrate by the binding agent;
- wherein the removing the organic thin film comprises:
- heating the organic thin film so as to gasify the organic thin film.
Dependencies are inferred from the claim text.