Hybrid substrate processing

A method of forming a hole in a substrate comprising material transparent to a laser, the method comprising:

• forming a modulated area according to a first predetermined pattern in the substrate by exposing the substrate to a pulsed laser beam according to the first predetermined pattern, wherein the first predetermined pattern defines a perimeter of the hole and surrounds a first portion of the substrate, and wherein a wavelength, power and pulse duration of the laser beam are selected to modify properties of the substrate in the modulated area without ablating the substrate;
• depositing a mask over the substrate including the modulated area, the first portion of the substrate and a second portion of the substrate that surrounds the modulated area;
• patterning the mask according to a second predetermined pattern that corresponds with the first predetermined pattern to form a patterned mask area;
• etching through the mask and the substrate in the patterned mask area;
• stripping the mask from the substrate;
• and
• separating the first portion of the substrate from the second portion of the substrate.