Crack resistant plastic enclosure structures

A method for forming a plastic housing structure for an electronic device, comprising:

• molding the plastic housing structure including an exterior surface and an opposing interior surface, wherein the exterior surface defines an exterior surface of the electronic device;
• drilling an opening in the molded plastic housing structure, wherein:
• the opening in the molded plastic housing structure has a depth and is defined by a wall surface that extends substantially from an interior edge at the interior surface to an exterior edge at the exterior surface;
• the opening is configured to receive at least one of:
• a button, a status indicator, a sensor, or a plug;
• and
• a dwell time of a cutting tool on the wall surface is selected to apply sufficient heat to the wall surface to activate the wall surface for forming a metal liner structure;
• forming the metal liner structure on the wall surface from the exterior edge to the interior edge using electrochemical deposition directly on the plastic of the wall surface, the metal liner structure having a height substantially equal to the depth of the opening, and wherein a first end of the metal line structure is positioned in line with the exterior edge and a second end of the metal liner structure opposite the first end is positioned with the interior edge;
• and
• mounting a display with pixels in the plastic housing structure of the electronic device.