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US 10,300,649 B2Granted
Enhancing die flatness
AssigneeRaytheon Company
InventorsAndrew Cahill, Sean F. Harris, Daniel D. Lofgreen
Life of this patent
Estimating the term…
Abstract
Methods and apparatus for enhancing the flatness of a die by applying adhesive to a shim having a selected flatness, rotating the shim to spread the adhesive to a layer having a uniform thickness, evacuating a chamber to create a vacuum; manipulating a die onto the adhesive layer in the chamber; and reducing a level of the vacuum to pressure the die onto the adhesive layer such that the bow in the die is reduced as the die conforms to the shim.
Claims17
A method, comprising:
- applying adhesive to a shim having a selected flatness;
- rotating the shim to spread the adhesive to a layer having a uniform thickness;
- evacuating a chamber to create a vacuum;
- manipulating a die onto the adhesive layer in the chamber;
- and
- reducing a level of the vacuum to pressure the die onto the adhesive layer such that the bow in the die is reduced as the die conforms to the shim.
3 more elements
A method of fabricating a sensor IC package, comprising:
- applying, in an oven vacuum chamber, adhesive to a shim having a selected flatness;
- rotating the shim to spread the adhesive to a layer having a uniform thickness;
- evacuating the vacuum chamber to create a vacuum;
- manipulating a die onto the adhesive layer in the vacuum chamber;
- and
- reducing a level of the vacuum in the vacuum chamber to pressure the die onto the adhesive layer such that the bow in the die is reduced as the die conforms to the shim.
3 more elements
Dependencies are inferred from the claim text.