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US 10,300,577 B2Granted
Polishing head, CMP apparatus including a polishing head, and manufacturing method of semiconductor integrated circuit device using a CMP apparatus
AssigneeAblic Inc.
InventorSukehiro Yamamoto
Life of this patent
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Abstract
In a polishing head for a CMP apparatus, a stress distributing plate made of metal or ceramic is placed between a wafer on a polishing pad and an air bag configured to press down the wafer, and a shock absorbing sheet is provided between the stress distributing plate and the underlying wafer, to thereby make pressure applied from the air bag to the wafer uniform.
Claims14
A polishing head for a CMP apparatus, comprising:
- a polishing pad;
- an air bag mounted on a surface of the polishing pad, and configured to press a front surface of a wafer against the polishing pad from a direction of a back surface of the wafer;
- a retainer ring surrounding a side surface of the air bag;
- atop ring enveloping the air bag, the wafer, and the retainer ring;
- and
- a stress distributing plate and a shock absorbing sheet both provided between the air bag and the wafer.
3 more elements
Dependencies are inferred from the claim text.