Laser welding of high thermal expansion glasses and glass-ceramics
AssigneeCorning Incorporated
InventorsMatthew John Dejneka, Alexander Mikhailovich Streltsov
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Abstract
Disclosed herein are methods for welding a first substrate and a second substrate, the method comprising bringing the first and second substrates into contact to form a substrate interface, and directing a laser beam operating at a predetermined wavelength through the second substrate onto the substrate interface, wherein the first substrate absorbs light from the laser beam in an amount sufficient to form a weld between the first substrate and the second substrate. The disclosure also relates to glass and/or glass-ceramic packaging and OLED display produced according to the methods disclosed herein.
Claims26
A method for welding a first and second substrate comprising:
- (a) bringing the first and second substrates into contact to form a substrate interface;
- (b) after forming the substrate interface, directing a laser beam operating at a predetermined wavelength through the second substrate onto the substrate interface;
- wherein the first substrate absorbs light from the laser beam in an amount sufficient to form a weld between the first substrate and the second substrate;
- wherein the first substrate has an absorption at the predetermined wavelength of greater than about 10 cm−1 and the second substrate has an absorption at the predetermined wavelength of less than about 1 cm−1 ;
- wherein at least one of the first and second substrates has a coefficient of thermal expansion greater than about 8 ppm/° C.;
- and
- wherein the laser beam converges to a focal point that is remote from the substrate interface.
A method for producing a glass and/or a glass-ceramic packaging, comprising:
- (a) placing a third substrate on a first or a second substrate;
- (b) bringing the first and second substrates into contact to form a substrate interface;
- (c) after forming the substrate interface, directing a laser beam operating at a predetermined wavelength through the second substrate onto the substrate interface;
- wherein the first substrate absorbs light from the laser beam in an amount sufficient to form a weld between the first substrate and the second substrate;
- wherein the first substrate has an absorption at the predetermined wavelength of greater than about 10 cm−1 and the second substrate has an absorption at the predetermined wavelength of less than about 1 cm−1,
- wherein at least one of the first and second substrates has a coefficient of thermal expansion greater than about 8 ppm/° C.,
- wherein the first and/or second substrates are chosen from glasses, ceramics, and glass-ceramics,
- wherein the weld between the first and second substrates hermetically seals the third substrate, and
- wherein the laser beam converges to a focal point that is remote from the substrate interface, the focal point being disposed below the substrate interface and within a volume of the first substrate.
A method for welding a first and second substrate comprising:
- (a) bringing the first and second substrates into contact to form a substrate interface;
- (b) after forming the substrate interface, directing a laser beam operating at a predetermined wavelength through the second substrate onto the substrate interface;
- wherein the first substrate absorbs light from the laser beam in an amount sufficient to form a weld between the first substrate and the second substrate;
- wherein the first substrate has an absorption at the predetermined wavelength of greater than about 10 cm−1 and the second substrate has an absorption at the predetermined wavelength of less than about 1 cm−1;
- wherein a coefficient of thermal expansion of the first substrate is greater than a coefficient of thermal expansion of the second substrate;
- and
- wherein the laser beam converges to a focal point that is remote from the substrate interface.
Dependencies are inferred from the claim text.